Fusible device and method
Electrically conductive devices and methods of making such devices are disclosed. One such device has a fusible conductor and a substrate. The substrate may support the fusible conductor. The substrate may have an outer perimeter and within the outer perimeter the substrate may have a heat-transfer-resisting material-deficient portion proximate to the fusible conductor.
1 . An electrically conductive device, comprising:
a fusible conductor;
a substrate supporting the fusible conductor, the substrate having an outer perimeter
and within the outer perimeter the substrate has a heat-transfer-resisting material-deficient portion proximate to the fusible conductor.
2 . The conductive device of claim 1 , wherein the material-deficient portion includes a hole in the substrate.
3 . The conductive device of claim 2 , wherein the hole is circular.
4 . The conductive device of claim 2 , wherein the hole is a slot.
5 . The conductive device of claim 1 , wherein the material-deficient portion includes a reduced thickness area in which a thickness of the substrate in the reduced thickness area is less than a predominant thickness of the substrate.
6 . The conductive device of claim 5 , wherein the fusible conductor is formed on the reduced thickness area.
7 . The conductive device of claim 1 , wherein the fusible conductor electrically joins two circuit locations, the circuit locations providing conductive material that may be joined to an electrical conditioning component.
8 . The conductive device of claim 7 , wherein the fusible conductor is supported by the conditioning component.
9 . A method of creating an electrically conductive device, comprising:
providing a substrate;
placing a fusible conductor on the substrate;
removing material from the substrate proximate to the fusible conductor to provide a heat-transfer-resisting material-deficient portion.
10 . The method of claim 9 , wherein the heat-transfer-resisting material-deficient portion is formed by drilling.
11 . The method of claim 9 , wherein the heat-transfer-resisting material-deficient portion is formed by punching.
12 . The method of claim 9 , wherein the heat-transfer-resisting material-deficient portion is formed by etching.
13 . The method of claim 9 , wherein the heat-transfer-resisting material-deficient portion is a hole.
14 . The method of claim 13 , wherein the hole is substantially circular.
15 . The method of claim 13 , wherein the hole is a slot.
16 . A method of creating an electrically conductive device, comprising:
providing a substrate having a heat-transfer-resisting material-deficient portion;
placing a fusible conductor proximate to the material-deficient portion.
17 . The method of claim 16 , wherein providing the substrate is preceded by forming the substrate to have the material-deficient portion.
18 . The method of claim 16 , wherein providing the substrate is preceded by forming the substrate and then removing material from the substrate to create the material-deficient portion.
19 . The method of claim 18 , wherein material is removed from the substrate by drilling.
20 . The method of claim 18 , wherein material is removed from the substrate by punching.
21 . The method of claim 18 , wherein material is removed from the substrate by etching.
22 . The method of claim 16 , wherein the heat-transfer-resisting material-deficient portion is a hole.
23 . The method of claim 22 , wherein the hole is substantially circular.
24 . The method of claim 22 , wherein the hole is a slot.