Adhesive transfer device
View Patent ↗The present application generally relates to adhesive transfer devices. One embodiment of the application discloses a hand-held actuatorless adhesive transfer device. Another embodiment of the application discloses an adhesive transfer device for applying adhesive to a side edge portion of a selected substrate.
1. A method for performing an adhesive transfer operation wherein adhesive is applied to a selected substrate, said method comprising:
providing a selected substrate to which adhesive is to be applied;
providing a hand-held actuatorless adhesive transfer device comprising:
a frame having a feeding side and a discharge side, said frame being sized and configured to be received in one hand of a user for manual handling and transport;
a first supply roll rotatably mounted to said frame, said first supply roll carrying a wound up supply of an adhesive carrying substrate that has an adhesive carrying surface coated with a layer of pressure-sensitive adhesive;
a second supply roll rotatably mounted to said frame, said second supply roll carrying a wound up supply of an adhesive mask substrate;
said adhesive carrying substrate being unwound from said first supply roll with a lead end portion thereof extending outwardly from the discharge side of said frame;
said mask substrate being unwound from said second supply roll with a lead end portion thereof extending outwardly from the discharge side of said frame adjacent the lead end portion of said carrying substrate;
said frame being constructed and arranged to enable the adhesive transfer operation to be initiated by manually grasping said frame with one hand and inserting a leading edge portion of the selected substrate between said adhesive carrying and mask substrates; and
pressure applying structure constructed and arranged to apply pressure to substrates being advanced through said device;
while manually grasping the frame with one hand, inserting the leading edge of selected substrate between said adhesive carrying and mask substrates;
while continuing to manually grasp said frame in one hand, manually grasping the lead end portions of said adhesive carrying and mask substrates of the discharge side of said frame with the other hand; and
while continuing to manually grasp said frame in one hand, manually pulling said lead end portions with the other hand so as to advance said mask, adhesive carrying, and selected substrates together through said device and outwardly from the discharge side of said frame such that said pressure applying structure applies pressure to said substrates being advanced through said device, thereby causing the pressure-sensitive adhesive on said carrying substrate bonds to the selected substrate.
2. A method according to claim 1 , wherein said mask substrate has a mask surface that engages the selected substrate and that has a greater affinity for adhesive bonding than the adhesive carrying surface of said adhesive carrying substrate; said method further comprising:
after said selected substrate has advanced outwardly from the discharge side of said frame, peeling said adhesive carrying and mask substrates apart from one another so that any portions of the adhesive bonded to the mask surface remains bonded thereto and are removed from said adhesive carrying substrate, thereby leaving said selected substrate bonded to said carrying substrate with substantially no adhesive exposed around the periphery of said selected substrate so that said selected substrate can be peeled back from said carrying substrate and bonded to a surface as desired.
3. A method according to claim 1 , wherein said pressure applying structure comprises a first substrate engaging structure provided on said frame and a second substrate engaging structure provided on said frame; said adhesive carrying substrate being unwound from said first supply roll and advanced between said substrate engaging structures with a surface thereof opposite said adhesive carrying surface engaging said first substrate engaging structure; said adhesive mask substrate being unwound from said second supply roll and advanced between said substrate engaging structures with a surface thereof opposite said adhesive mask surface engaging said second substrate engaging structure;
wherein advancing said substrates through said device includes advancing said substrates between said first and second substrate engaging structures such that said engaging structures apply pressure to said substrates to thereby cause the pressure-sensitive adhesive to bond to the selected substrate as aforesaid.