Manufacturing process: how to construct constraining core material into printed wiring board

1 . A process for manufacturing a printed wiring board, comprising:

aligning the weave of a woven panel of electrically conductive material relative to a tool surface using at least a pair of references; and

forming tooling holes in the panel of electrically conductive material.

2 . The process of claim 1 , wherein the pair of references include:

at least two mounting pins positioned along a first line;

at least two mounting pins positioned along a second line; and

wherein the first and second lines intersect at a right angle.

3 . The process of claim 1 , wherein the pair of references include:

a first reference edge; and

a second reference edge;

wherein the first and second reference edges meet at a right angle.

4 . The process of claim 1 , wherein the tooling holes are formed using a drill.

5 . The process of claim 1 , wherein the tooling holes are formed using a punch.

6 . A process for manufacturing a printed wiring board comprising:

forming a first set of tooling holes in a panel of electrically conductive material;

drilling clearance holes having a first diameter in the electrically conductive panel;

forming a stack of panels by aligning the panel of electrically conductive material with other layers of material using the first set of tooling holes; and

laminating the stack of panels.

7 . The process of claim 7 , further comprising drilling through holes having a second diameter less than the first diameter through the laminated stack.

8 . The process of claim 8 , further comprising using the first set of tooling holes as a reference to determine the locations in which to drill the through holes.

9 . The process of claim 8 , further comprising:

drilling at least one reference hole;

using an optical vision system to locate the at least one reference hole; and

drilling a second set of tooling holes in predetermined locations relative to the at least one reference hole.

10 . The process of claim 8 , further comprising:

drilling at least one reference hole;

using an optical vision system to locate the at least one reference hole; and

punching a second set of tooling holes in predetermined locations relative to the at least one reference hole.

11 . The process of claim 8 , further comprising:

aligning artwork against the electrically conductive panel;

screening photoresist over the artwork; and

etching the electrically conductive panel.

12 . The process of claim 8 , wherein aligning the artwork comprises:

punching holes corresponding to the first set of tooling holes in the artwork; and

aligning the artwork and the electrically conductive panel using the first set of tooling holes.

13 . A process for manufacturing a printed wiring board comprising:

forming a first set of tooling holes in a panel of electrically conductive material;

drilling clearance holes having a first diameter in the electrically conductive panel;

forming a second set of tooling holes through the panel of electrically conductive material;

forming a stack of panels by aligning the panel of electrically conductive material with other layers of material using the second set of tooling holes; and

laminating the stack of panels.

14 . The process of claim 13 , wherein the forming of a second set of tooling holes further comprises:

using the first set of tooling holes as a reference to locate predetermined locations; and

drilling the second set of tooling holes at the predetermined locations.

15 . The process of claim 13 , wherein the forming of a second set of tooling holes further comprises:

using the first set of holes as a reference to locate at least one predetermined location;

drilling a reference hole in the at least one predetermined location;

using an optical vision system to locate the reference hole; and

using the optical vision system to punch the second set of tooling holes in predetermined locations relative to the reference hole.

16 . The process of claim 13 , further comprising drilling through holes having a second diameter less than the first diameter through the laminated stack.

17 . The process of claim 13 , further comprising using either the first or the second set of tooling holes as a reference to determine the locations in which to drill the through holes.

18 . The process of claim 13 , further comprising:

drilling at least one reference hole;

using an optical vision system to locate the at least one reference hole; and

drilling a second set of tooling holes in predetermined locations relative to the at least one reference hole.

19 . The process of claim 13 , further comprising:

drilling at least one reference hole;

using an optical vision system to locate the at least one reference hole; and

punching a second set of tooling holes in predetermined locations relative to the at least one reference hole.

20 . The process of claim 13 , further comprising:

aligning artwork against the electrically conductive panel;

screening photoresist over the artwork; and

etching the electrically conductive panel.

21 . The process of claim 20 , wherein aligning the artwork comprises:

punching holes corresponding to the first set of tooling holes in the artwork; and

aligning the artwork and the electrically conductive panel using the first set of tooling holes.

22 . An optical vision system, comprising:

an X-ray light source;

an X-ray detector configured to generate an output indicative of the regions of the detector on which light is incident; and

a processor connected to the X-ray detector and configured to identify a circular pattern using the output of the X-ray detector.

23 . A process for manufacturing a printed wiring board, comprising:

drilling clearance holes in an electrically conductive panel of material;

routing channels in the electrically conductive panels of material laminating the electrically conductive panels with other panels of material to form an array of printed wiring board sub-assemblies;

drilling through holes through each of the printed wiring boards in the array of printed wiring board subassemblies;

plating the linings of the through holes; and

testing each printed wiring board in the array of printed wiring boards.

24 . The process of claim 23 , wherein the channels are routed in locations that electrically isolate each printed wiring board from the other printed wiring boards in the array of printed wiring boards.