IP Library › Granted Patent US 7,513,686
Granted Patent B2
US 7,513,686 · App. 11/362,749 · Granted Apr 7, 2009

Circuit lid with a thermocouple

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Quick Facts
Patent No.
US 7,513,686
App. No.
11/362,749
Granted
Apr 7, 2009
Kind
B2
Abstract

Various devices for measuring an electronic device lid are provided. In one aspect, an apparatus is provided that includes an integrated circuit, a lid for positioning on the integrated circuit, and a junction of two dissimilar metals associated with the lid. The junction provides a thermocouple to provide an output signal representative of a temperature of the lid.

Claims (50)

1. An apparatus, comprising:

an electronic device;

a lid for positioning on the electronic device; and

a junction of two dissimilar metals associated with the lid wherein a portion of the lid provides one of the two dissimilar metals, the junction providing a thermocouple to provide an output signal representative of a temperature of the lid.

2. The apparatus of claim 1 , comprising a sensing instrument to receive the output signal from the thermocouple.

3. The apparatus of claim 1 , comprising a thermal interface material positioned between the lid and the electronic device.

4. The apparatus of claim 1 , wherein the lid fully covers the electronic device.

5. The apparatus of claim 1 , comprising a thermal control system positionable on the lid for controlling the temperature of the lid.

6. The apparatus of claim 1 , wherein the lid comprises a metallic core and metallic coating surrounding the metallic core.

7. The apparatus of claim 6 , wherein the junction comprises the metallic coating and a dissimilar metallic lead coupled to the metallic coating.

8. The apparatus of claim 6 , wherein the junction comprises a portion of the metallic core and a dissimilar metallic lead coupled to the portion of the metallic core.

9. An apparatus, comprising:

an integrated circuit;

a lid for positioning on the integrated circuit; and

a junction of two dissimilar metals associated with the lid wherein a portion of the lid provides one of the two dissimilar metals, the junction providing a thermocouple to provide an output signal representative of a temperature of the lid.

10. The apparatus of claim 9 , comprising a sensing instrument to receive the output signal from the thermocouple.

11. The apparatus of claim 9 , comprising a thermal interface material positioned between the lid and the integrated circuit.

12. The apparatus of claim 9 , wherein the lid fully covers the integrated circuit.

13. The apparatus of claim 9 , comprising a thermal control system positionable on the lid for controlling the temperature of the lid.

14. The apparatus of claim 9 , wherein the lid comprises a metallic core and metallic coating surrounding the metallic core.

15. The apparatus of claim 14 , wherein the junction comprises the metallic coating and a dissimilar metallic lead coupled to the metallic coating.

16. The apparatus of claim 14 , wherein the junction comprises a portion of the metallic core and a dissimilar metallic lead coupled to the portion of the metallic core.

17. An apparatus, comprising:

a lid for an integrated circuit; and

a junction of two dissimilar metals associated with the lid wherein a portion of the lid provides one of the two dissimilar metals, the junction providing a thermocouple to provide an output signal representative of a temperature of the lid.

18. The apparatus of claim 17 , comprising a sensing instrument to receive the output signal from the thermocouple.

19. The apparatus of claim 17 , comprising a thermal interface material adapted to be positioned between the lid and the integrated circuit.

20. The apparatus of claim 17 , wherein the lid fully covers the integrated circuit.

21. The apparatus of claim 17 , comprising a thermal control system positionable on the lid for controlling the temperature of the lid.

22. The apparatus of claim 17 , wherein the lid comprises a metallic core and metallic coating surrounding the metallic core.

23. The apparatus of claim 22 , wherein the junction comprises the metallic coating and a dissimilar metallic lead coupled to the metallic coating.

24. The apparatus of claim 22 , wherein the junction comprises a portion of the metallic core and a dissimilar metallic lead coupled to the portion of the metallic core.

25. An apparatus, comprising:

an electronic device;

a lid for positioning on the electronic device;

a junction of two dissimilar metals associated with the lid wherein a portion of the lid provides one of the two dissimilar metals, the junction providing a thermocouple to provide an output signal representative of a temperature of the lid; and

a heat sink coupled to the lid.

26. The apparatus of claim 25 , comprising a sensing instrument to receive the output signal from the thermocouple.

27. The apparatus of claim 25 , comprising a thermal interface material positioned between the lid and the electronic device.

28. The apparatus of claim 25 , wherein the lid fully covers the electronic device.

29. The apparatus of claim 25 , comprising a cooling fan for forcing a gas past the heat sink.

30. The apparatus of claim 25 , wherein the lid comprises a metallic core and metallic coating surrounding the metallic core.

31. The apparatus of claim 30 , wherein the junction comprises the metallic coating and a dissimilar metallic lead coupled to the metallic coating.

32. The apparatus of claim 30 , wherein the junction comprises a portion of the metallic core and a dissimilar metallic lead coupled to the portion of the metallic core.

33. A method of sensing a temperature of an integrated circuit lid, comprising:

forming a junction of two dissimilar metals associated with the lid wherein a portion of the lid provides one of the two dissimilar metals, the junction providing a thermocouple operable to provide a first output signal indicative of the temperature of the lid; and

coupling the junction to a sensing instrument to receive the first output signal and generate a second output signal indicative of the temperature of the lid.

34. The method of claim 33 , wherein the forming of the junction comprises coupling a dissimilar metal lead to the lid.

35. The method of claim 33 , comprising operating the integrated circuit while measuring the temperature of the lid.

36. The method of claim 33 , comprising coupling a heat sink to the lid.

Assignments (1)
RELEASE OF SECURITY INTEREST Recorded May 12, 2021
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES U.S. INC.
Reel/Frame 056987/0001 →