IP Library Granted Patent US 7,234,358
Granted Patent B2
US 7,234,358 · App. 11/354,959 · Granted Jun 26, 2007

Pressure detecting apparatus

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Quick Facts
Patent No.
US 7,234,358
App. No.
11/354,959
Granted
Jun 26, 2007
Kind
B2
Abstract

A pressure detecting apparatus has a pressure detecting device that converts a strain caused by a stress exerted thereto to an electrical signal, and outputs the converted electrical signal. The apparatus has a housing base including a housing recess that houses the pressure detecting device therein, and a connecting material interposed between the pressure detecting device and the housing recess. The connecting material connects the pressure detecting device and the housing recess with a tensile elongation percentage of about 400% or higher. The pressure detecting apparatus facilitates preventing thermal stress from adversely affecting the detection performance thereof, and produces excellent thermal response.

Claims (11)

1. A pressure detecting apparatus comprising:

a pressure detector for converting a strain induced by a stress exerted thereto to an electrical signal, and for outputting the electrical signal;

a base comprising a housing for accommodating the pressure detector therein; and

a connector, interposed between the pressure detector and the housing, for connecting the pressure detector and the housing, said connector having a tensile elongation percentage of 400% or higher.

2. The pressure detecting apparatus according to claim 1 , wherein the pressure detector comprises a semiconductor.

3. The pressure detecting apparatus according to claim 1 , wherein the base comprises a resin molding.

4. The pressure detecting apparatus according to claim 1 , wherein the connector comprises a silicone resin adhesive.

5. The pressure detecting apparatus according to claim 1 , wherein the connector is provided such that a distance between a bonding plane of the pressure detector and a bonding plane of the housing is from 30μm to 100μm.

6. The pressure detecting apparatus according to claim 1 , wherein said pressure detector comprises a pedestal, a semiconductor substrate disposed on the pedestal, and a diaphragm attached to the semiconductor substrate, said connector being arranged between bottoms of the pedestal and housing of the base.

7. The pressure detecting apparatus according to claim 6 , wherein said base further includes a plurality of protrusions projecting upwardly from the bottom of the housing to receive the pedestal thereon.

8. The pressure detecting apparatus according to claim 7 , further comprising a protecting material for covering on and around the pressure detector.

Assignments (3)
MERGER AND CHANGE OF NAME Recorded Aug 26, 2011
From: FUJI ELECTRIC SYSTEMS CO., LTD. (FES); FUJI TECHNOSURVEY CO., LTD. (MERGER BY ABSORPTION)
To: FUJI ELECTRIC CO., LTD.
Reel/Frame 026970/0872 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 20, 2010
From: FUJI ELECTRIC DEVICE TECHNOLOGY CO., LTD.
To: FUJI ELECTRIC SYSTEMS CO., LTD.
Reel/Frame 024252/0438 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 7, 2006
From: SAITO, KAZUNORI; ICHIMURA, YUJI; YAMAGUCHI, KEI; UEYANAGI, KATSUMICHI; SHINODA, SHIGERU
To: FUJI ELECTRIC DEVICE TECHNOLOGY CO., LTD
Reel/Frame 017771/0847 →