Method and apparatus for controlling sample position during material removal or addition
A method and system includes the accurate positioning of a sample in a multi-axis range of motion. In a preferred embodiment, the present invention enables this movement by combining coarse and fine motion stages. By using a combination of stages and precise measuring means, normal and typical errors are significantly reduced.
1 . An apparatus for positioning a material in the appropriate location such that the material can be modified with a system, comprising:
a multi-axis stage configured to accept the material on an outer surface, wherein the multistage axis is configured to translate or rotate along at least one axis; and
a second stage with at least one axis of motion positioned on an opposing surface of the multi-axis stage.
2 . The apparatus as in claim 1 , wherein the multi-stage axis is configured to translate with a piezo actuator.
3 . The apparatus as in claim 2 , wherein the multi-stage axis is configured to rotate with a piezo actuator.
4 . The apparatus as in claim 1 , wherein the system comprises a laser.
5 . The apparatus as in claim 1 , wherein the material is modified by selecting one from the group consisting of adding material and removing material.
6 . The apparatus as in claim 1 , wherein the material is a photomask.
7 . The apparatus as in claim 1 , wherein the material is a silicon device in process.
8 . The apparatus as in claim 1 , wherein the material is a flat panel device.
9 . The apparatus as in claim 2 , wherein the apparatus reduces the effects of Abbe errors and minimal parasitic motion.
10 . The apparatus as in claim 4 , wherein the laser is of a short pulse duration.
11 . The apparatus as in claim 10 , wherein the short pulse duration is in the femto-second range.
12 . The apparatus as in claim 2 , further comprising an observation and control device that is configured to track modification made on the material.
13 . The apparatus as in claim 12 , wherein the observation and control device further comprises a mirror or a partial reflecting mirror, a computing device and a piezo stage controller.
14 . The apparatus as in claim 13 , wherein the observation and control device transmits observed values of the modification to the computing device, wherein the computing device is configured to determine an error in the modification.
15 . The apparatus as in claim 14 , wherein the computing device transmits data to the piezo stage controller.
16 . The apparatus as in claim 15 , wherein the data is correction data.
17 . The apparatus as in claim 16 , wherein the system is a laser.
18 . The apparatus as in claim 17 , wherein a lens is configured to focus a beam of the laser and measure the modification.
19 . The apparatus as in claim 2 , wherein the multi-stage axis is configured to rotate with a flexure.
20 . The apparatus as in claim 19 , wherein a sensor is configured to sense motion of the multi-axis stage.
21 . The apparatus as in claim 20 , wherein the sensor is a capacitive sensor.
22 . The apparatus as in claim 1 , wherein the system further comprises a temperature control apparatus.
23 . The apparatus as in claim 1 , wherein the system further comprises humidity control apparatus.
24 . The apparatus as in claim 1 , wherein the system further comprises a vibration isolation apparatus.
25 . The apparatus as in claim 1 , wherein the system further comprises a robotic sample handling apparatus.
26 . The apparatus as in claim 1 , wherein the second stage is configured to move in a course motion.
27 . A method for positioning a sample relative to a system such that the sample could be modified, comprising:
positioning the sample on a multi-axis stage, wherein the stage is translational and rotational along an axis; and
positioning the multi-axis stage on a second stage.
28 . The method as in claim 27 , further comprising positioning the sample with the multi-stage axis relative to the system, wherein the system is configured to modify the sample.
29 . The method as in claim 28 , wherein modifying the sample comprises removing material.
30 . The method as in claim 29 , wherein modifying the sample comprises adding material.
31 . The method as in claim 27 , further comprising modifying the sample with a laser.
32 . The method as in claim 31 , wherein the laser is a short pulse duration laser.
33 . The method as in claim 32 , wherein the short pulse duration laser is in the femto-second pulse range.
34 . The method as in claim 27 , further comprising sensing a movement of the sample on the multi-stage axis.
35 . The method as in claim 34 , wherein the step of sensing is accomplished with a capacitive sensor.
36 . The method as in claim in 31 , further comprising observing the modification of the sample.
37 . The method as in claim 36 , further comprising determining a presence of an error while the sample is being modified.
38 . The method as in claim 37 , further comprising correcting the error.
39 . The method as in claim 38 , wherein the step of correcting the error comprises transmitting correction information to a multi-stage axis controller and adjusting the multi-stage axis in response to the correction information.
40 . An apparatus for positioning a material in the appropriate location such that the material can be modified with a system, comprising:
first means for multi-axis staging that is configured to accept the material on an outer surface, wherein the first means for multi-axis staging is configured to translate or rotate along at least one axis; and
a second mean for staging with at least one axis of motion positioned on an opposing surface of the multi-axis stage.
41 . The apparatus as in claim 40 , further comprising means for adding or removing material from the material.
42 . The apparatus of claim 41 , wherein the means for adding or removing is a laser.
43 . The apparatus of claim 41 , wherein the means for adding or removing is a FIB source.
44 . The apparatus of claim 41 , wherein the means for adding or removing is an electron beam source.
45 . The apparatus of claim 42 , wherein the laser is pulsed.
46 . A method for adding or removing material from a target surface with high precision relative to surface features comprising:
positioning the sample on a multi-axis stage, wherein the stage is translational and rotational along an axis;
positioning the multi-axis stage on a second stage; and
directing a source of energy at or near the surface.
47 . The method of claim 46 further comprising measuring the location of the added or removed material.
48 . The method claim 47 , wherein the source of energy is used for both measurement and adding or removing material.