Method of making an address plate

1. A method of producing an address plate comprising the steps of:

coating a layer of conductive material onto a substrate;

coating a layer of metal over the conductive material;

coating a layer of photoresist above this layer of metal;

curing the layer of photoresist;

exposing, through a first mask, the desired pattern of the conductors onto the layer of photoresist;

developing the photoresist and etching the layer of metal and the layer of conductive material;

exposing, through a second mask, a desired relief pattern onto the layer of the photoresist;

developing the photoresist and etching only the layer of metal;

coating the resulting etched layer with a layer of dielectric material;

applying a further layer of photoresist, the thickness of this layer being equal to the desired height of a relief pattern;

curing the further layer of photoresist;

exposing, through a third mask, the desired structure of the relief pattern onto the further layer of photoresist; and

developing the photoresist and allowing the layer to dry, resulting in spacers raised above the layer of dielectric material.

2. A method as claimed in claim 1 , wherein a layer of metal is coated onto the layer of conductive material prior to the layer of photoresist being applied, the layer of photoresist being a layer of positive working photoresist, the etching of the metal layer taking place simultaneously with the etching of the conductive material, and further exposing, through a mask, a desired pattern of metal conductors onto the layer of positive working photoresist, developing the photoresist and further etching the metal layer.

3. A method as claimed in claim 2 , wherein the metal is silver.

4. A method as claimed in claim 1 , wherein the substrate is flexible.

5. A method as claimed in claim 1 , wherein the substrate is transparent.

6. A method as claimed in claim 1 , wherein the conducting layer is comprised of an inorganic material.