Thermal and intrinsic stress compensated micromirror apparatus and method
View Patent ↗A micromirror apparatus includes a device layer having a recess, a multilayer thin-film dielectric reflector coupled to and structurally supported by the device layer on the opposite side of the device layer from said recess, and a stress compensator seated in the recess, with the stress compensator operable to resist device layer bending moments resulting from intrinsic and thermal mismatch stresses between the multilayer thin-film dielectric reflector and the device layer.
1. A micromirror apparatus, comprising:
a device layer having a recess;
a multilayer thin-film dielectric reflector coupled to and structurally supported by said device layer on the opposite side of said device layer from said recess;
a stress compensator seated in said recess, said stress compensator operable to resist device layer bending moments resulting from intrinsic and thermal mismatch stresses between said multilayer thin-film dielectric reflector and said device layer.
2. The apparatus according to claim 1 , wherein said stress compensator comprises a second multilayer thin-film dielectric reflector.
3. The apparatus according to claim 1 , further comprising:
a flexure extending from said device layer.
4. The apparatus according to claim 3 , wherein said flexure comprises a thinned extension of said device layer.
5. The apparatus according to claim 3 , further comprising:
a mechanical support connected to said flexure, said flexure enabling movement of said device layer relative to said mechanical support.
6. The apparatus according to claim 5 , further comprising:
a support column coupled to said mechanical support;
a supporting substrate coupled to said support column, said supporting substrate spaced adjacent to said stress compensator.
7. The apparatus according to claim 6 , wherein said supporting substrate comprises and a first electrode.
8. The apparatus according to claim 7 , wherein said device layer comprises a second electrode, so that application of a voltage differential between said first and second electrodes results in movement of said multilayer thin-film dielectric reflector.
9. The apparatus according to claim 6 , wherein said support column comprises gold (Au).
10. The apparatus according to claim 1 , wherein said device layer comprises an electrode.
11. The apparatus according to claim 1 , wherein said device layer comprises a material selected from the group consisting of single-crystal silicon and polysilicon.
12. A micromirror apparatus, comprising:
a device layer having a recess;
first and second multilayer thin-film dielectric reflectors carried on opposite sides of said device layer, said second multilayer thin-film dielectric reflector seated in said recess in said device layer and having a common linear thermal expansion coefficient with said first multilayer thin-film dielectric reflector to reduce warping of said device layer in response to intrinsic and thermal mismatch stresses between said first multilayer thin-film dielectric reflector and said device layer.
13. The apparatus according to claim 12 , further comprising a flexure extending from said device layer.
14. The apparatus according to claim 13 , further comprising:
a flexure support connected by said flexure to said device layer, said flexure enabling movement of said device layer relative to said flexure support.
15. The apparatus according to claim 14 , further comprising:
a support substrate coupled to said flexure support, said support substrate comprising active control circuitry to provide actuation of said first multilayer thin-film dielectric reflector.
16. The apparatus according to claim 14 , further comprising:
a support substrate coupled to said flexure support, said support substrate comprising active control circuitry to provide electrostatic actuation of said first multilayer thin-film dielectric reflector.
17. The apparatus according to claim 12 , wherein said support substrate further comprises an electrode.
18. A micromirror array, comprising:
a plurality of micromirror structures, each structure comprising:
a device layer having a recess;
a multilayer thin-film dielectric reflector coupled to and structurally supported by said device layer;
a stress compensator seated in said recess in the opposite side of said device layer from said multilayer thin-film dielectric reflector, said stress compensator operable to resist device layer bending moments resulting from intrinsic and thermal mismatch stresses between said micromirror and said substrate; and
respective flexures extending from said device layers.
19. The array of claim 18 , wherein each structure further comprises:
respective supports connected to said flexures, said flexures enabling movement of said device layers relative to said supports.
20. The array of claim 18 , further comprising:
respective electrodes positioned to actuate movements of corresponding device layers in response to applied voltages between said electrodes and their respective device layers.
21. The array of claim 18 , wherein at least one of said plurality of micromirror structures further comprises said multilayer thin-film dielectric reflector and said stress compensator sharing approximately equal linear thermal expansion coefficients to reduce warping of said respective device layer.
22. The array of claim 18 , further comprising:
a base substrate which provides support for each of said electrodes.