IP Library Granted Patent US 7,227,784
Granted Patent B2
US 7,227,784 · App. 11/358,206 · Granted Jun 5, 2007

Nonvolatile semiconductor memory device performing erase operation that creates narrow threshold distribution

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Quick Facts
Patent No.
US 7,227,784
App. No.
11/358,206
Granted
Jun 5, 2007
Kind
B2
Abstract

A nonvolatile semiconductor memory device includes a control circuit configured to perform a first block erase operation that erases nonvolatile memory cells together in a lump such that threshold voltages of the memory cells are set lower than a first erase verify voltage, to check whether a threshold voltage of each of the nonvolatile memory cells is lower than a first erase-degree-check voltage after the first block erase operation, to perform a first write-back operation in response to a check result indicating that the threshold voltage is lower than the first erase-degree-check voltage, thereby raising the threshold voltage above a voltage higher than the first erase-degree-check voltage, and to perform a second block erase operation that erases the nonvolatile memory cells together in a lump after the first write-back operation such that the threshold voltages of the memory cells are set lower than a second erase verify voltage.

Claims (26)

1. A nonvolatile semiconductor memory device, comprising:

a plurality of nonvolatile memory cells constituting an entirety or part of a memory cell array; and

a control circuit configured to perform a first block erase operation that erases the plurality of nonvolatile memory cells together in a lump such that threshold voltages of the memory cells are set lower than a first erase verify voltage, to perform a first erase-degree check as to whether a threshold voltage of each of the nonvolatile memory cells is lower than a first erase-degree-check voltage after the first block erase operation, to perform a first write-back operation in response to a check result indicating that the threshold voltage is lower than the first erase-degree-check voltage, the first write-back operation raising the threshold voltage above a first write-back-verify voltage that is higher than the first erase-degree-check voltage, and to perform a second block erase operation that erases the plurality of nonvolatile memory cells together in a lump after the first write-back operation such that the threshold voltages of the memory cells are set lower than a second erase verify voltage.

2. The nonvolatile semiconductor memory device as claimed in claim 1 , further comprising:

a first-erase-operation-purpose reference cell for comparison with the nonvolatile memory cells in a first erase verify operation accompanying the first block erase operation;

a first-erase-degree-check-purpose reference cell for comparison with the nonvolatile memory cells in the first erase-degree check; and

a second-erase-operation-purpose reference cell for comparison with the nonvolatile memory cells in a second erase verify operation accompanying the second block erase operation,

wherein the second-erase-operation-purpose reference cell has a threshold voltage lower than that of the first-erase-operation-purpose reference cell.

3. The nonvolatile semiconductor memory device as claimed in claim 2 , further comprising a first-write-back-verify-purpose reference cell for comparison with the nonvolatile memory cells in a first write-back verify operation accompanying the first write-back operation, wherein the first-write-back-verify-purpose reference cell has a threshold voltage higher than that of the first-erase-operation-purpose reference cell.

4. The nonvolatile semiconductor memory device as claimed in claim 1 , wherein the control circuit is configured to perform a preliminary write operation to write memory cells that are in an erased state among the plurality of nonvolatile memory cells before the first block erase operation.

5. The nonvolatile semiconductor memory device as claimed in claim 4 , further comprising:

a write-verify-purpose reference cell for comparison with the nonvolatile memory cells in a write-verify operation accompanying the preliminary write operation; and

a first-write-back-verify-purpose reference cell for comparison with the nonvolatile memory cells in a first write-back verify operation accompanying the first write-back operation,

wherein the first-write-back-verify-purpose reference cell has a threshold voltage lower than that of the write-verify-purpose reference cell.

6. The nonvolatile semiconductor memory device as claimed in claim 1 , wherein a preparatory operation inclusive of the first erase-degree check and the first write-back operation is performed more than once, said nonvolatile semiconductor memory device further including a plurality of erase-degree-check-purpose reference cells and a plurality of write-back-verify-purpose reference cells for comparison with the nonvolatile memory cells in a plurality of erase-degree checks and a plurality of write-back operations included in the plurality of preparatory operations, the plurality of erase-degree-check-purpose reference cells having respective different threshold voltages, and the plurality of write-back-verify-purpose reference cells having respective different threshold voltages.

7. A nonvolatile semiconductor memory device, comprising:

a plurality of nonvolatile memory cells constituting an entirety or part of a memory cell array; and

a control circuit configured to perform a first block erase operation that erases the plurality of nonvolatile memory cells together in a lump such that threshold voltages of the memory cells are set lower than a first erase verify voltage, to perform a first erase-degree check as to whether a threshold voltage of each of the nonvolatile memory cells is lower than a first erase-degree-check voltage after the first block erase operation, to perform a first write-back operation in response to a check result indicating that the threshold voltage is lower than the first erase-degree-check voltage, the first write-back operation raising the threshold voltage above a first write-back-verify voltage, to perform a second erase-degree check as to whether a threshold voltage of each of the nonvolatile memory cells is lower than a second erase-degree-check voltage after the first write-back operation, to perform a second write-back operation in response to a check result indicating that the threshold voltage is lower than the second erase-degree-check voltage, the second write-back operation raising the threshold voltage above a second write-back-verify voltage, and to perform a second block erase operation that erases the plurality of nonvolatile memory cells together in a lump after the second write-back operation such that the threshold voltages of the memory cells are set lower than a second erase verify voltage,

wherein the second erase-degree-check voltage is higher than the first erase-degree-check voltage, the second write-back-verify voltage being higher than the second erase-degree-check voltage, and the first write-back-verify voltage being higher than the second write-back-verify voltage.

8. A method of erasing nonvolatile memory cells in a nonvolatile semiconductor memory device in which a plurality of nonvolatile memory cells constituting an entirety or part of a memory cell array are erased together in a lump, comprising:

a first block erase step of erasing the plurality of nonvolatile memory cells together in a lump;

a check step of checking whether a threshold voltage of each of the nonvolatile memory cells is lower than a predetermined voltage after the first block erase step;

a write-back step of raising the threshold voltage above the predetermined voltage of the check step with respect to the nonvolatile memory cells having the threshold voltages lower than the predetermined voltage in accordance with a check result of the check step; and

a second block erase step of erasing the plurality of nonvolatile memory cells together in a lump after the write-back step.

9. The method as claimed in claim 8 , wherein the first block erase step includes a first erase verify step of ensuring that the threshold voltages of all the nonvolatile memory cells are lower than a first threshold voltage, and the second block erase step includes a second erase verify step of ensuring that the threshold voltages of all the nonvolatile memory cells are lower than a second threshold voltage, the second threshold voltage being lower than the first threshold voltage.

10. The method as claimed in claim 8 , further comprising a preliminary write step of writing memory cells that are in an erased state among the plurality of nonvolatile memory cells before the first block erase step, wherein a write verify reference voltage used in a write-verify operation accompanying the preliminary write step being different from a write verify reference voltage used in a write-back-verify operation accompanying the write back step.

Assignments (10)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 15, 2022
From: CYPRESS SEMICONDUCTOR CORPORATION
To: INFINEON TECHNOLOGIES LLC
Reel/Frame 059721/0467 →
RELEASE OF SECURITY INTEREST Recorded Mar 16, 2022
From: MUFG UNION BANK, N.A.
To: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
Reel/Frame 059410/0438 →
CORRECTIVE ASSIGNMENT TO CORRECT THE 8647899 PREVIOUSLY RECORDED ON REEL 035240 FRAME 0429. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTERST. Recorded Nov 3, 2020
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 058002/0470 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN INTELLECTUAL PROPERTY Recorded Oct 28, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: MUFG UNION BANK, N.A.
Reel/Frame 050896/0366 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 30, 2015
From: SPANSION, LLC
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 036038/0620 →
SECURITY INTEREST Recorded Mar 21, 2015
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 035240/0429 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 11, 2013
From: FUJITSU SEMICONDUCTOR LIMITED
To: SPANSION LLC
Reel/Frame 031205/0461 →
CHANGE OF NAME Recorded Jul 22, 2010
From: FUJITSU MICROELECTRONICS LIMITED
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 024982/0245 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 12, 2008
From: FUJITSU LIMITED
To: FUJITSU MICROELECTRONICS LIMITED
Reel/Frame 021998/0645 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 22, 2006
From: TAKEGUCHI, TETSUJI
To: FUJITSU LIMITED
Reel/Frame 017601/0095 →