Laser irradiation method and apparatus for forming a polycrystalline silicon film
View Patent ↗A method for changing an amorphous silicon film to a poly-crystalline silicon film includes the steps of irradiating an elongate pulse laser beam onto the silicon film while scanning in the direction normal to the major axis of the elongate pulse laser beam, to form a plurality of irradiated areas, irradiating flat-surface light onto the irradiated areas in the direction parallel to the major axis, and analyzing distribution of the reflected light from the irradiated areas to determine the threshold value of micro-crystallization. The threshold value is used to further determine an energy density of the elongate pulse laser beam for the phase change process.
1. A method for changing a phase of a semiconductor layer from an amorphous state to a crystal state, comprising the steps of:
irradiating an elongate first pulse laser beam having a specific generation frequency onto a semiconductor layer with a plurality of different energy densities while scanning in a direction normal to a major axis of said first pulse laser beam, to thereby form a plurality of first irradiated areas corresponding to said different energy densities;
irradiating a flat-surface light onto said first irradiated areas in a direction substantially parallel to said major axis of said first pulse laser beam, to receive reflected light from each of said first irradiated areas;
analyzing said reflected light to estimate a threshold value of a micro-crystallization energy density by determining a color distribution from said reflected light in a direction normal to said major areas of said first pulse laser beam, and judging a distance between adjacent peaks of color change and/or uniformity of said color change;
determining a first energy density based on said estimated threshold value; and
irradiating an elongate second pulse laser beam having said specific generation frequency onto the semiconductor layer with said first energy density while scanning in a direction normal to a major axis of said second pulse laser beam, to form a second irradiated area.
2. The method according to claim 1 , wherein a scanning pitch of said first pulse laser beam in each of said first irradiated areas is longer than a scanning pitch of said second pulse laser beam in said second irradiated area.
3. The method according to claim 1 , wherein said first pulse laser beam has a beam size smaller than a beam size of said second pulse laser beam.
4. The method according to claim 1 , wherein said threshold value is estimated based on a periodicity of said reflected light in said determining step.
5. The method according to claim 1 , wherein said threshold value is estimated by the steps of determining a color distribution from said reflected light in a direction normal to said major axis, and a width of a color in said color distribution.
6. A method for changing a phase of a semiconductor layer from an amorphous state to a crystallized state, comprising the steps of:
irradiating an elongate first pulse laser beam having a specific generation frequency onto a semiconductor layer with a plurality of different energy densities while scanning in a direction normal to a major axis of said first pulse laser beam, to thereby form a plurality of first irradiated areas corresponding to said different energy densities;
irradiating a flat-surface light onto said first irradiated areas in a direction substantially parallel to said major axis of said first pulse laser beam, to receive reflected light from each of said first radiated areas;
analyzing said reflected light to estimate a threshold value of a micro-crystallization energy density wherein said threshold value is estimated by the steps of determining a color distribution from said reflected light in a direction normal to said major axis, and a width of a color in said color distribution;
determining a first energy density based on said estimated threshold value; and
irradiating an elongate second pulse laser beam having said specific generation frequency onto the semiconductor layer with said first energy density while scanning in a direction normal to a major axis of said second pulse laser beam, to form a second irradiated area.
7. The method according to claim 6 , wherein a scanning pitch of said first pulse laser beam in each of said first irradiated areas is longer than a scanning pitch of said second pulse laser beam in said second irradiated area.
8. The method according to claim 6 , wherein said first pulse laser beam has a size smaller than a beam size of said second pulse laser beam.
9. The method according to claim 6 , wherein said threshold value is estimated based on a periodicity of said reflected light in said determining step.