IP Library Granted Patent US 7,377,794
Granted Patent B2
US 7,377,794 · App. 11/366,210 · Granted May 27, 2008

Multiple wavelength sensor interconnect

Assignee: Masimo Corporation
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Quick Facts
Patent No.
US 7,377,794
App. No.
11/366,210
Granted
May 27, 2008
Kind
B2
Abstract

A sensor interconnect assembly has a circuit substrate. An emitter portion of the substrate is adapted to mount emitters. A detector portion of the substrate is adapted to mount a detector. A cable portion of the substrate is adapted to connect a sensor cable. A first group of conductors are disposed on the substrate electrically interconnecting the emitter portion and the cable portion. A second group of conductors are disposed on the substrate electrically interconnecting the detector portion and the cable portion. A decoupling portion of the substrate disposed proximate the cable portion substantially mechanically isolating the cable portion from both the emitter portion and the detector portion so that sensor cable stiffness is not translated to the emitters or the detector.

Claims (58)

1. A sensor interconnect assembly comprising:

a circuit substrate including an elongate portion;

an emitter portion of the substrate adapted to mount a plurality of emitters;

a detector portion of the substrate adapted to mount a detector;

a cable portion of the substrate adapted to connect a sensor cable;

a first plurality of conductors disposed on the substrate electrically interconnecting the emitter portion and the cable portion at least partially disposed along the elongate portion of the substrate;

a second plurality of conductors disposed on the substrate electrically interconnecting the detector portion and the cable portion at least partially disposed alone the elongate portion of the substrate; and

a decoupling portion of the substrate disposed between the cable portion and the elongate portion substantially mechanically decoupling stress associated with the cable portion from one or more of the first and second pluralities of conductors along the elongate portion of the substrate.

2. The sensor interconnect assembly according to claim 1 wherein the circuit substrate is a flex circuit.

3. The sensor interconnect assembly according to claim 2 wherein the decoupling portion is a substantially narrowed region of the flex circuit.

4. The sensor interconnect assembly according to claim 3 further comprising a second decoupling portion of the flex circuit disposed between the emitter portion and the detector portion.

5. The sensor interconnect assembly according to claim 4 wherein the second decoupling portion is an elongated, relatively narrow interconnect between the emitter portion and the detector portion.

6. A sensor interconnect assembly comprising:

a circuit substrate;

an emitter portion of the substrate adapted to mount a plurality of emitters;

a detector portion of the substrate adapted to mount a detector;

a cable portion of the substrate adapted to connect a sensor cable;

a first plurality of conductors disposed on the substrate electrically interconnecting the emitter portion and the cable portion;

a second plurality of conductors disposed on the substrate electrically interconnecting the detector portion and the cable portion:

a decoupling portion of the substrate disposed proximate the cable portion substantially mechanically decoupling cable stiffness associated with the cable portion from one or more of the emitter portion and the detector portion; and

a shield of the flex circuit extending from the cable portion and adapted to fold over detector wires of the sensor cable after wire attachment to the cable portion.

7. A sensor interconnect assembly which mechanically decouples cable stress from one or more of first and second pluralities of conductors, the sensor interconnect assembly comprising:

a circuit substrate including an elongate portion;

an emitter portion of the substrate adapted to mount a plurality of emitters;

a detector portion of the substrate adapted to mount a detector;

a cable portion of the substrate adapted to connect a sensor cable;

a first plurality of conductors disposed on the substrate electrically interconnecting the emitter portion and the cable portion at least partially disposed along the elongate portion of the substrate;

a second plurality of conductors disposed on the substrate electrically interconnecting the detector portion and the cable portion at least partially disposed along the elongate portion of the substrate; and

a decoupling portion of the substrate disposed between the cable portion, the elongate portion, and one or more of the emitter portion and the detector portion, the decoupling portion forming a narrowing of the substrate.

8. The sensor interconnect assembly according to claim 7 wherein the circuit substrate is a flex circuit.

9. The sensor interconnect assembly according to claim 7 further comprising a second decoupling portion of the flex circuit disposed between the emitter portion and the detector portion.

10. The sensor interconnect assembly according to claim 9 wherein the second decoupling portion forms a narrowing of the substrate between the emitter portion and the detector portion.

11. A sensor interconnect assembly which mechanically decouples cable stiffness from one or more of an emitter portion and a detector portion, the sensor interconnect assembly comprising:

a circuit substrate;

an emitter portion of the substrate adapted to mount a plurality of emitters;

a detector portion of the substrate adapted to mount a detector;

a cable portion of the substrate adapted to connect a sensor cable;

a first plurality of conductors disposed on the substrate electrically interconnecting the emitter portion and the cable portion;

a second plurality of conductors disposed on the substrate electrically interconnecting the detector portion and the cable portion; and

a decoupling portion of the substrate disposed between the cable portion and one or more of the emitter portion and the detector portion, the decoupling portion forming a narrowing of the substrate; and

a shield of the flex circuit extending from the cable portion and adapted to fold over detector wires of the sensor cable after wire attachment to the cable portion.

12. The sensor interconnect assembly according to claim 5 further comprising a shield of the flex circuit extending from the cable portion and adapted to fold over detector wires of the sensor cable after wire attachment to the cable portion.

13. The sensor interconnect assembly according to claim 1 wherein the decoupling portion extends substantially perpendicular to the elongate portion of the substrate.

14. The sensor interconnect assembly according to claim 10 further comprising a shield of the flex circuit extending from the cable portion and adapted to fold over detector wires of the sensor cable after wire attachment to the cable portion.

15. The sensor interconnect assembly according to claim 7 wherein the decoupling portion extends substantially perpendicular to the elongate portion of the substrate.

16. A sensor interconnect assembly comprising:

a circuit substrate including an elongate portion;

an emitter portion of the substrate adapted to mount a plurality of emitters;

a detector portion of the substrate adapted to mount a detector;

a cable portion of the substrate adapted to connect a sensor cable;

a first plurality of conductors disposed on the substrate electrically interconnecting the emitter portion and the cable portion at least partially disposed along the elongate portion of the substrate;

a second plurality of conductors disposed on the substrate electrically interconnecting the detector portion and the cable portion at least partially disposed along the elongate portion of the substrate; and

a decoupling portion of the substrate extending perpendicular to the elongate portion and connecting the elongate portion and the cable portion, wherein the decoupling portion substantially mechanically decouples stress associated with the cable portion from one or more of the first and second pluralities of conductors along the elongate portion of the substrate.

17. The sensor interconnect assembly according to claim 16 wherein the circuit substrate is a flex circuit.

18. The sensor interconnect assembly according to claim 17 wherein the decoupling portion is a substantially narrowed region of the flex circuit.

19. The sensor interconnect assembly according to claim 18 further comprising a second decoupling portion of the flex circuit disposed between the emitter portion and the detector portion.

20. The sensor interconnect assembly according to claim 19 wherein the second decoupling portion is an elongated, relatively narrow interconnect between the emitter portion and the detector portion.

21. The sensor interconnect assembly according to claim 20 further comprising a shield of the flex circuit extending from the cable portion and adapted to fold over detector wires of the sensor cable after wire attachment to the cable portion.

Assignments (3)
CHANGE OF NAME Recorded May 16, 2024
From: CERCACOR LABORATORIES, INC.
To: WILLOW LABORATORIES, INC.
Reel/Frame 067455/0298 →
CHANGE OF NAME Recorded May 21, 2012
From: MASIMO LABORATORIES, INC.
To: CERCACOR LABORATORIES, INC.
Reel/Frame 028246/0087 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 31, 2006
From: AMMAR AL-ALI ET AL.; ABDUL-HAFIZ, YASSIR
To: MASIMO LABORATORIES, INC.
Reel/Frame 017941/0335 →
Continuity (5)
Provisional Application 6065759600 · Mar 1, 2005
Provisional Application 6065728100 · Mar 1, 2005
Provisional Application 6065726800 · Mar 1, 2005
Provisional Application 6065775900 · Mar 1, 2005
Related Publication 20060241358A1 · Oct 26, 2006