IP Library Granted Patent US 7,323,720
Granted Patent B2
US 7,323,720 · App. 11/347,287 · Granted Jan 29, 2008

Light-emitting device, image forming apparatus, and electronic apparatus with an integrated circuit mounted on a substrate

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,323,720
App. No.
11/347,287
Granted
Jan 29, 2008
Kind
B2
Abstract

A light-emitting device includes a substrate having a plurality of light-emitting elements and a light emission region arranged on one surface thereof, light being emitted from one surface of the light emission region; and an integrated circuit chip that generates signals for controlling the plurality of light-emitting elements. The integrated circuit chip is connected to the substrate so as to overlap a portion of or the entire light emission region, as viewed from the other surface of the substrate.

Claims (75)

1. A light-emitting device, comprising:

a substrate having a first surface and a second surface;

a light emission region arranged over the first surface of the substrate,

a plurality of light-emitting elements each having a cathode and an anode and being located in the light emission region, light being emitted in a light-emitting direction from the light emission region;

at least one integrated circuit chip that generates signals to control the plurality of light-emitting elements and that have a plurality of output terminals to output signals to the plurality of light-emitting elements,

a plurality of connection terminals connected to the plurality of output terminals of the integrated circuit chip;

a common cathode line connected to the cathode of each of the plurality of light-emitting elements; and

first wiring lines that connect the anodes of the plurality of light-emitting elements to the plurality of connection terminals,

the integrated circuit chip being connected to the substrate so as to overlap at least a portion of the light emission region, as viewed from a position in the light-emitting direction,

the integrated circuit chip being fixed to the first surface of the substrate by the plurality of output terminals,

each of the plurality of terminals having a length such that the bottom of the integrated circuit chip does not contact the light-emitting region, and

the plurality of light-emitting elements being interposed between the plurality of connection terminals and the common cathode line.

2. The light-emitting device according to claim 1 ,

the plurality of connection terminals being provided over the substrate.

3. The light-emitting device according to claim 1 ,

the plurality of light-emitting elements being arranged in a column, the common cathode line being arranged adjacent a first side of the column of the plurality of light-emitting elements, and

the plurality of connection terminals being arranged adjacent a second side of the column of the plurality of light-emitting elements.

4. The light-emitting device according to claim 1 ,

a plurality of the output terminals and the plurality of connection terminals being alternately disposed with respect to the plurality of light-emitting elements.

5. The light-emitting device according to claim 4 ,

the common cathode line being formed to zigzag so as to traverse adjacent light-emitting elements, and

the common cathode line, the plurality of light-emitting elements, the first wiring lines, and the plurality of connection terminals being arranged from a first long side of the integrated circuit chip to a second long side of the integrated circuit chip.

6. The light-emitting device according to claim 1 ,

the at least one integrated circuit chip being a plurality of integrated circuit chips each having short sides and long sides,

some of the plurality of output terminals being arranged adjacent to one of the short sides and long sides of each of the plurality of integrated circuit chips,

the plurality of connection terminals being arranged over the substrate at positions corresponding to the output terminals arranged adjacent to the one sides,

the light-emitting device further comprising second wiring lines that connect the connection terminals arranged adjacent to the one sides, and

at least one of the light-emitting elements being disposed between adjacent integrated circuit chips and being arranged so as to intersect the one sides.

7. The light-emitting device according to claim 1 ,

the at least one integrated circuit chip being a plurality of integrated circuit chips each having short sides and long sides, at least some of the light-emitting elements being disposed between adjacent integrated circuit chips,

the light-emitting device further comprising at least one flexible substrate having a plurality of wiring lines to supply signals to at least one of the integrated circuit chips,

a first portion of the substrate being covered with the flexible substrate constituting a first region, and a second portion of the substrate not being covered with the flexible substrate constituting a second region,

at least some of the plurality of output terminals being arranged adjacent to a long side of each of the plurality of integrated circuit chips,

the plurality of connection terminals being arranged over the substrate at positions corresponding to the plurality of output terminals arranged adjacent to the long sides, and

the light-emitting device further comprising third wiring lines that connect the plurality of connection terminals arranged adjacent to the long sides with the light-emitting elements disposed between adjacent integrated circuit chips, the third wiring lines being arranged in at least one of the first region and the second region so as to intersect the long sides.

8. The light-emitting device according to claim 7 , the third wiring lines being provided in only the second region so as to intersect the long sides.

9. The light-emitting device according to claim 7 ,

the common cathode line, the light-emitting elements provided between the adjacent integrated circuit chips, and the third wiring lines being arranged in this order.

10. The light-emitting device according to claim 7 ,

the third wiring lines being provided in the first and second regions so as to intersect the long sides.

11. An image forming apparatus, comprising:

the light-emitting device according to claim 1 ; and

photosensitive members that form images by radiation of light beams,

the light-emitting device being a head unit that radiates the light beams onto the photosensitive members.

12. An electronic apparatus, comprising:

the light-emitting device according to claim 1 .

13. The light-emitting device according to claim 1 ,

the integrated circuit chip being indirectly connected to the substrate.

14. A light-emitting device, comprising:

a substrate;

a plurality of light-emitting elements arranged over the substrate, the plurality of light-emitting elements each having a cathode and an anode;

a common cathode line connecting the cathode of each of at least one pair of adjacent light-emitting elements;

at least one integrated circuit chip arranged over the plurality of light-emitting elements, the integrated circuit chip having a plurality of output terminals;

a plurality of connection terminals connected to the plurality of output terminals of the integrated circuit chip; and

wiring lines that connect the anodes of the plurality of light-emitting elements to the plurality of connection terminals, the wiring lines and the common cathode line being formed in a same layer over the substrate.

15. A light-emitting device, comprising:

a substrate;

a plurality of light-emitting elements arranged over the substrate, the plurality of light-emitting elements each having a cathode and an anode;

a common cathode line connecting the cathode of each of at least one pair of adjacent light-emitting elements;

at least one integrated circuit chip arranged over the plurality of light-emitting elements, the integrated circuit chip having a plurality of output terminals;

a plurality of connection terminals connected to the plurality of the output terminals of the integrated circuit chip; and

wiring lines that connect the anodes of the plurality of light-emitting elements to the plurality of the connection terminals,

each of the plurality of light-emitting elements being interposed between one of the plurality of connection terminals and the common cathode line.

16. A light-emitting device, comprising:

a substrate;

a plurality of light-emitting elements arranged over the substrate, the plurality of light-emitting elements each having a cathode and an anode;

a common cathode line connecting the cathode of each of at least one pair of adjacent light-emitting elements;

a plurality of integrated circuit chips each having short sides and long sides and being arranged over the plurality of light-emitting elements, the integrated circuit chip having a plurality of output terminals;

a plurality of connection terminals connected to the plurality of the output terminals of the integrated circuit chip and being arranged over the substrate; and

a wiring line,

the plurality of output terminals including a first output terminal and a second output terminal, the first output terminal being arranged adjacent to one of the short sides of the each of the plurality of integrated circuit chips and the second output terminal being arranged adjacent to one of the long sides of the each of the plurality of integrated circuit chips,

the plurality of connection terminals including a first connection terminal,

the first connection terminal connecting to the first output terminal of the integrated circuit chip,

the wiring connecting the first connection terminal to one of the plurality of light-emitting elements, and

the wiring being arranged so as to intersect the one of the short sides.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 17, 2022
From: EL TECHNOLOGY FUSION GODO KAISHA
To: ELEMENT CAPITAL COMMERCIAL COMPANY PTE. LTD.
Reel/Frame 059435/0428 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 31, 2018
From: SEIKO EPSON CORPORATION
To: EL TECHNOLOGY FUSION GODO KAISHA
Reel/Frame 047998/0879 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 6, 2006
From: KUBOTA, TAKEHIKO; FUJIKAWA, SHINSUKE
To: SEIKO EPSON CORPORATION
Reel/Frame 017549/0065 →