Material and uses thereof
View Patent ↗A material comprising cobalt (Co), platinum (Pt) and phosphorus (P) having a composition of 94-98 wt % Co, 0-1 wt % Pt and 2-4 wt % P. The material may be subjected to annealing at a temperature between 100 and 500 degrees Celsius. The material is formed by electroplating a substrate in a suitable electrochemical bath. The electroplated CoPtP material forms a layer on the substrate. The CoPtP material has enhanced perpendicular magnetic properties and may be advantageous for use in microelectromechanical system (MEMS) devices.
1. A material comprising cobalt (Co), platinum (Pt) and phosphorus (P),
wherein the material has a composition of 94-98 wt % Co, wt % Pt being larger than 0 and no larger than 1, and 2-4 wt % P, and
wherein the cobalt (Co) has a form of a hexagonal close-pack (hcp) and has a 2θ of approximately 44.5° on an X-ray diffraction spectrum.
2. A material comprising cobalt (Co), platinum (Pt) and phosphorus (P),
wherein the cobalt (Co) has a form of a hexagonal close-pack (hcp) and has a 2θ of approximately 44.5° on an X-ray diffraction spectrum and
wherein the material has a composition of 96.3 wt % Co, 0.6 wt % Pt and 3.1 wt % P.
3. A material according to claim 1 , wherein the material is subjected to annealing at a temperature between 100 and 500 degrees Celsius.
4. A material according to claim 3 , wherein the annealing is carried out under ambient atmosphere.
5. A substrate and a material according to claim 1 , wherein the material is electroplated on the substrate to form a layer thereon.
6. A substrate and a material according to claim 5 , wherein the layer has a thickness of at least 0.5 μ.
7. A substrate and a material according to claim 5 , wherein the substrate comprises a seed layer, the seed layer comprising a layer of gold (Au) on a layer of chromium (Cr) (Cr/Au seed layer).
8. A substrate and a material according to claim 7 , wherein the gold layer of the Cr/Au seed layer has a (111) crystallographic orientation.
9. A microelectromechanical system (MEMS) device comprising the material according to claim 1 .
10. A MEMS device according to claim 9 , wherein the MEMS device is a magnetic MEMS device.
11. A MEMS device according to claim 10 , wherein the MEMS device is a microgripper.