Germanium solar cell and method for the production thereof
View Patent ↗A method is disclosed for passivating and contacting a surface of a germanium substrate. A passivation layer of amorphous silicon material is formed on the germanium surface. A contact layer of metal, e.g., aluminum, is then formed on the passivation layer. The structure is heated so that the germanium surface makes contact with the contact layer. The aluminum contact layer can be configured for use as a mirroring surface for the back surface of the device. Thus, a passivated germanium surface is disclosed, as well as a solar cell comprising such a structure.
1. A method of passivating and contacting a surface of a germanium substrate, comprising:
providing a germanium substrate having a first surface, wherein the first surface is configured to be used as a back surface of a photovoltaic device; thereafter
forming a first hydrogenated amorphous silicon or amorphous silicon passivation layer on the first surface; thereafter
forming a contact layer on the first hydrogenated amorphous silicon or amorphous silicon passivation layer, wherein the contact layer comprises a first metal layer, the first metal layer comprising aluminum; and thereafter
forming an aluminum-diffused first hydrogenated amorphous silicon or amorphous silicon passivation layer by heating the substrate and the layers at a temperature of from about 180° C. to about 240° C. so that the first surface makes contact with the contact layer by diffusion of aluminum through the first hydrogenated amorphous silicon or amorphous silicon passivation layer to form a conductive path between the contact layer and the germanium substrate, whereby a photovoltaic device is obtained.
2. The method according to claim 1 , wherein the first metal layer consists essentially of aluminum.
3. The method according to claim 1 , wherein heating the substrate and the layers is performed locally, in a predetermined contact area.
4. The method according to claim 3 , wherein heating is by a laser.
5. The method according to claim 1 , wherein the contact layer is a continuous layer configured for use as a mirroring surface for the back surface.
6. The method according to claim 1 , wherein a contact resistivity of the conductive path between the contact layer and the germanium substrate is less than about 10 −4 Ωcm 2 .
7. The method according to claim 1 , further comprising cleaning the first surface before forming the first hydrogenated amorphous silicon or amorphous silicon passivation layer, the cleaning comprising applying a H 2 containing plasma to the first surface.
8. The method of claim 1 , further comprising cleaning the first surface before forming the passivation layer, the cleaning comprising applying a wet-chemical HF dip to the first surface.
9. The method according to claim 1 , wherein forming the first hydrogenated amorphous silicon or amorphous silicon passivation layer is performed by plasma enhanced chemical vapor deposition.
10. The method according to claim 9 , wherein the plasma enhanced chemical vapor deposition is performed at a temperature of from about 150° C. to about 300° C.
11. The method according to claim 1 , wherein the first hydrogenated amorphous silicon or amorphous silicon passivation layer has a thickness of less than about 100 nm.
12. The method according to claim 1 , wherein the first hydrogenated amorphous silicon or amorphous silicon passivation layer has a thickness of less than about 80 nm.
13. The method according to claim 1 , wherein the first hydrogenated amorphous silicon or amorphous silicon passivation layer has a thickness of from about 20 nm to about 100 nm.
14. The method according to claim 1 , wherein the photovoltaic device is selected from the group consisting of a solar cell, a thermophotovoltaic cell, and a photodetector.
15. The method according to claim 1 , wherein the contact layer further comprises an additional metal layer, the additional metal layer comprising at least one metal selected from the group consisting of Cu, Ag, and Au.
16. The method according to claim 1 , wherein the first metal layer is deposited atop the first hydrogenated amorphous silicon or amorphous silicon passivation layer, and wherein the additional metal layer is deposited atop the first metal layer.
17. The method according to claim 15 , wherein the additional metal layer is deposited by evaporation.
18. The method according to claim 15 , wherein the additional metal layer is deposited by electroplating.
19. The method according to claim 1 , wherein forming a contact layer on the first hydrogenated amorphous silicon or amorphous silicon passivation layer further comprises patterning the contact layer to form a contact grid.
20. The method according to claim 1 , further comprising:
forming an emitter area in the germanium substrate; thereafter
forming a second hydrogenated amorphous silicon or amorphous silicon passivation layer on a second surface of the germanium substrate, wherein the second surface is configured for use as front surface of a photovoltaic device;
forming a front contact layer on the second hydrogenated amorphous silicon or amorphous silicon passivation layer, wherein the front contact layer comprises a second metal layer; and
forming a metal-diffused second hydrogenated amorphous silicon or amorphous silicon passivation layer by heating the substrate and the layers at a temperature of from about 180° C. to about 240° C. so that the second surface makes contact with the front contact layer through the second hydrogenated amorphous silicon or amorphous silicon passivation layer.
21. The method according to claim 20 , wherein the second metal layer comprises a metal selected from the group consisting of Pd, Cu, Ag, and Au.
22. The method according to claim 20 , wherein only one heating step is performed for the front surface and the back surface.
23. The method according to claim 20 , wherein the second surface makes contact with the front contact layer through the second hydrogenated amorphous silicon or amorphous silicon passivation layer before the first surface makes contact with the contact layer through the first hydrogenated amorphous silicon or amorphous silicon passivation layer.
24. The method according to claim 1 , wherein heating is by a laser beam from a green (532 nm) YAG laser with a power of about 0.6 Watt, a diode current of 20 A, a propagation speed of the laser beam of 500 mm/min, a stage that was 0.250 mm out of focus, and a laser frequency of about 100 kHz.
25. The method according to claim 1 , wherein heating is by a laser beam with a power of about 0.6 Watt, a diode current of 20 A, a propagation speed of the laser beam of 500 mm/min, a stage that was 0.250 mm out of focus, and a laser frequency of about 100 kHz.
26. A method of passivating and contacting a surface of a germanium substrate, comprising:
providing a germanium substrate having a first surface and a second surface, wherein the first surface is configured to be used as a back surface of a photovoltaic device and wherein the second surface is configured to be used as a front surface of the photovoltaic device;
forming a second hydrogenated amorphous silicon or amorphous silicon passivation layer on the second surface;
forming a first hydrogenated amorphous silicon or amorphous silicon passivation layer on the first surface, wherein the first hydrogenated amorphous silicon or amorphous silicon passivation layer has a thickness of less than about 300 nm;
forming a contact layer on the first passivation layer, wherein the contact layer comprises a first metal layer, the first metal layer comprising aluminum; and
forming an aluminum-diffused first hydrogenated amorphous silicon or amorphous silicon passivation layer by heating the substrate and the layers at a temperature of from about 180° C. to about 240° C. so that the first surface makes contact with the contact layer by diffusion of aluminum through the first hydrogenated amorphous silicon or amorphous silicon passivation layer to form a conductive path between the contact layer and the germanium substrate, whereby a photovoltaic device is obtained.
27. The method according to claim 26 , wherein the first hydrogenated amorphous silicon or amorphous silicon passivation layer has a thickness of less than about 100 nm.
28. The method according to claim 26 , wherein the second hydrogenated amorphous silicon or amorphous silicon passivation layer has a thickness of less than about 40 nm.
29. The method according to claim 26 , wherein the second hydrogenated amorphous silicon or amorphous silicon passivation layer has a thickness of from about 10 nm to about 40 nm.
30. The method according to claim 26 , wherein the first hydrogenated amorphous silicon or amorphous silicon passivation layer has a thickness of from about 20 nm to about 100 nm.
31. The method according to claim 26 , wherein the first hydrogenated amorphous silicon or amorphous silicon passivation layer has a thickness of from about 40 nm to about 90 nm.
32. The method according to claim 26 , wherein the first hydrogenated amorphous silicon or amorphous silicon passivation layer has a thickness of from about 50 nm to about 80 nm.
33. The method according to claim 26 , wherein heating is by a laser beam from a green (532 nm) YAG laser with a power of about 0.6 Watt, a diode current of 20 A, a propagation speed of the laser beam of 500 mm/min, a stage that was 0.250 mm out of focus, and a laser frequency of about 100 kHz.
34. The method according to claim 26 , wherein heating is by a laser beam with a power of about 0.6 Watt, a diode current of 20 A, a propagation speed of the laser beam of 500 mm/min, a stage that was 0.250 mm out of focus, and a laser frequency of about 100 kHz.