Optical modulator module
View Patent ↗A high frequency substrate, on which a high frequency substrate transmission line for connecting a chip carrier transmission line and a package substrate transmission line is formed, is mounted while being inclined with respect to a package, so that each distance between the transmission lines can be reduced. Thereby, the lengths of wires for connecting the transmission lines can be reduced so as to improve frequency characteristics of an optical modulator module.
1. An optical modulator module comprising:
an optical modulator for modulating light on the basis of an electrical signal;
a chip carrier on which the optical modulator is mounted and a first transmission line is formed;
a package substrate which is connected to a package and on which a second transmission line is formed; and
a high frequency substrate which is arranged between said chip carrier and said package substrate and on which a third transmission line is formed, said third transmission line being connected to both said first transmission line and said second transmission line, wherein
each x coordinate each y coordinate of an input terminal of said first transmission line differs from each x coordinate and each y coordinate of an output terminal of said second transmission line;
said high frequency substrate in a rectangular shape is arranged so that said high frequency substrate abuts against said chip carrier or said package substrate in the vicinity of one corner of said high frequency substrate while a corner opposite to said one corner is made closer to said chip carrier or said package substrate; and
the connection of said first transmission line and said third transmission line or the connection of said second transmission line and said third transmission line is made by wire bonding.
2. The optical modulator module according to claim 1 , wherein
the minimum value of a distance between said high frequency substrate and said chip carrier is 50 μm or less, and the minimum value of a distance between said high frequency substrate and said package substrate is more than 50 μm.
3. The optical modulator module according to claim 1 , wherein
the minimum value of a distance between said high frequency substrate and said chip carrier is more than 50 μm, and the minimum value of a distance between said high frequency substrate and said package substrate is 50 μm or less.
4. The optical modulator module according to claim 1 , wherein
said high frequency substrate is chamfered at an angle of four degrees or more at least any one of said one corner and said corner opposite to said one corner.
5. The optical modulator module according to claim 1 , wherein
a relief against said high frequency substrate is formed in the vicinity of a portion, against which said high frequency substrate abuts, of said chip carrier or said package substrate.