IP Library Granted Patent US 7,418,870
Granted Patent B2
US 7,418,870 · App. 11/352,629 · Granted Sep 2, 2008

Pressure sensor with expanding member

Assignee: ZIN Technologies
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Quick Facts
Patent No.
US 7,418,870
App. No.
11/352,629
Filed
Feb 13, 2006
Granted
Sep 2, 2008
Kind
B2
Art Unit
2855
USPC
73/754
Abstract

Systems and methodologies that provide for multi-parameter sensing via micro fabricated sensing structures operatively connected to oscillators, each micro-fabricated sensing structure in part defines a frequency of a respective associated oscillator. Output from such oscillators can be combined together, and then AC coupled with an incoming DC voltage that feeds the oscillators. The wiring arrangement includes two conducting paths/wires that carry a direct current to the oscillators as well as outputting the combined signal to external measurement devices. In addition, arrangements for pressure sensors are provided that mitigate errors from temperature variations and the induced stress/strains.

Claims (26)

1. A micro-fabricated pressure sensor, comprising:

a pressure sensing element; and

a free expanding member formed as a result of a connection of a base of the micro-fabricated pressure sensor to a package, such that a connection area therebetween is less than an area of the base, the free expanding member mitigates effects of at least one of temperature induced stress and strains on the pressure sensing element.

2. The micro-fabricated pressure sensor of claim 1 , the micro-fabricated pressure sensor with a step structure that forms the connection area.

3. The micro-fabricated pressure sensor of claim 1 , the pressure sensing element operates based on at least one of a resonator, capacitive structures and piezoresistive.

4. The micro-fabricated pressure sensor of claim 1 , the pressure sensing element positioned on the free expanding member.

5. The micro-fabricated pressure sensor of claim 1 , the pressure sensing element comprising an encapsulation that relative thereto, a pressure of surrounding environment is measured.

6. The micro-fabricated pressure sensor of claim 1 , the free expanding member with a uniform thermal expansion coefficient to provide a zone that mitigates thermal stresses or strains.

7. The micro-fabricated pressure sensor of claim 1 , the free expanding member comprising silicone carbide.

8. The micro-fabricated pressure sensor of claim 1 , the pressure sensing element further sensitive to temperature.

9. The micro-fabricated pressure sensor of claim 1 , further comprising a wire connectable portion for attaching a wire thereto.

10. The micro-fabricated pressure sensor of claim 4 the free expanding member expandable to mitigate at least one of a strain and stress on the pressure sensing element.

11. A method of measuring a pressure via a pressure sensor comprising:

connecting a base of the pressure sensor to a package to form a connection area, the connection area smaller than an area of the base; and

forming a free expanding member from the connecting act, to reduce stress or strain on a sensing element associated with the pressure sensor.

12. The method of claim 11 further comprising forming a step shaped structure on the base.

13. The method of claim 11 further comprising positioning a sensing element associated with the pressure sensor on the free expanding member.

14. The method of claim 13 further comprising expanding the free expanding member as a result of pressure or temperature induced on the pressure sensor.

15. The method of claim 14 further comprising contracting the free expanding member.

16. The method of claim 14 further comprising mitigating a deformation on the sensing element.

17. The method of claim 14 , further comprising measuring a pressure of a surrounding environment relative to the sensing element.

18. The method of claim 14 further comprising providing a zone within the expanding member to absorb stresses or strains therein.

19. A micro-fabricated pressure sensor comprising:

means for forming a free expandable member; and

means for reducing a strain or stress on a sensing means of the pressure sensor;

means for reducing a contact area of the pressure sensor to a package.

Assignments (3)
RELEASE OF INTELLECTUAL PROPERTY SECURITY INTEREST Recorded Jul 22, 2025
From: HERCULES CAPITAL, INC., AS COLLATERAL AGENT
To: VOYAGER TECHNOLOGIES, INC. (F/K/A VOYAGER SPACE HOLDINGS, INC.); NANORACKS LLC; VOYAGER SPACE IP HOLDINGS, LLC; VALLEY TECH SYSTEMS, INC.; DREAMUP, PBC; PIONEER INVENTION, LLC; SPACE MICRO INC.; ALTIUS SPACE MACHINES, INC.; ZIN TECHNOLOGIES, INC.
Reel/Frame 072129/0689 →
SECURITY INTEREST Recorded Jul 1, 2024
From: VOYAGER SPACE HOLDINGS, INC.; VOYAGER SPACE IP HOLDINGS, LLC; DREAMUP, PBC; SPACE MICRO INC.; ZIN TECHNOLOGIES, INC.; NANORACKS LLC; VALLEY TECH SYSTEMS, INC.; PIONEER INVENTION, LLC; ALTIUS SPACE MACHINES, INC.
To: HERCULES CAPITAL, INC., AS AGENT
Reel/Frame 068104/0818 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 13, 2006
From: IZADNEGAHDAR, ALAIN
To: ZIN TECHNOLOGIES
Reel/Frame 017565/0863 →
Continuity (2)
Division 1106980100 · Feb 28, 2005
Related Publication 20060191349A1 · Aug 31, 2006