Semiconductor device comprising capacitor and method of fabricating the same
View Patent ↗A semiconductor device, having a memory cell region and a peripheral circuit region, includes an insulating film, having an upper surface, formed on a major surface of a semiconductor substrate to extend from the memory cell region to the peripheral circuit region. A capacitor lower electrode assembly is formed in the memory cell region to upwardly extend to substantially the same height as the upper surface of the insulating film on the major surface of the semiconductor substrate. Additionally, the lower electrode assembly includes first and second lower electrodes that are adjacent through the insulating film. A capacitor upper electrode is formed on the capacitor lower electrode through a dielectric film, to extend onto the upper surface of the insulating film. The capacitor lower electrode includes a capacitor lower electrode part having a top surface and a bottom surface. A semiconductor device organized as just described, permits implementation having a high density of integration while ensuring the capacitor exhibits high reliability and a constant capacitance.
1. A method of fabricating a semiconductor device comprising the steps of:
forming a lower insulating film over a major surface of a semiconductor substrate,
forming an upper insulating film over said lower insulating film,
forming an opening through said upper insulating film and said lower insulating film,
increasing a width of said opening at said lower insulating film by etching away a part of said lower insulating film exposed at said opening, wherein said lower insulating film has an etching rate larger than the etching rate of said upper insulating film,
forming a first conductor film along an inner side surface of said opening, and
forming a second conductor film on said first conductor film with a dielectric film there between,
wherein said lower insulating film includes impurities of a concentration higher than the concentration of said upper insulating film.
2. The method of fabricating a semiconductor device according to claim 1 , wherein, said impurity is boron or phosphorus.
3. The method of fabricating a semiconductor device according to claim 1 , wherein, in said step of increasing a width of said opening, etching is carried out using hydrofluoric acid.