Active matrix structure for a display device and method for its manufacture
View Patent ↗The invention relates to an active matrix structure and method for manufacturing the active matrix structure for a display device, wherein the structure includes: providing a matrix substrate with a number of row lines and a number of column lines, with each point of intersection between one of the row lines and one of the column lines being assigned a passage through the matrix substrate for generating a pixel, depositing a layer of p-silicon on the matrix substrate, for each pixel, creating an n + -doped region in the p-silicon, which n + -doped region is provided from the passage as far as a free surface of the p-silicon layer, and creating a p + -doped region within the n + -doped region such that a layer of the n + -doped region remains, and applying a layer made of a matrix material which has particles of electronic ink contained therein, or an organic light-emitting diode layer on a free surface of the final structure resulting from step c).
1. A method for forming an active matrix structure, comprising the steps of:
a) providing a matrix substrate with a plurality of row lines and column lines and creating passages through the matrix substrate, each passage defining a center of a pixel area wherein each passage connects to a row line in between adjacent column lines;
b) depositing a layer of p-silicon on the matrix substrate;
c) creating an n + -doped region for each pixel area in the p-silicon, wherein said n + -doped region is provided from the passage as far as a free surface of said layer of p-silicon, and creating a p + -doped region within said n + -doped region such that a layer of said n + -doped region remains and said p + -doped region reaches a free surface of said n + -doped region; and
d) applying a layer made of a matrix material which has particles of electronic ink contained therein, or an organic light-emitting diode layer on free surfaces of said layer of p- silicon and said n + -doped and said p + -doped regions.
2. The method as claimed in claim 1 , wherein said steps c) and d) are performed by means of ion implantation and subsequent laser annealing.
3. The method as claimed in claim 1 , wherein said layer made of matrix material in said step d) is laminated onto said free surfaces.
4. A method for forming an active matrix structure, comprising the steps of:
a) providing a substrate with at least one row line and at least one column line and creating a plurality of passages through the substrate to at least one row line each passage being located in between two adjacent column lines wherein each passage defines a center of a pixel area;
b) depositing a layer of p-silicon on the substrate;
c) creating an n + -doped region for each pixel area in the layer of p-silicon, wherein said n + -doped region extends from the passage to a surface of said layer of p-silicon, and creating a p + -doped region within said n + -doped region such that a layer of said n + -doped region remains and said p + -doped region reaches the surface of said n + -doped region; and
d) depositing a layer made of a material which has particles of electronic ink contained therein, or an organic light-emitting diode layer on said surface of said layer of p-silicon and said n + -doped and said p + -doped regions.
5. The method as claimed in claim 4 , wherein said steps c) and d) are performed by means of ion implantation and subsequent laser annealing.
6. The method as claimed in claim 4 , wherein the step of depositing a layer made of a material in said step d) comprises laminating said layer onto said surface.
7. The method as claimed in claim 1 , wherein said passage is filled with a material such that a resistance between 1 kΩ and 10 kΩ is obtained.
8. The method as claimed in claim 4 , wherein said passage is filled with a material such that a resistance between 1 kΩ and 10 kΩ is obtained.
9. A method for forming an active matrix structure having a plurality of pixel areas, comprising the steps of:
a) providing a matrix substrate with a plurality of row lines and column lines and
creating passages through the matrix substrate above each row line in between adjacent column lines;
b) depositing a layer of p-silicon on the matrix substrate;
c) creating an n + -doped region for each pixel area in the p-silicon, wherein said n + -doped region is provided from the passage as far as a free surface of said layer of p-silicon, and creating a p + -doped region within said n + -doped region such that a layer of said n + -doped region remains and said p + -doped region reaches a free surface of said n + -doped region; and
d) applying a layer made of a matrix material which has particles of electronic ink contained therein, or an organic light-emitting diode layer on free surfaces of said layer of p-silicon and said n + -doped and said p + -doped regions.
10. The method as claimed in claim 9 , wherein said steps c) and d) are performed by means of ion implantation and subsequent laser annealing.
11. The method as claimed in claim 9 , wherein said layer made of matrix material in said step d) is laminated onto said free surfaces.
12. The method as claimed in claim 9 , wherein said passage is filled with a material such that a resistance between 1 kΩ and 10 kΩ is obtained.