Forming method for polymeric laminated wafers comprising different film materials
View Patent ↗A method of making a polymeric laminated wafer comprising different film materials that are softenable and formable at different softening temperatures corresponding with the film materials. Also disclosed is a laminated wafer wherein a first layer has different thermal properties than a second layer of the wafer.
1. A method for forming a laminated wafer comprising the following steps in the sequence set forth:
(a) placing the laminated wafer having at least a cellulose resin protective layer and a polycarbonate base layer in a heated environment having a first temperature capable of softening at least the base layer;
(b) exposing the base layer to heat at a second temperature higher than the first temperature; and
(c) allowing the laminated wafer to form into a desired shape.
2. The method of claim 1 , wherein the step of exposing the base layer to heat at a second temperature higher than the first temperature comprises directing heat at the base layer and not to said first protective layer.
3. The method of claim 2 , wherein the directing of heat at the base layer includes directing infrared rays at the base layer.
4. The method of claim 1 , wherein the step of placing the laminated wafer having at least a cellulose resin protective layer and a polycarbonate base layer in a heated environment having a first temperature capable of softening at least the protective layer comprises placing the wafer in a heated chamber of a forming machine.
5. A method of forming a laminated wafer comprising the following steps in the sequence set forth:
(a) heating a cellulose resin protective layer of said laminated wafer to a first temperature equal at least to a softening temperature of the first the cellulose resin protective layer;
(b) heating a polycarbonate base layer of said laminated wafer to a second temperature equal at least to a softening temperature of the polycarbonate base layer, the second temperature being higher than the first temperature; and
(c) forming the laminated wafer into a desired shape.
6. The method of claim 5 , wherein heating a cellulose resin protective layer comprises heating a CAB film layer and wherein the CAB film layer is heated to a softening temperature of about 220° F.
7. The method of claim 5 , wherein heating a polycarbonate base layer of said laminated wafer to a second temperature at least equal to a softening temperature of a second the polycarbonate base layer comprises heating at least to a softening temperature of about 285° F.