Apparatuses and methods for repairing defects in a circuit
View Patent ↗Methods and apparatuses to repair defects in a circuit, such as during or subsequent to the manufacture of the circuit. Defects may be detected through, for example, optical processing of an acquired image of the circuit or by measuring the strength of a signal emitted across a pair of conductor plates. If defects are detected, conductive particles may be applied to the circuit to correct the detected defects.
1. A method for repairing defects in a circuit comprising:
detecting defects in a circuit, wherein the act of detecting comprises emitting a signal across a first conductor plate, receiving the signal by a second conductor plate, and measuring the strength of the signal received by the second conductor plate; and
if a defect is detected, applying conductive particles to the circuit to correct the detected defect,
wherein the acts of detecting and applying are performed using the same apparatus; and wherein no contact is made with the circuit during the detection of defects.
2. The method of claim 1 , wherein detecting defects further comprises:
acquiring an image of the circuit; and
optically processing the image to generate an input signal.
3. The method of claim 1 , wherein the emitted signal is a radio frequency signal.
4. The method of claim 1 , further comprising:
emitting the signal across a third conductor plate;
receiving the signal by a fourth conductor plate;
measuring the strength of the signal received by the fourth conductor plate; and
detecting defects in the circuit based on the measured signal strength.
5. The method of claim 1 , wherein the first conductor plate and the second conductor plate form a parallel plate capacitor.
6. The method of claim 5 , wherein the capacitor is operable to be passed over a circuit in one of a horizontal direction or a vertical direction.
7. The method of claim 1 , further comprising:
carrying the first conductor plate and the second conductor plate over a circuit in one of a horizontal direction or a vertical direction.
8. The method of claim 7 , wherein a control unit directs the movement of the first conductor plate and the second conductor plate over the circuit.
9. The method of claim 1 , wherein measuring comprises measuring a voltage across the first conductor and the second conductor.
10. The method of claim 1 , further comprising converting an analog measurement to a digital signal.
11. The method of claim 1 , wherein detecting comprises detecting defects in a circuit during manufacture of the circuit.
12. The method of claim 11 , wherein applying the conductive particles occurs during the manufacture of the circuit.
13. The method of claim 11 , wherein applying the conductive particles occurs subsequent to the manufacture of the circuit.
14. The method of claim 1 , wherein detecting comprises detecting a defect having a width of approximately one micrometer situated in a substrate having a thickness of approximately two micrometers.
15. The method of claim 1 , further comprising taking a control action if a defect is detected.
16. An apparatus for repairing defects in a circuit, comprising:
a carrier;
a detector at least partially carried by the carrier and configured to detect a defect in a circuit by measuring a strength measurement of a signal passed through a circuit; and
a printing device carried by the carrier and configured to apply conductive particles to the circuit to correct the detected defect; and
wherein the detector and the printing device do not make contact with the circuit.
17. The apparatus of claim 16 , further comprising a control unit in communication with the detector, the control unit including program logic operable to detect defects in the circuit based on the received strength measurement and, if a defect is detected, to correct the defect by controlling the printing device.
18. A method for repairing defects in a circuit comprising:
detecting defects in a circuit; and
if a defect is detected, applying conductive particles to the circuit to correct the detected defect,
wherein the acts of detecting and applying are performed using the same apparatus; wherein no contact is made with the circuit during the detection of defects; and wherein detecting of the defect cannot be done visually or optically.