IC package, IC socket, and IC socket assembly
View Patent ↗An IC socket assembly includes an IC socket, constituted by: a plurality of electrical contacts; an IC package mounting surface; an insulative socket housing for holding the plurality of electrical contacts at the IC package mounting surface; and an urging member for urging an IC package, which is mounted on the IC package mounting surface, toward the plurality of electrical contacts so as to establish electrical connections therewith; and the IC package. The IC package has a frame member provided about the periphery of a main body thereof.
1. An IC socket, comprising:
a plurality of electrical contacts;
an IC package mounting surface;
an insulative socket housing for holding the plurality of electrical contacts at the IC package mounting surface; and
an urging member for urging an IC package, which is mounted on the IC package mounting surface, toward the plurality of electrical contacts so as to establish electrical connections therewith;
the IC package having a frame member with peripheral walls provided about the periphery of the main body thereof and receiving protrusions formed on inner sides thereof for holding the IC package mounted in the frame member.
2. The IC socket of claim 1 wherein the peripheral walls cover the periphery of the IC package main body, two opposing ones of the peripheral walls are formed as relatively short height walls and the other two peripheral walls are formed as relatively tall height walls having greater heights that the relatively short height walls.
3. The IC socket of claim 2 further comprising protrusions on the peripheral walls for preventing erroneous insertion of the IC package.
4. The IC socket of claim 2 wherein each receiving protrusion comprises a receiving base for receiving the IC package.
5. The IC socket of claim 4 wherein each receiving protrusion comprises a taper for facilitating insertion of the IC package.
6. The IC socket of claim 5 further comprising an extraction preventing protrusion formed between two of the receiving protrusions on the peripheral walls.
7. The IC socket of claim 6 wherein the extraction preventing protrusion extends from an upper edge of the frame member to a lower edge thereof.
8. The IC socket of claim 7 further comprising a taper formed on the extraction preventing protrusion near the upper edge to facilitate insertion of the IC package main body.
9. The IC socket of claim 8 further comprising a stop surface formed on the extracting preventing protrusion near the lower edge.
10. The IC socket of claim 9 wherein the frame member is configured to hold the inserted IC package main body between the receiving bases and the stop surface.
11. The IC socket of claim 10 wherein the receiving protrusions are formed in the vicinities of corners of the frame member.
12. An IC socket assembly, comprising:
an IC socket, comprising:
a plurality of electrical contacts;
an IC package mounting surface;
an insulative socket housing for holding the plurality of electrical contacts at the IC package mounting surface; and
an urging member for urging an IC package, which is mounted on the IC package mounting surface, toward the plurality of electrical contacts so as to establish electrical connections therewith; and
an IC package having a frame member with peripheral walls provided about the periphery of the main body thereof and receiving protrusions formed on inner sides thereof for holding the IC package mounted in the frame member.
13. The IC socket assembly of claim 12 wherein the peripheral walls cover the periphery of the IC package main body, two opposing ones of the peripheral walls are formed as relatively short height walls and the other two peripheral walls are formed as relatively tall height walls having greater heights than the relatively short height walls.
14. The IC socket assembly of claim 13 further comprising protrusions on the peripheral walls for preventing erroneous insertion of the IC package.
15. The IC socket assembly of claim 13 wherein each receiving protrusion comprises a receiving base for receiving the IC package.
16. The IC socket assembly of claim 15 wherein each receiving protrusion comprises a taper for facilitating insertion of the IC package.
17. The IC socket assembly of claim 16 further comprising an extraction preventing protrusion formed between two of the receiving protrusions on the peripheral walls.
18. The IC socket assembly of claim 17 wherein the extraction preventing protrusion extends from an upper edge of the frame member to a lower edge thereof.
19. The IC socket assembly of claim 18 further comprising a taper formed on the extraction preventing protrusion near the upper edge to facilitate insertion of the IC package main body.
20. The IC socket assembly of claim 19 further comprising a stop surface formed on the extracting preventing protrusion near the lower edge.
21. The IC socket assembly of claim 20 wherein the frame member is configured to hold the inserted IC package main body between the receiving bases and the stop surface.
22. The IC socket assembly of claim 21 wherein the receiving protrusions are formed in the vicinities of corners of the frame member.
23. An IC socket, comprising:
a socket housing having an IC package mounting surface positioned opposite a lower surface;
a plurality of electrical contacts disposed in the socket housing, the electrical contacts extending through the lower surface for connection to a printed circuit board and oppositely extending to a location within the socket housing for electrical connection to contacts of an inserted IC package;
an urging member for urging an IC package, which is mounted on the IC package mounting surface, toward the plurality of electrical contacts; and,
a frame member having peripheral walls which receive a main body of the IC package.
24. The IC socket of claim 23 wherein two opposing ones of the peripheral walls are formed as relatively short height walls and the other two peripheral walls are formed as relatively tall height walls having greater heights than the relatively short height walls.
25. The IC socket of claim 23 further comprising protrusions on the peripheral walls for preventing erroneous insertion of the IC package.
26. The IC socket of claim 23 further comprising receiving protrusions formed on inner sides of the peripheral walls for holding the IC package mounted in the frame member.
27. The IC socket of claim 26 wherein each receiving protrusion comprises a receiving base for receiving the IC package.
28. The IC socket of claim 26 wherein each receiving protrusion comprises a taper for facilitating insertion of the IC package.
29. The IC socket of claim 26 further comprising an extraction preventing protrusion formed between two of the receiving protrusions on the peripheral walls.
30. The IC socket of claim 29 further comprising a stop surface formed on the extracting preventing protrusion near the lower edge.
31. The IC socket of claim 30 wherein the frame member is configured to hold the inserted IC package main body between the receiving protrusions and the stop surface.