Packaging substrate and manufacturing method thereof, integrated circuit device and manufacturing method thereof, and SAW device
View Patent ↗A basic portion layer 21 of a substrate electrode 12 a connected to a projecting electrode 13 electrically and mechanically on a substrate member of ceramics. The substrate member on which the basic portion layer 21 is formed is subjected to sintering. A surface of the basic portion layer 21 in the sintered substrate member is polished. On the polished basic portion layer 21 , the plating layers 22, 23 are formed, so that surface roughness of the substrate electrode 12 a may be, for example, not larger than 0.1 μmRMS. Accordingly, junction strength of an integrated circuit element mounted on a packaging substrate by a flip-chip method can be improved.
1. A method of manufacturing an integrated circuit device, said method comprising:
preparing an integrated circuit element which has an element substrate, a predetermined conductive pattern and a projecting electrode formed on said element substrate;
preparing a packaging substrate which has an external connecting terminal having a predetermined height and is electrically connected with a mounting substrate, and a supporting layer which has a thickness not smaller than said predetermined height of said external connecting terminal; said supporting layer being formed at least in an area corresponding to a position where said integrated circuit element is mounted;
bringing said supporting layer into contact with a stage upon setting said packaging substrate on said stage with an element mounting surface being directed to the outside; and
joining said integrated circuit element to said element mounting surface of said packaging substrate by applying ultrasonic wave vibration while pushing said integrated circuit element towards said supporting layer.
2. A method of manufacturing an integrated circuit device as claimed in claim 1 , wherein said supporting layer is insulative.
3. A method of manufacturing an integrated circuit device as claimed in claim 1 , wherein said packaging substrate is made of resin.
4. A method of manufacturing an integrated circuit device as claimed in claim 1 , wherein said integrated circuit element is an SAW element having a predetermined frequency band and a central frequency thereof, said integrated circuit device being an SAW device including said SAW element mounted on said packaging substrate.
5. A method of manufacturing an integrated circuit device as claimed in claim 1 , wherein two said SAW elements having central frequencies of bands different from each other are mounted on said packaging substrate.
6. A method of manufacturing an integrated circuit device, said method comprising:
preparing an integrated circuit element which has an element substrate, a predetermined conductive pattern and a projecting electrode formed on said element substrate;
preparing a packaging substrate which has an external connecting terminal electrically connected with a mounting substrate and formed on a terminal forming surface positioned at a side opposite to said element mounting surface;
preparing a stage having a supporting projection capable of being contact with at least an area corresponding to a position where said integrated circuit element is mounted except said external connecting terminal forming area on said terminal forming area;
setting said packaging substrate on said supporting projection of said stage with said element mounting surface being directed to the outside; and
joining said integrated circuit element to said element mounting surface of said packaging substrate by applying ultrasonic wave vibration while pushing said integrated circuit element towards said supporting projection.