IP Library Granted Patent US 7,553,549
Granted Patent B2
US 7,553,549 · App. 11/362,950 · Granted Jun 30, 2009

Engineered wood boards with reduced VOC emissions

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Quick Facts
Patent No.
US 7,553,549
App. No.
11/362,950
Granted
Jun 30, 2009
Kind
B2
Abstract

Disclosed is a wood panel having a core layer, and upper and lower surface layers, the surface layers comprising a melamine urea formaldehyde surface resin, wherein the melamine urea formaldehyde surface resin is a product of reaction reagents, the reaction reagents comprising: about 5 to about 25 wt % melamine; about 5 to about 20 wt % urea; about 15 to about 30 wt % formaldehyde; and water.

Claims (52)

1. A wood panel comprising a core layer, and upper and lower surface layers,

wherein the surface layers comprise a first resin,

wherein the first resin is a melamine urea formaldehyde resin condensation reaction product of reaction reagents comprising:

about 5 to about 25 wt % melamine;

about 5 to about 20 wt % urea;

about 15 to about 30 wt % formaldehyde; and

water;

wherein the surface layers contain about 4 wt % to about 12 wt % of the first resin; and

wherein the core layer comprises a second resin different from the first resin.

2. The wood panel according to claim 1 , wherein the wood panel is oriented strand board.

3. The wood panel according to claim 1 , wherein the reaction reagents further comprise about 0.1 to about 10 wt % of a phenol compound.

4. The wood panel according to claim 3 , wherein the phenol compound is phenol formaldehyde.

5. The wood panel according to claim 1 , wherein the surface layers further comprise about 0.1% to about 4% of a powdered phenol-formaldehyde resin.

6. The wood panel according to claim 1 , wherein the core layer comprises about 1 wt % to about 6 wt % isocyanate resin.

7. The wood panel according to claim 6 , wherein the isocyanate resin is pMDI.

8. The wood panel according to claim 1 , wherein the core layer, and the upper and lower surface layers are composed of strands selected from the group consisting of pine, aspen, oak, maple, fir, and gum strands.

9. A process for preparing an engineered wood panel comprising the steps of:

coating wood strands with a first resin wherein the first resin comprises a reaction product of reagents comprising:

about 5 to about 25 wt % melamine;

about 5 to about 20 wt % urea;

about 15 to about 30 wt % formaldehyde; and

water;

coating wood strands with a second resin which is different than the first resin;

preparing a wood panel comprising a core layer, and upper and lower surface layers, wherein the surface layers contain about 4 wt % to about 12 wt % of the first resin, and wherein the core layer comprises the second resin.

10. The process according to claim 9 , further comprising reacting the reagents of the first resin with about 0.1 to about 10 wt % phenol compound.

11. The process according to claim 10 , wherein the phenol compound is phenol formaldehyde.

12. The process according to claim 9 , wherein the core layer, and the upper and lower surface layers are composed of strands selected from the group consisting of pine, aspen, oak, maple, fir, and gum strands.

13. The panel of claim 1 wherein the surface layers contain about 6 wt % to about 12 wt % of the first resin.

14. The panel of claim 1 wherein the surface layers contain about 8 wt % to about 12 wt % of the first resin.

15. A wood panel comprising

a) upper and lower surface layers comprising i) wood strands, ii) a first resin, and ii) about 0 to about 4 wt % of a second resin,

wherein the first resin is a melamine urea formaldehyde resin which is a condensation reaction product of

about 5 to about 25 wt % melamine;

about 5 to about 20 wt % urea;

about 15 to about 30 wt % formaldehyde;

about 15 to about 75 wt % water;

and further condensation reaction with

about 0 to about 10 wt % phenol compound; and

wherein the second resin is powdered phenol-formaldehyde (PF) resin, and

b) a core layer comprising i) wood strands and ii) a third resin.

16. The panel of claim 15 wherein the third resin is an isocyanate resin.

17. The panel of claim 15 wherein the isocyanate resin is pMDI.

18. A method for reducing emissions in engineered wood materials comprising

a) adding a first melamine urea formaldehyde (MUF) resin to wood strands,

b) adding about 0 to about 4 wt % of a second formaldehyde-containing resin to the first resin or the first resin and wood strands mixture,

d) adding a third resin to wood strands,

d) forming an engineered wood material using each of the resin/wood strands mixtures,

wherein the first resin and third resin are different and wherein the first resin/wood strands mixture is used in surface layers of the engineered wood material and wherein the third resin/wood strands mixture is used in a core layer of the engineered wood material.

19. The method of claim 18 , wherein the emissions of the engineered wood material comprise

a) a total VOC less than 500 mcg/m 3 ,

b) a formaldehyde level of less than 0.05 ppm, and

c) total aldehydes level of less than 0.100 ppm.

Assignments (4)
RELEASE OF SECURITY INTEREST IN PATENTS Recorded Jun 27, 2014
From: WELLS FARGO BANK, NATIONAL ASSOCIATION
To: J.M. HUBER CORPORATION; CP KELCO U.S., INC.; HUBER ENGINEERED WOODS LLC
Reel/Frame 033247/0705 →
RELEASE OF SECURITY INTEREST Recorded Nov 1, 2011
From: BANK OF AMERICA, N.A.
To: J.M. HUBER CORPORATION; 333 ASSOCIATES LLC; 333 PARTNERS LLC; CELTEGAN LLC; CP KELCO U.S., INC.; HUBER CST COMPANY; HUBER CST CORPORATION; HUBER ENERGY L.P.; HUBER ENERGY LLC; HUBER ENGINEERED WOODS LLC; HUBER EQUITY CORPORATION; HUBER INTERNATIONAL CORP.; HUBER RESOURCES CORP.; HUBER SOUTH TEXAS GP, LLC; HUBER SOUTH TEXAS LP, LLC; HUBER TIMBER INVESTMENTS LLC; HUBER TIMBER LLC; J.M. HUBER MICROPOWDERS INC.; JMH PARTNERS CORP.; KELCO COMPANY; ST. PAMPHILE TIMBER LLC; TABSUM, INC.; TARA INSURANCE GLOBAL LIMITED; QUINCY WAREHOUSES, INC. (FORMERLY UNDERGROUND WAREHOUSES, INC.
Reel/Frame 027158/0142 →
SECURITY AGREEMENT Recorded Mar 29, 2011
From: J.M. HUBER CORPORATION; 333 ASSOCIATES LLC; 333 PARTNERS LLC; CELTEGAN LLC; CP KELCO U.S., INC.; HUBER CST COMPANY; HUBER CST CORPORATION; HUBER ENERGY L.P.; HUBER ENERGY LLC; HUBER ENGINEERED WOODS LLC; HUBER EQUITY CORPORATION; HUBER INTERNATIONAL CORP.; HUBER RESOURCES CORP.; HUBER SOUTH TEXAS GP, LLC; HUBER SOUTH TEXAS LP, LLC; HUBER TIMBER INVESTMENTS LLC; HUBER TIMBER LLC; J.M. HUBER MICROPOWDERS INC.; JMH PARTNERS CORP.; KELCO COMPANY; ST. PAMPHILE TIMBER LLC; TABSUM, INC.; TARA INSURANCE GLOBAL LIMITED; UNDERGROUND WAREHOUSES, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 026042/0063 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 27, 2006
From: LILES, W. TERRY; OU, NIAN-HUA; PEEK, BRIAN M.
To: HUBER ENGINEERED WOODS LLC
Reel/Frame 017630/0266 →