IP Library Granted Patent US 7,414,593
Granted Patent B2
US 7,414,593 · App. 11/362,442 · Granted Aug 19, 2008

Thermoformed frequency selective surface

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Quick Facts
Patent No.
US 7,414,593
App. No.
11/362,442
Granted
Aug 19, 2008
Kind
B2
Abstract

A three-dimensional FSS fabrication system is described. FSS elements are pre-mapped in two-dimensional form and constructed on a flat FSS panel that is then formed into a desired three-dimensional shape. The 2-D flat surface of the designed FSS is mapped into a desired three-dimensional curvature so that when formed from 2-D into the 3-D shape, the FSS elements are moved into a desired position and/or orientation. In one embodiment, the mapping from 2-D to 3-D is performed using the elastic properties of a desired substrate material. In one embodiment, one or more flat FSS panels are constructed on a formable or thermo-formable substrate. In one embodiment, the substrate includes a thermoplastic. In one embodiment, the substrate includes a thermoplastic material with fiber reinforcement. The FSS elements can be created by printing, deposition, photo-etching, etc. The flat FSS layers are thermoformed or chemically formed over a tool having the desired shape. In one embodiment, the FSS layers are formed to the shape of the tool by using vacuum techniques. In one embodiment, the FSS layers are formed to the shape of the tool by supporting the FSS layer between male and female tools.

Claims (39)

1. A method for constructing a three-dimensional FSS structure, comprising:

designing an FSS having a desired spacing between FSS elements;

determining a mapping from a two-dimensional surface to a three-dimensional shape according to an elastic property of a substrate material and a shape of a tool that describes said desired three-dimensional shape;

determining a desired position for each of said FSS elements according to said mapping;

creating a plurality of physical FSS elements to a substantially flat substrate, each of said physical FSS elements positioned according to said mapping; and

forming said substrate to said three-dimensional shape.

2. The method of claim 1 , wherein said substrate comprises a thermoplastic.

3. The method of claim 1 , wherein said substrate comprises a thermoplastic with support fibers.

4. The method of claim 1 , wherein said forming comprises thermoforming.

5. The method of claim 1 , wherein said forming comprises thermoforming using vacuum to force said FSS layer against said tool.

6. The method of claim 1 , wherein said forming comprises thermoforming using first and second tools to mold a shape of said FSS layer.

7. The method of claim 1 , wherein said FSS elements comprise slot-type elements.

8. The method of claim 1 , wherein said FSS elements comprise wire-type elements.

9. The method of claim 1 , wherein said FSS elements comprise patch-type elements.

10. The method of claim 1 , wherein said FSS elements comprise resonant-type elements.

11. The method of claim 1 , wherein said FSS elements comprise nonresonant-type elements.

12. The method of claim 1 , further comprising combining one or more three-dimensional FSS structures.

13. The method of claim 1 , wherein said determining a mapping comprises physical testing.

14. An FSS structure constructed by:

determining a desired element shape of FSS elements and a desired spacing between said FSS elements;

determining a mapping from a two-dimensional surface to a desired three-dimensional shape according to at least an elastic property of a substrate material and said desired three-dimensional shape;

creating a plurality of physical FSS elements on a substantially flat substrate, each of said physical FSS elements shaped according to said desired element shape and positioned according to said mapping; and

forming said substrate to said three-dimensional shape by pressing said substrate against a tool that corresponds to said desired three-dimensional shape.

15. The FSS structure of claim 14 , wherein said FSS elements are provided to an upper surface of said substrate and to a lower surface of said substrate.

16. The FSS structure of claim 14 , wherein said forming comprises thermoforming.

17. The FSS structure of claim 14 , wherein said forming comprises thermoforming using vacuum to force said substrate against said tool.

18. The FSS structure of claim 14 , wherein said forming comprises thermoforming using first and second tools to mold a shape of said FSS layer.

19. The FSS structure of claim 14 , wherein said FSS elements comprise slot-type elements.

20. The FSS structure of claim 14 , wherein said FSS elements comprise wire-type elements.

21. The FSS structure of claim 14 , wherein said FSS elements comprise patch-type elements.

22. The FSS structure of claim 14 , wherein said FSS elements comprise resonant-type elements.

23. The FSS structure of claim 14 , wherein said FSS elements comprise nonresonant-type elements.

24. The FSS structure of claim 14 , wherein said substrate comprises a thermoplastic.

25. The FSS structure of claim 14 , wherein said substrate comprises a thermoplastic with support fibers.

26. The FSS structure of claim 14 , further comprising calculating an electromagnetic performance of said FSS according to said mapping.

27. The FSS structure of claim 14 , wherein said mapping from a two-dimensional surface to a desired three-dimensional shape is determined by physical testing.

28. The FSS structure of claim 14 , wherein said mapping from a two-dimensional surface to a desired three-dimensional shape is determined by physical testing of an FSS provided to a substrate.

29. The FSS structure of claim 14 , wherein said mapping from a two-dimensional surface to a desired three-dimensional shape is determined by physical testing of an FSS provided to a thermoplastic material.

30. The FSS structure of claim 14 , wherein said mapping from a two-dimensional surface to a desired three-dimensional shape is determined by deforming a flat FSS in the desired three-dimensional shape and measuring the effect of said deforming on elements of said FSS.

Assignments (9)
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Jun 6, 2018
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS ADMINISTRATIVE AGENT
To: ORBITAL ATK, INC.
Reel/Frame 046477/0874 →
CHANGE OF NAME Recorded Jan 23, 2018
From: ALLIANT TECHSYSTEMS INC.
To: ORBITAL ATK, INC.
Reel/Frame 045130/0205 →
CHANGE OF NAME Recorded Jan 9, 2018
From: ALLIANT TECHSYSTEMS INC.
To: ORBITAL ATK, INC.
Reel/Frame 045031/0335 →
RELEASE OF SECURITY INTEREST Recorded Oct 7, 2015
From: BANK OF AMERICA, N.A.
To: ALLIANT TECHSYSTEMS INC.
Reel/Frame 036807/0671 →
SECURITY AGREEMENT Recorded Sep 30, 2015
From: ORBITAL ATK, INC.; ORBITAL SCIENCES CORPORATION
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS ADMINISTRATIVE AGENT
Reel/Frame 036732/0170 →
SECURITY AGREEMENT Recorded Nov 26, 2013
From: ALLIANT TECHSYSTEMS INC.; CALIBER COMPANY; EAGLE INDUSTRIES UNLIMITED, INC.; FEDERAL CARTRIDGE COMPANY; SAVAGE ARMS, INC.; SAVAGE RANGE SYSTEMS, INC.; SAVAGE SPORTS CORPORATION
To: BANK OF AMERICA, N.A.
Reel/Frame 031731/0281 →
SECURITY AGREEMENT Recorded Nov 4, 2010
From: ALLIANT TECHSYSTEMS INC.; AMMUNITION ACCESSORIES INC.; ATK COMMERCIAL AMMUNITION COMPANY INC.; ATK COMMERCIAL AMMUNITION HOLDINGS COMPANY; ATK LAUNCH SYSTEMS INC.; ATK SPACE SYSTEMS INC.; FEDERAL CARTRIDGE COMPANY; EAGLE INDUSTRIES UNLIMITED, INC.; EAGLE MAYAGUEZ, LLC; EAGLE NEW BEDFORD, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 025321/0291 →
SECURITY AGREEMENT Recorded Aug 24, 2007
From: AMMUNITION ACCESSORIES INC.; ATK COMMERCIAL AMMUNITION COMPANY INC.; ATK COMMERCIAL AMMUNITION HOLDINGS COMPANY INC.; ATK LAUNCH SYSTEMS INC.; ATK SPACE SYSTEMS INC.; FEDERAL CARTRIDGE COMPANY; MICRO CRAFT INC.; ALLIANT TECHSYSTEMS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 019733/0757 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 30, 2006
From: WILLIAMS, VICTOR G.; MACFARLAND, ANDREW B.; SALADIN, ETHAN C.; MARCUM, JAY C.
To: ALLIANT TECHSYSTEMS INC.
Reel/Frame 017934/0951 →