IP Library Granted Patent US 7,299,861
Granted Patent B2
US 7,299,861 · App. 11/331,208 · Granted Nov 27, 2007

Water-cooling heat exchanger and heat-dissipating device for the same

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Quick Facts
Patent No.
US 7,299,861
App. No.
11/331,208
Granted
Nov 27, 2007
Kind
B2
Abstract

A water-cooling heat exchanger and a heat-dissipating device are mounted on a heat-generating element of a computer for rapidly guiding and dissipating the heat generated by the heat-generating element. A water-cooling head, a pump and a heat-dissipating fan are stacked up, and an annular heat exchanger is used to surround the above components, thereby to reduce the space of the whole construction to a lowest extent. With the heat-dissipating fan provided in the center of the annular heat exchanger, the airflow generated by the heat-dissipating fan can blow the heat exchanger in multiple directions, thereby to obtain the optimal effect of heat dissipation.

Claims (7)

1. A water-cooling heat-dissipating device, comprising:

a heat exchanger comprising a pump, a plurality of primary water paths and a plurality of auxiliary water paths, wherein the pump has an outlet pipe and an inlet pipe, the primary water paths are formed with an inlet and an outlet, the inlet is connected to the outlet pipe of the pump, the outlet is connected to the inlet pipe of the pump, the plurality of auxiliary water paths are formed between each primary water path, each auxiliary water path is separately arranged with an interval thereabout, and a plurality of heat-dissipating fins are formed in the interval; and

a heat-absorbing element provided underneath the pump of the heat exchanger, wherein a water path is formed between the heat-absorbing element and the pump for a fluid passing through, the water path is in communication with the outlet pipe and the inlet pipe, thereby to form a circulating route for the fluid passing through.

2. The water-cooling heat-dissipating device according to claim 1 , wherein the heat-absorbing element is circumferentially surrounded by each primary water path and auxiliary water path.

3. The water-cooling heat-dissipating device according to claim 2 , wherein the heat-absorbing element is a water-cooling head.

4. The water-cooling heat-dissipating device according to claim 1 , further comprising a heat-dissipating fan arranged above the pump of the heat exchanger and surrounded by each primary water path and auxiliary water path.

5. The water-cooling heat-dissipating device according to claim 4 , wherein the pump and the heat-dissipating fan are adapted to be activated by a common rotating shaft.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 20, 2012
From: COOLER MASTER CO., LTD.
To: CHEMTRON RESEARCH LLC
Reel/Frame 027567/0332 →
CORRECTIVE ASSIGNMENT TO CORRECT THE CONVEYANCE EXECUTIVE DATE PREVIOUSLY RECORDED ON REEL 017476 FRAME 0321. ASSIGNOR(S) HEREBY CONFIRMS THE DATE 12/09/2004 IS INCORRECT AND SHOULD BE 12/09/2005. Recorded Nov 17, 2011
From: LO, LIEH-FENG
To: COOLER MASTER CO., LTD.
Reel/Frame 027248/0855 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 13, 2006
From: LO, LIEH-FENG
To: COOLER MASTER CO., LTD.
Reel/Frame 017476/0321 →