Enhanced heat pipe cooling with MHD fluid flow
View Patent ↗A cooling apparatus includes a heat pipe base covering a heat source; a heat sink with a plurality of heat sink fins; a plurality of heat pipes connecting the heat pipe base and the heat sink; and a magneto-hydrodynamic (MHD) pump assembly connected to the heat sink. In a method for cooling a heat source with heat pipes, magneto-hydrodynamic (MHD) fluid pipes, and a heat sink, the method includes transmitting heat from evaporating ends of the heat pipes connected to a heat source to condensing ends of the heat pipes connected to the heat sink; and circulating MHD fluid inside the MHD fluid pipes embedded in the heat sink to dissipate heat. In a method for cooling a heat sink connected to a plurality of heat pipes and containing a plurality of MHD fluid pipes, the method includes generating a plurality of magnetic fields using an array of magnets; creating an electric potential from a top surface to a bottom surface of each MHD fluid pipe using a plurality of metal films; and inducing electrically-conductive MHD fluid to circulate in the plurality of MHD fluid pipes by the plurality of magnetic fields and the electric potential.
1. A cooling apparatus comprising:
a heat pipe base covering a heat source;
a heat sink with a plurality of heat sink fins;
a plurality of heat pipes connecting the heat pipe base and the heat sink; and
a magneto-hydrodynamic (MHD) pump assembly connected to the heat sink.
2. The cooling apparatus according to claim 1 , further comprising a plurality of MHD fluid pipes contained inside the heat sink.
3. The cooling apparatus according to claim 1 , wherein the heat source comprises an integrated circuit.
4. The cooling apparatus according to claim 1 , wherein the MHD pump assembly comprises an array of metal pipes, an array of electrically non-conductive materials separating each metal pipe, an array of metal films on top and bottom surfaces of the array of metal pipes, and an array of magnets below the array of metal pipes.
5. The cooling apparatus according to claim 4 , wherein the array of metal pipes and the array of metal films are made of copper.
6. The cooling apparatus according to claim 4 , wherein the array of electrically non-conductive materials are made of plastic.
7. The cooling apparatus according to claim 1 , wherein the plurality of heat pipes is L-shaped.
8. The cooling apparatus according to claim 7 , wherein the heat sink is not placed on top of the heat source.