IP Library Granted Patent US 7,358,570
Granted Patent B2
US 7,358,570 · App. 11/340,519 · Granted Apr 15, 2008

Liquid crystal display panel

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Quick Facts
Patent No.
US 7,358,570
App. No.
11/340,519
Granted
Apr 15, 2008
Kind
B2
Abstract

A COG type liquid crystal display panel 10 in which a rectangular chip mounting area MA for mounting an IC chip 14 is provided on one of a pair of substrates 11, 12 on which a plurality of electrodes are provided, a plurality of extraction electrodes 20 that are severally connected to the electrodes are lead out into the chip mounting area, and the terminals for bump 21 u to 21 z , 31 u to 31 z connected to bump terminals of the IC chip are formed on the extraction electrodes, from which the extraction electrodes are lead out at least on two sides of the rectangular chip mounting area and further extended into the chip mounting area from the terminals for bump and terminals for inspection 22 u to 22 z , 32 u to 32 z are arrayed on extended end portions of the extraction electrodes so as to be drawn up in a line according to a predetermined rule of the electrodes to which the extraction electrodes are connected. Consequently, it is possible to provide a liquid crystal display panel upon which intermediate functional inspection can be easily performed even if it is a COG type liquid crystal display panel on which a fairly large number of extraction electrodes exist.

Claims (8)

1. A COG (Chip On Glass) type liquid crystal display panel in which a substantially rectangular chip mounting area for mounting an IC chip for driving liquid crystal is provided on one of a pair of substrates on which a plurality of electrodes are arranged in a matrix state, wherein the electrodes are connected to pixels (R, B, G) of different types, liquid crystal is filled between the substrates whose peripheral areas are bonded together by a sealing material, a plurality of extraction electrodes, which are respectively connected to the electrodes, are lead out of said chip mounting area, and terminals for bump, which are connected to bump terminals of said IC chip for driving liquid crystal, are formed on the extraction electrodes,

wherein said plurality of extraction electrodes are lead out at least to two sides of said rectangular chip mounting area and are further extended onto said chip mounting area from said terminals for bump, and terminals for inspection are arrayed on extended end portions of the extraction electrodes such that said terminals for inspection are arrayed in a straight line comprising terminals connected to pixels of the same type, to which extraction electrodes lead out from said at least two sides of the rectangular chip mounting area are connected,

wherein said extraction electrodes are connected to transparent electrodes respectively corresponding to pixels of R, G and B, via switching elements, said terminal for inspection are used as terminals for inspecting R, G and B corresponding to said respectively connected transparent electrodes for R, G and B, and the terminals for inspection are arrayed in straight lines consisting of terminals for inspecting R, G and B, respectively.

2. The liquid crystal display panel according to claim 1 , wherein said plurality of extraction electrodes are lead out of facing long sides of said rectangular chip mounting area.

3. The liquid crystal display panel according to claim 1 , wherein said plurality of extraction electrodes are lead out of three sides of the sides of the rectangular chip mounting area but not from the side that is most remote from the display surface of said liquid crystal display panel.

4. The liquid crystal display panel according to claim 1 , wherein extraction electrodes connecting said terminals for bump and the terminals for inspection are wired so as not to overlap each other.

5. The liquid crystal display panel according to claim 1 , wherein the width of said terminals for inspection is made smaller than said terminals for bump.

6. The liquid crystal display panel according to claim 1 , wherein said terminals for bump are arrayed along the longitudinal direction of sides of said rectangular chip mounting area, and adjacent terminals for bump are arrayed on separate straight lines to prevent the adjacent terminals for bump from contacting each other.

Assignments (5)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 8, 2013
From: SONY CORPORATION
To: JAPAN DISPLAY WEST INC.
Reel/Frame 031378/0243 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 11, 2011
From: EPSON IMAGING DEVICES CORPORATION
To: SONY CORPORATION
Reel/Frame 025935/0327 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE'S ADDRESS TO 6925 TOYOSHINA TAZAWA, AZUMINO-SHI NAGANO JAPAN PREVIOUSLY RECORDED ON REEL 019844 FRAME 0750. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNEE'S ADDRESS. Recorded Nov 7, 2008
From: SANYO EPSON IMAGING DEVICES CORPORATION
To: EPSON IMAGING DEVICES CORPORATION
Reel/Frame 021803/0753 →
CHANGE OF NAME Recorded Sep 18, 2007
From: SANYO EPSON IMAGING DEVICES CORPORATION
To: EPSON IMAGING DEVICES CORPORATION
Reel/Frame 019844/0750 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 27, 2006
From: ARAMATSU, YOSHIAKI
To: SANYO EPSON IMAGING DEVICES CORP.
Reel/Frame 017522/0188 →