IP Library Granted Patent US 8,305,507
Granted Patent B2
US 8,305,507 · App. 11/356,853 · Granted Nov 6, 2012

Thin film transistor array panel having improved storage capacitance and manufacturing method thereof

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Quick Facts
Patent No.
US 8,305,507
App. No.
11/356,853
Granted
Nov 6, 2012
Kind
B2
Abstract

A thin film transistor array panel is provided, which includes a gate line, a data line intersecting the gate line, a storage electrode apart from the gate and data lines, a thin film transistor connected to the gate and data lines and having a drain electrode, a pixel electrode connected to the drain electrode, a first insulating layer over the thin film transistor and disposed under the pixel electrode, and a second insulating layer disposed on the first insulating layer and having an opening exposing the first insulating layer on the storage electrode.

Claims (39)

1. A thin film transistor array panel, comprising:

a gate line;

a data line intersecting the gate line;

a storage electrode apart from the gate line and the data line;

a semiconductor disposed under the storage electrode and contacting the storage electrode;

a thin film transistor connected to the gate line and the data line and having a drain electrode formed of the same layer as the storage electrode;

a pixel electrode connected to the drain electrode and electrically separated from the storage electrode;

a first insulating layer over the storage electrode and the drain electrode and disposed under the pixel electrode;

a second insulating layer disposed on the first insulating layer, and having an opening exposing the first insulating layer on the storage electrode,

a shielding electrode disposed in the same layer as the pixel electrode and transmitting a common voltage, the shielding electrode contacting the storage electrode,

wherein the shielding electrode comprises a first portion extending along the data line and covering the data line.

2. The thin film transistor array panel of claim 1 , wherein the first insulating layer is made of inorganic material.

3. The thin film transistor array panel of claim 2 , wherein the second insulating layer is made of organic material.

4. The thin film transistor array panel of claim 1 , wherein the shielding electrode and the pixel electrode are disposed on the first insulating layer and the second insulating layer.

5. The thin film transistor array panel of claim 1 , wherein the shielding electrode is extended to the data line.

6. The thin film transistor array panel of claim 5 , wherein the shielding electrode completely covers the boundaries of the data line.

7. The thin film transistor array panel of claim 1 , wherein the shielding electrode overlaps at least a portion of the gate line.

8. The thin film transistor array panel of claim 7 , wherein the shielding electrode is extended to the data line and the gate line.

9. The thin film transistor array panel of claim 8 , wherein the width of the shielding electrode is larger than that of the data line and smaller than that of the gate line.

10. A thin film transistor array panel, comprising:

a gate line formed on an insulating substrate;

a gate insulating layer formed on the gate line;

a first semiconductor formed on the gate insulating layer;

a data line and a drain electrode formed on the first semiconductor, the data line and the drain electrode being separate from each other;

a storage conductor formed on the gate insulating layer and formed of the same layer as the drain electrode;

a second semiconductor made at the same layer as the first semiconductor and disposed under the storage conductor and contacting the storage conductor;

a first passivation layer formed on the storage conductor, the data line, and the drain electrode;

a second passivation layer formed on the first passivation layer and having an opening exposing the first passivation layer corresponding to the storage conductor;

a pixel electrode connected to the drain electrode and overlapping the storage conductor via the first passivation layer in the opening;

a shielding electrode disposed in the same layer as the pixel electrode and transmitting a common voltage, the shielding electrode contacting the storage electrode,

wherein the shielding electrode comprises a first portion extending along the data line and covering the data line.

11. The thin film transistor array panel of claim 10 , wherein the first passivation layer is thinner than the second passivation layer.

12. The thin film transistor array panel of claim 10 , wherein the first passivation layer includes inorganic material or the second passivation layer includes organic material.

13. The thin film transistor array panel of claim 10 , wherein the first semiconductor, except for a portion between the data line and the drain electrode, has the same plane shape as the data line and the drain electrode.

14. The thin film transistor array panel of claim 10 , wherein the first semiconductor is made of amorphous silicon.

15. The thin film transistor array panel of claim 10 , wherein the shielding electrode is formed on the second passivation layer and overlaps at least a portion of the gate line and the data line.

16. The thin film transistor array panel of claim 15 , wherein the first passivation layer and the second passivation layer have a contact hole exposing the storage conductor, and the storage conductor is connected to the shielding electrode through the contact hole.

17. The thin film transistor array panel of claim 1 , wherein the shielding electrode includes a protrusion portion having a shape, in a plan view, that protrudes away from the data line and ends over a portion of the storage conductor with a space between the protrusion portion and the gate lines on each side.

18. The thin film transistor array panel of claim 10 , wherein the shielding electrode includes a protrusion portion having a shape, in a plan view, that protrudes away from the data line and ends over a portion of the storage conductor with a space between the protrusion portion and the gate lines on each side.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 21, 2022
From: SAMSUNG DISPLAY CO., LTD.
To: TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
Reel/Frame 060778/0487 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 22, 2012
From: SAMSUNG ELECTRONICS CO., LTD.
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 029008/0339 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 17, 2006
From: RYU, HYE-YOUNG; KIM, JANG-SOO; KIM, SANG-GAB; CHIN, HONG-KEE; OH, MIN-SEOK; CHOE, HEE-HWAN; KIM, SHI-YUL
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 017620/0482 →