Semiconductor device, display module, and manufacturing method of semiconductor device
View Patent ↗A semiconductor device is provided that includes wiring patterns on a substrate formed of an organic insulating film, and a semiconductor chip mounted on the substrate. A liquid crystal display panel and a PW board are electrically connected to each other with an anisotropic conductive adhesive. At least one surface of the insulating film is treated with a silicon coupling material. The silicon coupling material contains silicon (Si) at a surface element density of 0.5 atomic percent to 12.0 atomic percent on a surface of the insulating film.
1. A semiconductor device in which wiring patterns are formed on a substrate that is formed of an organic insulating film, and in which at least one semiconductor chip is mounted on, the semiconductor device comprising:
at least one surface of the insulating film is applied with a silicon coupling material, and the silicon coupling material having a SiX structure selected from the group consisting of SiOn, Si(OH)n and SiOn(OH)n, and the silicon coupling material contains silicon (Si) at a surface element density of 0.5 atomic percent to 12.0 atomic percent on the applied surface of the insulating film, wherein n is a variable.
2. The semiconductor device as set forth in claim 1 , wherein the insulating film comprises polyimide.
3. The semiconductor device as set forth in claim 1 , wherein the at least one semiconductor chip mounted on the substrate has a distinct function.
4. The semiconductor device as set forth in claim 2 , wherein the at least one semiconductor chip mounted on the substrate has a distinct function.
5. The semiconductor device as set forth in claim 3 , wherein more than one semiconductor chip is mounted on the substrate.
6. The semiconductor device as set forth in claim 4 , wherein more than one semiconductor chip is mounted on the substrate.
7. The semiconductor device as set forth in claim 1 , wherein the at least one semiconductor chip has a bump electrode made of gold (Au), and wherein the wiring patterns formed on the substrate are made of tin (Sn) or plated with tin (Sn).
8. The semiconductor device as set forth in claim 2 , wherein the wiring patterns formed on the substrate are made of tin (Sn) or plated with tin (Sn).
9. The semiconductor device as set forth in claim 1 , wherein the at least one semiconductor chip has a bump electrode made of gold (Au), and wherein the wiring patterns formed on the substrate are made of gold (Au) or plated with gold (Au).
10. The semiconductor device as set forth in claim 2 , wherein the at least one semiconductor chip has a bump electrode made of gold (Au), and wherein the wiring patterns formed on the substrate are made of gold (Au) or plated with gold (Au).
11. The semiconductor device as set forth in claim 1 , wherein an electrical component is mounted on the substrate in addition to the at least one semiconductor chip.
12. The semiconductor device as set forth in claim 2 , wherein an electrical component is mounted on the substrate in addition to the at least one semiconductor chip.
13. A display module using a semiconductor device in which wiring patterns are formed on a substrate that is formed of an organic insulating film, and in which at least one semiconductor chip is mounted on, the display module comprising:
at least one surface of the insulating film in the semiconductor device is applied with a silicon coupling material having a SiX structure selected from the group consisting of SiOn, Si(OH)n and SiOn(OH)n, and the silicon coupling material contains silicon (Si) at a surface element density of 0.5 atomic percent to 12.0 atomic percent on the applied surface of the insulating film, wherein n is a variable,
the semiconductor device being electrically connected to a display panel with an anisotropic conductive adhesive.
14. The display module as set forth in claim 13 , wherein the insulating film of the semiconductor device comprises polyimide.
15. The display module as set forth in claim 13 , wherein the at least one semiconductor chip mounted on the substrate of the semiconductor device has a distinct function.
16. The display module as set forth in claim 14 , wherein the at least one semiconductor chip mounted on the substrate of the semiconductor device has a distinct function.
17. The display module as set forth in claim 13 , wherein more than one semiconductor chip is mounted on the substrate of the semiconductor device.
18. The display module as set forth in claim 14 , wherein more than one semiconductor chip is mounted on the substrate of the semiconductor device.
19. The display module as set forth in claim 13 , wherein the at least one semiconductor chip of the semiconductor device has a bump electrode made of gold (Au), and wherein the wiring patterns formed on the substrate are made of tin (Sn) or plated with tin (Sn).
20. The display module as set forth in claim 14 , wherein the at least one semiconductor chip of the semiconductor device has a bump electrode made of gold (Au), and wherein the wiring patterns formed on the substrate are made of tin (Sn) or plated with tin (Sn).
21. The display module as set forth in claim 13 , wherein the at least one semiconductor chip of the semiconductor device has a bump electrode made of gold (Au), and wherein the wiring patterns formed on the substrate are made of gold (Au) or plated with gold (Au).
22. The display module as set forth in claim 14 , wherein the at least one semiconductor chip of the semiconductor device has a bump electrode made of gold (Au), and wherein the wiring patterns formed on the substrate are made of gold (Au) or plated with gold (Au).
23. The display module as set forth in claim 13 , wherein an electrical component is mounted on the substrate of the semiconductor device in addition to the at least one semiconductor chip.
24. The display module as set forth in claim 14 , wherein an electrical component is mounted on the substrate of the semiconductor device in addition to the at least one semiconductor chip.
25. The display module as set forth in claim 13 , wherein the display panel comprises a liquid crystal display panel.
26. The display module as set forth in claim 14 , wherein the display panel comprises a liquid crystal display panel.
27. The display module as set forth in claim 15 , wherein the display panel comprises a liquid crystal display panel.
28. The display module as set forth in claim 16 , wherein the display panel comprises a liquid crystal display panel.
29. The display module as set forth in claim 17 , wherein the display panel comprises a liquid crystal display panel.
30. The display module as set forth in claim 18 , wherein the display panel comprises a liquid crystal display panel.
31. The display module as set forth in claim 19 , wherein the display panel comprises a liquid crystal display panel.
32. The display module as set forth in claim 20 , wherein the display panel comprises a liquid crystal display panel.
33. The display module as set forth in claim 21 , wherein the display panel comprises a liquid crystal display panel.
34. The display module as set forth in claim 22 , wherein the display panel comprises a liquid crystal display panel.
35. The display module as set forth in claim 23 , wherein the display panel comprises a liquid crystal display panel.
36. The display module as set forth in claim 24 , wherein the display panel comprises a liquid crystal display panel.