Etched leadframe for reducing metal gaps
A leadframe is disclosed having an unreduced leadframe thickness. The leadframe includes a portion of reduced thickness. The portion of reduced thickness can be created by a subtractive process, such as an etching process. The leadframe further includes a gap located within the portion of reduced thickness. The gap is located between metal portions of the leadframe and extends through at least a portion of the reduced thickness. The width of the gap can be less than the unreduced leadframe thickness as a result of the portion of reduced thickness.
1 . A leadframe comprising:
a portion of the leadframe having an unreduced leadframe thickness;
a portion of the leadframe having a reduced thickness that is thinner than the unreduced leadframe thickness; and
a gap located within the portion of reduced thickness, the gap being located between metal portions of the leadframe and extending through at least a portion of the reduced thickness, the width of the gap being less than the unreduced leadframe thickness.
2 . The leadframe of claim 1 , wherein the gap width is less than the unreduced leadframe thickness but greater than the reduced thickness.
3 . The leadframe of claim 1 , wherein the portion of reduced thickness is produced in the leadframe by an etching process.
4 . The leadframe of claim 1 , wherein the portion of reduced thickness is about half the thickness of the unreduced leadframe thickness.
5 . The leadframe of claim 1 , wherein the portion of reduced thickness has a substantially square, rectangular, circular, elliptical, or non-uniform shape.
6 . The leadframe of claim 1 , wherein the portion of reduced thickness has a non-uniform thickness across the portion of reduced thickness.
7 . The leadframe of claim 1 , wherein a gap having the gap width in the portion of unreduced leadframe thickness violates an operating or manufacturing constraint of the leadframe.
8 . The leadframe of claim 7 , wherein the operating constraint is a mechanical support for a component supported by the leadframe.
9 . An electronic component comprising:
the leadframe of claim 1; and
a circuit supported by the leadframe.
10 . An electronic component comprising:
a circuit coupled to a leadframe; and
the leadframe configured to support the circuit and further configured to electrically couple the circuit to a printed circuit board, the leadframe having an unreduced leadframe thickness, the leadframe including a portion of reduced thickness having a thickness less than the unreduced leadframe thickness, the leadframe further including a gap in the portion of reduced thickness, the gap having a width that is less than the unreduced leadframe thickness.
11 . An electronic component according to claim 10 , further comprising:
a plurality of portions of reduced thickness, each of the plurality of portions of reduced thickness including at least one gap, wherein the gaps each have a width less than the unreduced leadframe thickness.
12 . A method for fabricating a leadframe, the method comprising:
providing a metal leadframe having an unreduced leadframe thickness;
producing a portion of reduced thickness in the leadframe; and
producing a gap in the portion of reduced thickness, the gap having a width less than the unreduced leadframe thickness.
13 . The method of claim 12 , wherein the portions of reduced thickness are produced by an etching process.
14 . The method of claim 12 , wherein the gaps have a width greater than the reduced thickness but less than the unreduced leadframe thickness.
15 . The method of claim 12 , wherein the portion of reduced thickness has a substantially square, rectangular, circular, elliptical, or non-uniform shape.
16 . The method of claim 12 , wherein the portion of reduced thickness has a non-uniform thickness across the portion of reduced thickness.
17 . The method of claim 12 , wherein the gap width is less than a functional gap width at the unreduced leadframe thickness.
18 . The method of claim 12 , wherein the width of the gap violates an operating constraint of the leadframe if not for the portion of reduced thickness.
19 . A method for fabricating an electrical component, the method comprising:
manufacturing a leadframe according to claim 12; and
attaching a circuit to the leadframe.
20 . A method according to claim 19 , wherein the leadframe is produced using a subtractive manufacturing process and the circuit is attached to the leadframe using die attach.