IP Library Granted Patent US 7,161,461
Granted Patent B1
US 7,161,461 · App. 11/369,399 · Granted Jan 9, 2007

Injection molded trim resistor assembly

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Quick Facts
Patent No.
US 7,161,461
App. No.
11/369,399
Granted
Jan 9, 2007
Kind
B1
Abstract

A trim resistor assembly includes a trimmable resistor element embedded within a polymeric housing. The trimmable resistor element includes trimmable resistive film disposed on a nonconductive substrate. Lead wires are connected to contact pads on the substrate. The resistor element and wires are pre-assembled and placed within a mold defining a cavity. The mold includes a pedestal that covers a central region of the substrate that includes the trimmable resistive film. A polymeric material is injected into the cavity to form an integrally molded body that is the polymeric housing. In addition to the trim resistor element and the bare end sections of the wires, the section of the wires that are adjacent the end sections and include the polymeric sheath are also embedded in the housing to strengthen and seal the joint. The pedestal forms an opening in the housing that exposes the resistive film to provide access for trimming the resistance to a desired value. By embedding the trimmable resistor element and the electrical connections within an integral body, the dimensions of the housing may be minimized, and damage to the electrical connections is reduced.

Claims (22)

1. A method for manufacturing a trim resistor assembly comprising

providing a trimmable resistor element comprising a nonconductive substrate, a resistive film disposed on the surface and including a trimmable portion, a first contact pad disposed on the substrate in contact with said resistive film, and a second contact pad disposed on the substrate spaced apart from the first conductive pad and in contact with the resistive film, said substrate comprising an obverse face having a central region and a perimeter region and a reverse face opposite the obverse face;

connecting a first lead wire to the first contact pad and a second lead wire to the second pad, thereby forming a pre-assembly;

arranging the pre-assembly within a mold, said mold defining a cavity and comprising a pedestal and said pre-assembly being arranged such that the pedestal covers the central region and said perimeter region is exposed within the mold;

injecting a polymeric material into the cavity to form a polymeric housing, said polymeric material being injected against the perimeter region of the obverse face and the reverse face of said trimmable resistive element to embed the trimmable resistive element within the polymeric housing, thereby producing an assembly; and

removing the assembly from the mold, said removing including withdrawing the pedestal from the polymeric housing to form an opening in the polymeric housing and expose the central region of the substrate.

2. A method in accordance with claim 1 ,

wherein the first lead wire comprises a metal wire and a polymeric sheath about the metal wire, said first lead wire including an end section stripped of the polymeric sheath and whereat the metal wire is exposed;

wherein the second lead wire comprises a metal wire and a polymeric sheath about the metal wire, said first lead wire including an end section stripped of the polymeric sheath and whereat the metal wire is exposed; and

wherein the end section of the first lead wire is connected to the first conductive pad and the end section of the second lead wire is connected to the second conductive pad.

3. A method in accordance with claim 2 ,

wherein the first wire comprises an adjacent section adjacent to the end section; and wherein the second wire comprises an adjacent section adjacent the end section, and wherein the step of injecting the polymeric material includes injecting the polymeric material into contact with the adjacent sections and the end sections of the first and second lead wires so as to embed adjacent sections and the connections between the end sections and the conductive pads within the housing.

4. A method in accordance with claim 1 , wherein the mold defines a cavity, and wherein the polymeric material is injected into the cavity.

5. A method in accordance with claim 4 , wherein mold comprises upper and lower sections, and wherein the pedestal extends from the lower section to support the substrate within the cavity.

6. A trim resistor assembly comprising:

a trimmable resistor element comprising a nonconductive substrate, a resistive film disposed on the substrate and including a trimmable end portion, a first contact pad disposed on the substrate in contact with said resistive film, and a second contact pad disposed on the substrate spaced apart from the first conductive pad and in contact with the resistive film;

a first lead wire comprising a metal wire and a polymeric sheath encasing the metal wire, said first lead wire having an first end section whereat the metal wire is exposed and is in contact with the first contact pad and an adjacent section that includes the polymeric sheath;

a second lead wire comprising a metal wire and a polymeric sheath encasing the metal wire, said second lead wire having a second end section whereat the metal wire is exposed and is in contact with the second contact pad and an adjacent section that includes the polymeric sheath; and

a polymeric housing formed of an integrally molded body, said trimmable resistor element and said end sections and said adjacent sections of said first and second lead wires being embedded in the molded body, said polymeric housing having a top surface and defining a trim opening exposing said resistive film, whereby the resistive film is spaced apart from the top surface of the polymeric housing and the trim opening provides access for trimming the resistive film to a desired resistance.

7. A trim resistor assembly in accordance with claim 6 , further comprising a polymeric seal within the trim opening.

8. A trim resistor assembly in accordance with claim 6 wherein the substrate comprises an obverse surface and a reverse surface, said obverse surface bearing the resistive film, the first contact pad and the second contact pad and having a perimeter region, and wherein the polymeric body is molded against the reverse surface and the perimeter region of the obverse surface to secure the trimmable resistor element within the polymeric housing.

9. A trim resistor assembly in accordance with claim 6 wherein the end sections of the first and second lead wires are parallel.

Assignments (5)
RELEASE OF SECURITY INTEREST Recorded Jan 14, 2015
From: JPMORGAN CHASE BANK, N.A.
To: DELPHI TECHNOLOGIES, INC.
Reel/Frame 034762/0540 →
SECURITY AGREEMENT Recorded Apr 18, 2011
From: DELPHI TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 026146/0173 →
RELEASE OF SECURITY INTEREST Recorded Apr 15, 2011
From: THE BANK OF NEW YORK MELLON
To: DELPHI CONNECTION SYSTEMS HOLDINGS LLC; DELPHI PROPERTIES MANAGEMENT LLC; DELPHI TECHNOLOGIES, INC.; DELPHI AUTOMOTIVE SYSTEMS LLC; DELPHI CONNECTION SYSTEMS LLC; DELPHI CORPORATION; DELPHI HOLDINGS LLC; DELPHI INTERNATIONAL SERVICES COMPANY LLC; DELPHI MEDICAL SYSTEMS LLC; DELPHI TRADE MANAGEMENT LLC
Reel/Frame 026138/0574 →
SECURITY AGREEMENT Recorded Nov 13, 2009
From: DELPHI TECHNOLOGIES, INC.
To: BANK OF NEW YORK MELLON, AS ADMINISTRATIVE AGENT, THE
Reel/Frame 023510/0562 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 7, 2006
From: NELSON, CHARLES SCOTT
To: DELPHI TECHNOLOGIES, INC.
Reel/Frame 017667/0556 →