Semiconductor package fabrication
View Patent ↗A semiconductor package fabrication method in which drop on demand deposition of a drop on demand depositable material is used to prepare one component or a plurality of components of a semiconductor package or multi-chip module.
1. A method of preparing a semiconductor package comprising:
identifying a reference mark on a semiconductor package component;
positioning a drop on demand head capable of depositing drop depositable material based on said identified reference mark; and
depositing said depositable material on a surface of said semiconductor package component to realize a pattern.
2. The method of claim 1 , wherein said semiconductor package component is a semiconductor die.
3. The method of claim 2 , wherein said semiconductor die is a part of a semiconductor wafer.
4. The method of claim 1 , wherein said semiconductor package component is a MOSFET, an IGBT, a diode, a HEMT, a bipolar transistor, a JFET, or an integrated circuit.
5. The method of claim 1 , wherein said depositable material is a dielectric.
6. The method of claim 1 , wherein said depositable material is an electrically conductive material.
7. The method of claim 1 , wherein said semiconductor package component is a portion of a lead frame.
8. The method of claim 1 , wherein said semiconductor package component is a conductive can.
9. The method of claim 1 , wherein said depositable material is a polymer alloy.
10. The method of claim 9 , wherein said polymer alloy includes a silicon epoxy.
11. The method of claim 9 , wherein said polymer alloy includes a silicon polyester.
12. The method of claim 9 , wherein said polymer alloy includes an acrylate.
13. The method of claim 1 , wherein said depositable material includes an organopolysiloxane.
14. The method of claim 1 , wherein said semiconductor package component is part of a multi-chip module.
15. A method for fabricating a semiconductor device comprising:
forming a conductive body, said conductive body including a material susceptible to consumption by a solder;
depositing a barrier atop said conductive body, said barrier being capable of preventing the consumption of said material that is susceptible of consumption; and
depositing a solderable body atop said barrier; wherein said barrier is deposited through a drop on demand process, or said barrier is screen printed.
16. The method of claim 15 , wherein said material susceptible of consumption comprises silver.
17. The method of claim 15 , wherein said barrier comprises nickel.
18. The method of claim 15 , wherein said solderable body includes silver.
19. The method of claim 15 , wherein said barrier is comprised of nickel, and said solderable body is comprised of silver.
20. The method of claim 15 , wherein said material susceptible of consumption is silver, said barrier is comprised of nickel, and said solderable body includes silver.
21. A method of fabricating an MCM comprising:
drop on demand depositing conductive tracks and dielectric bodies on a leadframe to form an integrated circuit body capable of receiving semiconductor devices; and
drop on demand depositing of identifying indicia on said leadframe.
22. The method of claim 21 , wherein said indicia includes part number or date of fabrication.