Floating heatsink for removable components
View Patent ↗A floating heatsink is disclosed for components mounted within an electromagnetic enclosure. The floating heatsink includes an aperture within the enclosure wall against which a floating heatsink is disposed on the interior of the enclosure. The floating heatsink is dimensioned to overlap the enclosure around the aperture. A resilient bias member is disposed along the overlap between the floating heatsink and the enclosure. The resilient bias member acts as an electromagnetic gasket while urging the floating heatsink against the component. In certain embodiments the component is replaceable via a second aperture in the enclosure. The floating heatsink is particularly useful for overcoming the need for thermal compounds of heatsinks using the enclosure known in the art.
1. An apparatus for removing heat from a component to be mounted within an enclosure, said enclosure having a first aperture adjacent to said component when said component is in an operating position, the apparatus comprising:
a floating heatsink disposed interior to said enclosure adjacent to said first aperture, said floating heatsink dimensioned to overlap said enclosure around the periphery of said first aperture, said floating heatsink including a peripheral edge having a top surface, said top surface facing an underside of said enclosure adjacent said aperture; and
a first resilient bias member disposed between at least a portion of an overlap between said floating heatsink and said enclosure, wherein said first resilient bias member acts as an electromagnetic gasket between said floating heatsink and said enclosure, wherein said first resilient bias member is disposed atop at least a portion of said top surface,
whereby said first resilient bias member urges said floating heatsink against said component in the operating position.
2. An apparatus as claimed in claim 1 , wherein said enclosure further comprises a second aperture, and said component may be removed from said enclosure via said second aperture.
3. An apparatus as claimed in claim 1 , wherein said first resilient bias member comprises an elastomeric compound having electrically conductive media dispersed therethrough.
4. An apparatus as claimed in claim 1 , wherein said first resilient bias member comprises a multi-fingered metallic gasketing strip.
5. An apparatus as claimed in claim 1 , wherein said first resilient bias member contacts said underside of said enclosure and biases said floating heatsink away from said enclosure.
6. An apparatus for removing heat from a component to be mounted within an enclosure, said enclosure having a first aperture adjacent to said component when said component is in an operating position, the apparatus comprising:
a floating heatsink disposed interior to said enclosure adjacent to said first aperture, said floating heatsink dimensioned to overlap said enclosure around the periphery of said first aperture; and
a first resilient bias member disposed between at least a portion of an overlap between said floating heatsink and said enclosure, wherein said first resilient bias member acts as an electromagnetic gasket between said floating heatsink and said enclosure, whereby said first resilient bias member urges said floating heatsink against said component in the operating position; and
a second resilient bias member disposed between said floating heatsink and said enclosure, said second resilient bias member bearing against said enclosure to urge said floating heatsink against said component in the operating position.
7. An apparatus as claimed in claim 6 , wherein said floating heatsink includes a peripheral edge having a top surface, said top surface facing an underside of said enclosure adjacent said aperture, and wherein said first resilient bias member and said second resilient bias member are disposed atop at least a portion of said top surface and bear against said underside.
8. An apparatus for removing heat from a component to be mounted within an enclosure, said enclosure having an underside surface and defining an aperture adjacent to said component when said component is in an operating position, the apparatus comprising:
a floating heatsink disposed interior to said enclosure adjacent to said first aperture, said floating heatsink being dimensioned larger than said aperture such that a peripheral portion of said floating heatsink overlaps with a portion of said underside surface adjacent said aperture; and
a first resilient bias member disposed between said peripheral portion of said floating heatsink and said portion of said underside surface adjacent said aperture, wherein said first resilient bias member acts as an electromagnetic gasket between said floating heatsink and said enclosure, and wherein said first resilient bias member bears against said underside surface to urge said floating heatsink against said component in the operating position.
9. An apparatus as claimed in claim 8 , wherein said enclosure further comprises a second aperture, and said component may be removed from said enclosure via said second aperture.
10. An apparatus as claimed in claim 8 , wherein said first resilient bias member comprises an elastomeric compound having electrically conductive media dispersed therethrough.
11. An apparatus as claimed in claim 8 , wherein said first resilient bias member comprises a multi-fingered metallic gasketing strip.
12. An apparatus as claimed in claim 8 , wherein said floating heatsink includes a peripheral edge having a top surface, said top surface facing said underside of said enclosure adjacent said aperture, and wherein said first resilient bias member is disposed atop at least a portion of said top surface.
13. An apparatus as claimed in claim 8 , further including a second resilient bias member disposed between said floating heatsink and said enclosure, said second resilient bias member bearing against said enclosure to urge said floating heatsink against said component in the operating position.