Transponder assembly for use with parallel optics modules in fiber optic communications systems
A transponder assembly for use with fiber optic digital communication cables having multiple parallel optic fiber elements. The transponder assembly features a transmitter port and receiver port for connection with separate parallel optic cables for separately transmitting and receiving data and an electrical connector for connecting with computer or communication systems. The transponder assembly includes a parallel optic transmitter module and a parallel optic receiver module having pluggable edge connectors. The assembly also includes a circuit board on which a semiconductor chip useful for signal processing and the electrical connector are mounted. A flex circuit is used in connecting the circuit board to the parallel optic modules. The semiconductor chip and electrical connector are mounted directly across from one another on opposite surfaces of the circuit board.
1. A transponder assembly having a housing, the transponder assembly comprising:
a parallel optics receiver module having a receiver edge connector;
a parallel optics transmitter module having a transmitter edge connector;
a printed circuit board having a top surface and a bottom surface;
a semiconductor chip mounted on the top surface of the printed circuit board, the semiconductor chip providing signal processing capabilities;
an electrical connector mounted to the bottom surface of the printed circuit board;
a connector board;
a first electrical connection jack mounted on the connector board, the first electrical connection jack adapted for connecting with the receiver edge connector of the parallel optics receiver module;
a second electrical connection jack mounted on the connector board, the second electrical connection jack adapted for connecting with the transmitter edge connector of the parallel optics transmitter module; and
a flex circuit for connecting and interfacing the connector board with the printed circuit board.
2. A transponder assembly according to claim 1 wherein the electrical connector comprises a pin-array connector, and the semiconductor chip comprises a SerDes chip.
3. A transponder assembly according to claim 1 wherein the printed circuit board includes first and second overlapping ball grid array attachments for connecting the electrical connector and semiconductor chip with the printed circuit board.
4. A transponder assembly according to claim 1 wherein the parallel optics receiver module and the parallel optics transmitter module are adapted for interfacing with fiber optic ribbon cables containing twelve optical fibers.
5. A transponder assembly according to claim 1 wherein the printed circuit board forms a first plane, and the connector board forms a second plane, and wherein the first plane is different from the second plane.