Apparatus for dissipating heat from electronic components in an enclosed housing
View Patent ↗An electronic device includes a housing configured to enclose an electronic component mounted to an inner portion of the housing. A thermally conductive gap-filler is in thermal contact with the electronic component. A heat sink is in thermal contact with the thermally conductive gap-filler and a thermally conductive plate is in thermal contact, at a first side, with the heat sink through an opening in the housing, and affixed, at the first side, to an outer portion of the housing surrounding the opening.
1. An electronic device, comprising:
a housing configured to enclose an electronic component mounted to an inner portion of the housing;
a thermally conductive gap-filler in thermal contact with the electronic component, wherein the gap-filler is a thermally conductive elastomeric material;
a heat sink in thermal contact with the thermally conductive gap-filler; and
a thermally conductive plate in thermal contact, at a first side, with the heat sink through an opening in the housing, and affixed, at the first side, to an outer portion of the housing surrounding the opening.
2. The electronic device of claim 1 , further comprising:
an insulating material affixed to a second side of the thermally conductive plate.
3. The electronic device of claim 1 , wherein the electronic component is mounted directly to a bottom side of the inner portion of the housing.
4. The electronic device of claim 1 , wherein the electronic component is mounted to another component enclosed within the housing.
5. The electronic device of claim 4 , wherein the another component is a circuit board.
6. The electronic device of claim 1 , wherein a compressive force provides the thermal contact between the electronic component and the gap-filler and between the gap filler and the heat sink.
7. The electronic device of claim 6 , wherein the gap filler is capable of distorting upon receiving the compressive force.
8. The electronic device of claim 1 , further comprising:
an adhesive material between the electronic component and the gap filler.
9. The electronic device of claim 1 further comprising:
an adhesive material between the gap filler and the heat sink.
10. The electronic device of claim 1 , wherein the thermally conductive plate covers the entire opening.
11. The electronic device of claim 2 , wherein the insulating material is a label for identifying the electronic device.
12. The electronic device of claim 1 , wherein the electronic device is a telephone.
13. The electronic device of claim 11 , wherein the electronic component is an integrated Ethernet switch capable of operating at Gigabit Ethernet (GbE) speeds.
14. The electronic device of claim 1 , wherein the electronic component is a PHY.
15. The electronic device of claim 13 , wherein the electronic component is a combination of a PHY and an integrated Ethernet switch.
16. The electronic device of claim 11 , wherein the housing further comprises:
a first housing part; and
a second housing part configured to couple the first housing part to enclose the electronic component.
17. The electronic device of claim 16 , wherein the first housing part is a top part of a base of a telephone and the second housing part is a bottom part of the base.
18. The electronic device of claim 16 , wherein each of the first and second housing parts includes an inner portion and an outer portion, and further comprising:
a user interface on the outer portion of the first housing part; and wherein the opening is in the second housing part.
19. The electronic device of claim 1 , wherein the heat sink is a passive heat sink.
20. The electronic device of claim 1 , wherein the thermally conductive plate is an aluminum plate.
21. The electronic device of claim 1 , wherein the thermally conductive elastomeric material includes a woven glass fiber web, dielectric film or aluminum foil substrate coated with a silicone based emulsion that has been impregnated with thermally conductive particles.