IP Library Granted Patent US 7,432,441
Granted Patent B2
US 7,432,441 · App. 11/353,139 · Granted Oct 7, 2008

Assembly of modularized housing and door cover

Assignee: Super Micro Computer, Inc.
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Quick Facts
Patent No.
US 7,432,441
App. No.
11/353,139
Granted
Oct 7, 2008
Kind
B2
Abstract

An assembly of modularized housing and door cover includes a modularized housing; a door cover having a upper part thereof formed with at least one sleeve for putting around the axial pin, and a main body thereof formed with a plurality of ventilation openings; a film having a surface thereof partially adhered to peripheral areas of the ventilation openings using an adhesive layer to form loose-leaf connection; and spring accommodated in the axial pin, and having one end thereof pushed against the wall surface and the other end thereof pushed against an inner wall of the door cover. The modularized housing is provided with excellent ventilation effects therein when assembled with power supply device. The accommodating chambers are not assembled with power supply devices, external air in large amounts is prevented from entering into the idle accommodating chamber, thereby forming negative pressure at the interior of the modularized housing.

Claims (14)

1. An assembly of modularized housing and door cover, comprising:

a modularized housing, which has at least one rectangular accommodating chamber having a wall surface provided with a rectangular hole, and an axial pin laterally, pivotally connected and located in the hole;

a door cover having an upper part thereof formed with at least one sleeve for putting around the axial pin, and a main body thereof formed with a plurality of ventilation openings;

a film having a surface thereof partially adhered to peripheral areas of the ventilation openings using an adhesive layer to form loose-leaf connection; and

at least one spring accommodated in the axial pin, and having one end thereof pushed against the wall surface and the other end thereof pushed against an inner wall surface of the door cover;

wherein, the spring and the sleeve are located in the hole.

2. The assembly of modularized housing and door cover in accordance with claim 1 , wherein the wall surface is provided with a plurality of air-guiding holes.

3. The assembly of modularized housing and door cover in accordance with claim 1 , wherein the accommodating chamber may be inserted by a power supply device, and the door cover is in a flexibly closed status while approaching the wall surface.

4. The assembly of modularized housing and door cover in accordance with claim 1 , wherein the wall surface situated at an opening of the accommodating chamber is provided with a flexible curved spring plate in a protruding manner.

5. The assembly of modularized housing and door cover in accordance with claim 1 , wherein the accommodating chambers are provided in quantity of four and have lateral spacing plates and longitudinal spacing plates.

6. The assembly of modularized housing and door cover in accordance with claim 1 , wherein the door cover is provided with a recessed surface, with the ventilation openings formed thereon.

7. The assembly of modularized housing and door cover in accordance with claim 1 , wherein the door cover has two side surfaces thereof distributed with longitudinal protruding edges.

8. The assembly of modularized housing and door cover in accordance with claim 1 , the wall surface of the accommodating chamber is defined as an upper wall surface or a lower wall surface of the accommodating chamber.

9. The assembly of modularized housing and door cover in accordance with claim 1 , wherein, air pressure at the interior of the rectangular accommodating chamber is smaller than air pressure outside the modularized housing.

Assignments (6)
SECURITY INTEREST Recorded Jan 20, 2026
From: SUPER MICRO COMPUTER, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 074447/0643 →
RELEASE OF SECURITY INTEREST Recorded Nov 22, 2024
From: BANK OF AMERICA, N.A., AS AGENT
To: SUPER MICRO COMPUTER, INC.
Reel/Frame 069436/0469 →
SECURITY INTEREST Recorded Apr 27, 2018
From: SUPER MICRO COMPUTER, INC
To: BANK OF AMERICA, N.A, AS ADMINSTRATIVE AGENT
Reel/Frame 046029/0940 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 7, 2006
From: LIANG, STEVE CHIEN-FA
To: SUPER MICRO COMPUTER INC.
Reel/Frame 018218/0375 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 24, 2006
From: ABLECOM TECHNOLOGY, INC.
To: SUPER MICRO COMPUTER, INC.
Reel/Frame 018168/0031 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 14, 2006
From: LIANG, CHIEN-FA
To: SUPER MICRO COMPUTER, INC.; ABLECOM TECHNOLOGY INC.
Reel/Frame 017576/0433 →
Continuity (1)
Related Publication 20070187126A1 · Aug 16, 2007