IP Library Patent Application 11370022
Patent Application
App. No. 11/370,022

Ultrasonic probe and producing method therefor

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Quick Facts
Patent No.
US None
App. No.
11/370,022
Abstract

Ultrasonic transducers disposed at a head of an ultrasonic probe are joined to a flexible sheet having a curved surface shape. Through holes are formed in the flexible sheet. The through hole is filled with conductive paste for electrically connecting to an individual electrode of the ultrasonic transducer. The flexible sheet is attached to a semicircular support. A surface of the support is provided with device-side terminals for electrically connecting to the conductive paste. The inside of the support is provided with wiring for connecting the device-side terminal to a wiring cable, which is connected to an ultrasonic observing unit.

Claims (39)

1 . An ultrasonic probe, at a head of which a plurality of ultrasonic transducers are arranged in an array form, said ultrasonic probe comprising:

a flexible sheet to which said ultrasonic transducers are joined, said flexible sheet being bent so as to have a curved surface shape;

a through hole formed in said flexible sheet; and

a conductive member fitted into said through hole, said conductive member electrically connecting to an individual electrode of said ultrasonic transducer.

2 . An ultrasonic probe according to claim 1 , further comprising:

a support to which said flexible sheet is attached, said support having a curved surface shape.

3 . An ultrasonic probe according to claim 2 , wherein said support is formed in either of a semicircular shape and a cylindrical shape.

4 . An ultrasonic probe according to claim 2 , further comprising:

a terminal disposed at a surface of said support, said terminal electrically connecting to said conductive member; and

wiring led through the inside of said support, said wiring connecting said terminal to a wiring cable contained in said ultrasonic probe.

5 . An ultrasonic probe according to claim 1 , further comprising;

a flexible wiring substrate to which said flexible sheet is attached;

a terminal disposed at a surface of said flexible wiring substrate, said terminal electrically connecting to said conductive member; and

wiring led through the inside of said flexible wiring substrate, said wiring connecting said terminal to a wiring cable contained in said ultrasonic probe.

6 . An ultrasonic probe according to claim 5 , further comprising:

a support to which said flexible wiring substrate is attached, said support having a curved surface shape.

7 . An ultrasonic probe according to claim 6 , wherein said support is formed in either of a semicircular shape and a cylindrical shape.

8 . An ultrasonic probe according to claim 1 , wherein said conductive member is a conductive paste being as an adhesive applied to said flexible sheet at a time when said transducers are joined to said flexible sheet.

9 . An ultrasonic probe according to claim 8 , wherein said individual electrode of said ultrasonic transducer is said conductive paste applied to a surface of said flexible sheet.

10 . An ultrasonic probe according to claim 1 , wherein said conductive member is a metal pin.

11 . A producing method for an ultrasonic probe, at a head of which a plurality of ultrasonic transducers are arranged in an array form, said producing method comprising the steps of:

forming through holes in a flexible sheet to be joined to said ultrasonic transducers;

fitting a conductive member into said through hole, said conductive member being for electrically connecting to an individual electrode of said ultrasonic transducer;

joining a wafer of a piezoelectric element of said ultrasonic transducer to said flexible sheet; and

dicing said wafer in said array form.

12 . A producing method for the ultrasonic probe according to claim 11 , further comprising the steps of:

bending said flexible sheet so as to have a curved surface shape; and

attaching said flexible sheet to a support having a curved surface shape.

13 . A producing method for the ultrasonic probe according to claim 12 , wherein said support is formed in either of a semicircular shape and a cylindrical shape.

14 . A producing method for the ultrasonic probe according to claim 12 , wherein a surface of said support is provided with a terminal for electrically connecting to said conductive member, and the inside of said support is provided with wiring for connecting said terminal to a wiring cable contained in said ultrasonic probe.

15 . A producing method for the ultrasonic probe according to claim 11 , further comprising the step of:

attaching said flexible sheet to a flexible wiring substrate, a surface of said flexible wiring substrate being provided with a terminal for electrically connecting to said conductive member, and the inside of said flexible wiring substrate being provided with wiring for connecting said terminal to a wiring cable contained in said ultrasonic probe.

16 . A producing method for the ultrasonic probe according to claim 15 , further comprising the step of:

bending said flexible wiring substrate so as to have a curved surface shape; and

attaching said flexible wiring substrate to a support having a curved surface shape.

17 . A producing method for the ultrasonic probe according to claim 16 , wherein said support is formed in either of a semicircular shape and a cylindrical shape.

18 . A producing method for the ultrasonic probe according to claim 11 , wherein said conductive member is a conductive paste being as an adhesive applied to said flexible sheet at a time when said transducers are joined to said flexible sheet.

19 . A producing method for the ultrasonic probe according to claim 18 , wherein said individual electrode of said ultrasonic transducer is said conductive paste applied to a surface of said flexible sheet.

20 . A producing method for the ultrasonic probe according to claim 11 , wherein said conductive member is a metal pin.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 15, 2007
From: FUJIFILM HOLDINGS CORPORATION (FORMERLY FUJI PHOTO FILM CO., LTD.)
To: FUJIFILM CORPORATION
Reel/Frame 018904/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 8, 2006
From: KUNIYASU, TOSHIAKI
To: FUJI PHOTO FILM CO., LTD.
Reel/Frame 017672/0560 →