Piezoelectric inkjet printhead and method of manufacturing the same
View Patent ↗A piezoelectric inkjet printhead, and a method of manufacturing the same, includes an ink inlet for allowing inflow of ink, a plurality of pressure chambers to contain ink to be ejected, the plurality of pressure chambers being in communication with the ink inlet, a manifold formed in communication with the ink inlet, a plurality of restrictors connecting the manifold to respective first ends of the pressure chambers, a plurality of dampers at positions corresponding to respective second ends of the pressure chambers, the second ends being opposite the first ends, a plurality of nozzles in communication with the plurality of dampers for ejecting the ink, a plurality of actuators for applying a driving force to each of the pressure chambers for ejecting the ink, a damping membrane under the manifold for dampening a pressure change inside the manifold and a cavity under the damping membrane.
1. A piezoelectric inkjet printhead, comprising:
an ink inlet for allowing inflow of ink;
a plurality of pressure chambers to contain ink to be ejected, the plurality of pressure chambers being in communication with the ink inlet;
a manifold formed in communication with the ink inlet;
a plurality of restrictors connecting the manifold to respective first ends of the pressure chambers;
a plurality of dampers at positions corresponding to respective second ends of the pressure chambers, the second ends being opposite the first ends;
a plurality of nozzles in communication with the plurality of dampers for ejecting the ink;
a plurality of actuators for applying a driving force to each of the pressure chambers for ejecting the ink;
a damping membrane under the manifold for dampening a pressure change inside the manifold;
a cavity under the damping membrane; and
a supporting rib in the cavity along a length direction of the cavity.
2. The piezoelectric inkjet printhead as claimed in claim 1 , wherein the damping membrane has a thickness of about 10 μm to about 20 μm.
3. The piezoelectric inkjet printhead as claimed in claim 1 , wherein the cavity extends to an edge of the printhead.
4. The piezoelectric inkjet printhead as claimed in claim 3 , wherein the cavity is in communication with an ambient atmosphere.
5. The piezoelectric inkjet printhead as claimed in claim 4 , wherein:
the printhead has an opening in the edge thereof, and
the opening couples the cavity to the ambient atmosphere.
6. The piezoelectric inkjet printhead as claimed in claim 1 , wherein the cavity has substantially the same width as the manifold.
7. The piezoelectric inkjet printhead as claimed in claim 1 , wherein the cavity has a width larger than the manifold.
8. The piezoelectric inkjet printhead as claimed in claim 1 , wherein:
the ink inlet and the plurality of pressure chambers are in an upper substrate,
the manifold, the plurality of restrictors, the plurality of dampers and the damping membrane are in a middle substrate, the plurality of nozzles are in a lower substrate, and
the cavity is in at least one of a bottom surface of the middle substrate and a top surface of the lower substrate.
9. The piezoelectric inkjet printhead as claimed in claim 8 , wherein the cavity extends to an edge of the at least one of the bottom surface of the middle substrate and the top surface of the lower substrate.
10. The piezoelectric inkjet printhead as claimed in claim 8 , wherein a full extent of the cavity is defined in one of the middle substrate and the lower substrate.
11. The piezoelectric inkjet printhead as claimed in claim 1 , further comprising:
a barrier rib in the manifold along a length direction of the manifold in correspondence with the supporting rib.
12. The piezoelectric inkjet printhead as claimed in claim 1 , wherein the supporting rib in the cavity is in contact with the damping membrane.
13. A piezoelectric inkjet printhead, comprising:
an ink inlet for allowing inflow of ink;
a plurality of pressure chambers to contain ink to be ejected, the plurality of pressure chambers being in communication with the ink inlet;
a manifold formed in communication with the ink inlet;
a barrier rib in the manifold along a length direction of the manifold;
a plurality of restrictors connecting the manifold to respective first ends of the pressure chambers;
a plurality of dampers at positions corresponding to respective second ends of the pressure chambers, the second ends being opposite the first ends;
a plurality of nozzles in communication with the plurality of dampers for ejecting the ink;
a plurality of actuators for applying a driving force to each of the pressure chambers for ejecting the ink; and
means for dampening a pressure change inside the manifold including a cavity and a supporting rib in the cavity along a length direction of the cavity in correspondence with the barrier rib.
14. The piezoelectric inkjet printhead as claimed in claim 13 , wherein the means for dampening comprises:
a damping membrane under the manifold;
wherein the cavity is located under the damping membrane.
15. The piezoelectric inkjet printhead as claimed in claim 14 , wherein the supporting rib in the cavity is in contact with the damping membrane.
16. The piezoelectric inkjet printhead as claimed in claim 13 , wherein the cavity is in communication with an ambient atmosphere.
17. The piezoelectric inkjet printhead as claimed in claim 16 , wherein:
the printhead has an opening in an edge thereof, and
the opening couples the cavity to the ambient atmosphere.
18. A method of manufacturing a piezoelectric inkjet printhead, comprising:
forming an ink inlet allowing inflow of ink;
forming a plurality of pressure chambers to contain ink to be ejected;
forming a manifold in communication with the ink inlet;
forming a plurality of restrictors connecting the manifold to respective first ends of the pressure chambers;
forming a plurality of dampers at positions corresponding to respective second ends of the pressure chambers, the second ends being opposite the first ends;
forming a damping membrane under the manifold for dampening pressure change inside the manifold;
forming a cavity under the damping membrane;
forming a supporting rib in the cavity along a length direction of the cavity;
forming a plurality of nozzles for ejecting the ink; and
forming a plurality of piezoelectric actuators for providing a driving force for ejecting the ink.
19. The method as claimed in claim 18 , wherein the damping membrane has a thickness of about 10 μm to about 20 μm.
20. The method as claimed in claim 18 , wherein the cavity extends to an edge of the printhead.
21. The method as claimed in claim 20 , wherein the cavity is in communication with an ambient atmosphere.
22. The method as claimed in claim 21 , wherein:
the printhead is formed with an opening in the edge thereof, and
the opening couples the cavity to the ambient atmosphere.
23. The method as claimed in claim 18 , wherein the cavity has substantially the same width as the manifold.
24. The method as claimed in claim 18 , wherein the cavity has a width larger than the manifold.
25. The method as claimed in claim 18 , further comprising:
forming a barrier rib in the manifold along a length direction of the manifold in correspondence with the supporting rib.
26. The method as claimed in claim 18 , wherein:
forming the ink inlet and the plurality of pressure chambers includes processing an upper silicon substrate,
forming the manifold, the plurality of restrictors, the plurality of dampers and the damping membrane includes processing a middle silicon substrate,
forming the plurality of nozzles includes processing a lower silicon substrate, and
forming the cavity includes processing at least one of the middle and lower substrates.
27. The method as claimed in claim 26 , wherein each of processing of the middle substrate and processing of the lower substrate comprises forming an aligning mark for using the aligning mark as an aligning reference in stacking and bonding the lower substrate and the middle substrate, and
the cavity is simultaneously formed with the aligning mark in at least one of the middle substrate and the lower substrate.
28. The method as claimed in claim 27 , wherein forming the cavity and the aligning mark comprises:
forming a silicon oxide layer on at least one surface of the bottom surface of the middle substrate and the top surface of the lower substrate;
forming a photoresist on the silicon oxide layer and patterning the photoresist to form openings for the cavity and the aligning mark;
etching the silicon oxide layer exposed through the openings to expose the at least one surface; and
etching the at least one surface exposed by the etching of the silicon oxide layer to a predetermined depth to form the cavity and the aligning mark.
29. The method as claimed in claim 18 , wherein the supporting rib in the cavity is in contact with the damping membrane.
30. A method of manufacturing a piezoelectric inkjet printhead, comprising:
providing lower, middle and upper silicon substrates;
processing the upper silicon substrate including the following,
forming an ink inlet allowing inflow of ink, and
forming a plurality of pressure chambers to contain ink to be ejected;
processing the middle silicon substrate including the following,
forming a manifold in communication with the ink inlet,
forming a plurality of restrictors connecting the manifold to respective first ends of the pressure chambers,
forming a plurality of dampers at positions corresponding to respective second ends of the pressure chambers, the second ends being opposite the first ends, and
forming a damping membrane under the manifold for dampening pressure change inside the manifold;
processing the lower silicon substrate including forming a plurality of nozzles for ejecting the ink;
processing at least one of the middle substrate and the lower substrate including forming a cavity under the damping membrane; and
forming a plurality of piezoelectric actuators for providing a driving force for ejecting the ink;
wherein forming the cavity includes the following,
forming a silicon oxide layer on at least one surface of a bottom surface of the middle substrate and a top surface of the lower substrate,
forming a photoresist on the silicon oxide layer and patterning the photoresist to form an opening for the cavity,
etching the silicon oxide layer exposed through the opening to expose the at least one surface, and
etching the at least one surface exposed by the etching of the silicon oxide layer to a predetermined depth to form the cavity.