Embedded microchannel cooling package for a central processor unit
View Patent ↗An indirect cooling liquid embedded package design for use with a computer central processor unit is suitable for thermal management of high heat dissipation electronic components such as server processors. The indirect contact cooling liquid embedded packaged CPU has mechanical coupling and embedded plumbing that attaches to the board pumped liquid supply and indirect cooling of the heat-generating portion of the CPU with an embedded microchannel heat exchanger. The coolant package system for the CPU removes higher levels of heat indirectly from the core of the processors by convective cooling. Cooling liquid is introduced into the package of the server CPU by mechanically attaching the CPU to the board through a socket interconnect. Pins of the socket serves to provide electrical connection between the board and the CPU, while a few pins are designed for the purpose of inletting and outletting cooling liquid into and out of the CPU package.
1. A package for an integrated circuit employing indirect liquid cooling comprising:
a substrate having a first microchannel for allowing liquid coolant to flow from a bottom surface of the substrate to a top surface of the substrate and a second microchannel for allowing liquid coolant to flow from the top surface of the substrate to the bottom surface of the substrate;
an integrated circuit attached to the top surface of the substrate;
a lid for surrounding the integrated circuit;
a lid attachment for sealing the lid to the substrate; and
a microchannel heat exchanger coupled to the first and second microchannels arranged between a top surface of the integrated circuit and the lid, wherein the top surface of the integrated circuit comprises one or more heat-producing portions of the integrated circuit and wherein the microchannel heat exchanger is directly coupled to the heat-producing portions.
2. The package of claim 1 wherein the substrate comprises ceramic molding material including at least one layer of metal interconnect circuits providing electrical connection between top and bottom metallic connection pads.
3. The package of claim 1 wherein the lateral dimensions of the substrate are about 50×50 mm 2 .
4. The package of claim 1 wherein the substrate is about 2 mm thick.
5. The package of claim 1 wherein the microchannel has a diameter of about 0.5 mm.
6. The package of claim 1 wherein the integrated circuit comprises a microprocessor.
7. The package of claim 1 further comprising a plurality of conductive bumps for attaching the integrated circuit to the top surface of the substrate.
8. The package of claim 7 further comprising an underfill material for conformally coating the plurality of conductive bumps.
9. The package of claim 1 wherein the lid attachment comprises a self-locking attachment mechanism.
10. The package of claim 1 wherein the liquid coolant comprises water, water/glycol, a fluorocarbon liquid coolant, or a refrigerant.
11. A package assembly for an integrated circuit employing indirect liquid cooling comprising:
a board having a liquid coolant inlet and a liquid coolant outlet;
a socket coupled to the board via a first plurality of socket pins;
a package substrate coupled to the socket via a second plurality of socket pins, wherein a first microchannel is arranged adjacent to the first and second pluralities of socket pins for allowing liquid coolant to flow from the liquid coolant inlet through the board, the socket, and the package substrate and a second microchannel is arranged adjacent to the first and second pluralities of socket pins for allowing liquid coolant to flow through the package substrate, the socket, and the board to the liquid coolant outlet;
an integrated circuit attached to the top surface of the substrate;
a lid for surrounding the integrated circuit;
a lid attachment for sealing the lid to the substrate; and
a microchannel heat exchanger coupled to the first and second microchannels placed on a top surface of the integrated circuit.
12. The package of claim 11 wherein the substrate comprises ceramic molding material including at least one layer of metal interconnect circuits providing electrical connection between top and bottom metallic connection pads.
13. The package of claim 11 wherein the lateral dimensions of the substrate are about 50×50 mm 2 .
14. The package of claim 11 wherein the substrate is about 2 mm thick.
15. The package of claim 11 wherein the microchannel has a diameter of about 0.5 mm.
16. The package of claim 11 wherein the integrated circuit comprises a microprocessor.
17. The package of claim 11 further comprising a plurality of conductive bumps for attaching the integrated circuit to the top surface of the substrate.
18. The package of claim 17 further comprising an underfill material for conformally coating the plurality of conductive bumps.
19. The package of claim 11 wherein the lid attachment comprises a self-locking attachment mechanism.
20. A package assembly for an integrated circuit employing indirect liquid cooling, comprising:
a board having a liquid coolant inlet and a liquid coolant outlet;
a socket coupled to the board with a plurality of socket pins;
a package substrate coupled to the socket via a plurality of socket pins wherein a first microchannel is arranged between two adjacent socket pins to allow liquid coolant to flow from the liquid coolant inlet through the board, the socket, and the package substrate and a second microchannel is arranged between two adjacent socket pins, said second microchannel for allowing liquid coolant to flow through the package substrate, the socket, and the board to the liquid coolant outlet;
an integrated circuit attached to the top surface of the substrate;
a lid for surrounding the integrated circuit;
a lid attachment for sealing the lid to the substrate; and
a microchannel heat exchanger coupled to the first and second microchannels placed on a top surface of the integrated circuit.