Methods for processing a pulsed laser beam to create apertures through microlens arrays

1. A method of optically processing a pulsed laser beam to create apertures in a layer on a back side of a substrate that includes a microlens array on a front side thereof, the method comprising:

impinging the pulsed laser beam through the microlens array on the front side of the substrate and onto the layer on the back side of the substrate,

wherein the substrate that includes the microlens array on the front side thereof and the layer on the back side thereof is configured for visible light applications and wherein the pulsed laser beam is a pulsed laser beam having longer wavelength than visible light; and

wherein impinging the pulsed laser beam onto the layer on the back side of the substrate through the microlens array on the front side of the substrate comprises passing the pulsed laser beam through a layer on the microlens array that has different index of refraction than the microlens array, prior to entering the microlens array.

2. A method according to claim 1 wherein impinging the pulsed laser beam comprises moving the substrate that includes the microlens array on the front side thereof and the layer on the back side thereof in a given direction while rastering the pulsed laser beam across the substrate perpendicular to the given direction to create the apertures in the layer.

3. A method according to claim 2 wherein moving the substrate that includes the microlens array on the front side thereof and the layer on the back side thereof in a given direction while rastering the pulsed laser beam across the substrate perpendicular to the given direction to create the apertures in the layer is performed so as to overlap impingement areas of the pulsed laser beam on the substrate in both the given direction and perpendicular to the given direction.

4. A method according to claim 1 wherein the pulsed laser beam is at least one inch square in area and is sufficiently uniform in power to create apertures in the layer on the back side of the substrate through all of the microlenses in the microlens array on the front side thereof on which the at least one inch square pulsed laser beam impinges, wherein the microlenses include at least one base dimension that is less than about 100 μm in size.

5. A method according to claim 1 wherein the pulsed laser beam is at least one inch square in area and is sufficiently uniform in power to create apertures in the layer on the back side of the substrate through the microlenses in the microlens array on the front side thereof on which the at least one inch square pulsed laser beam impinges, without visible defects, wherein the microlenses include at least one base dimension that is less than about 100 μm in size.

6. A method according to claim 1 wherein the pulsed laser beam is at least one inch square in area and is sufficiently uniform in power to create apertures in the layer on the back side of the substrate through the microlenses in the microlens array on the front side thereof on which the at least one inch square pulsed laser beam impinges, with non-visible defects that have a periodicity of at least about one inch, wherein the microlenses include at least one base dimension that is less than about 100 μm in size.

7. A method according to claim 1 wherein the pulsed laser beam is a pulsed infrared laser beam.

8. A method according to claim 1 wherein at least some of the apertures include debris from the layer in the centers thereof.

9. A method of optically processing a pulsed laser beam to create apertures in a layer on a back side of a substrate that includes a microlens array on a front side thereof, the method comprising:

impinging the pulsed laser beam through the microlens array on the front side of the substrate and onto the layer on the back side of the substrate,

wherein the substrate that includes the microlens array on the front side thereof and the layer on the back side thereof is configured for visible light applications and wherein the pulsed laser beam is a pulsed laser beam having longer wavelength than visible light; and

wherein impinging the pulsed laser beam onto the layer on the back side of the substrate through the microlens array on the front side of the substrate comprises passing the pulsed laser beam through a layer on the microlens array that has different index of refraction than the microlens array, and a coupling layer between the different index of refraction layer and the microlens array, prior to entering the microlens array.

10. A method of optically processing a pulsed laser beam to create apertures in a layer on a back side of a substrate that includes a microlens array on a front side thereof, the method comprising:

impinging the pulsed laser beam through the microlens array on the front side of the substrate and onto the layer on the back side of the substrate,

wherein the pulsed laser beam is at least one inch square in area and is sufficiently uniform in power to create apertures in the layer on the back side of the substrate through all of the microlenses in the microlens array on the front side thereof on which the at least one inch square pulsed laser beam impinges, wherein the microlenses include at least one base dimension that is less than about 100 μm in size; and

wherein moving the substrate that includes the microlens array on the front side thereof and the layer on the back side thereof in a given direction while rastering the pulsed laser beam across the substrate perpendicular to the given direction to create the apertures in the layer is performed so as to overlap impingement areas of the pulsed laser beam on the substrate in both the given direction and perpendicular to the given direction.

11. A method according to claim 10 wherein at least some of the apertures include debris from the layer in the centers thereof.

12. A method of optically processing a pulsed laser beam to create apertures in a layer on a back side of a substrate that includes a microlens array on a front side thereof, the method comprising:

impinging the pulsed laser beam through the microlens array on the front side of the substrate and onto the layer on the back side of the substrate,

wherein the pulsed laser beam is at least one inch square in area and is sufficiently uniform in power to create apertures in the layer on the back side of the substrate through all of the microlenses in the microlens array on the front side thereof on which the at least one inch square pulsed laser beam impinges, wherein the microlenses include at least one base dimension that is less than about 100 μm in size; and

wherein the pulsed laser beam is also sufficiently uniform in power to create the apertures in the layer on the back side of the substrate with the at least one inch square pulsed laser beam, without visible defects.

13. A method according to claim 12 wherein impinging the pulsed laser beam comprises moving the substrate that includes the microlens array on the front side thereof and the layer on the back side thereof in a given direction while rastering the pulsed laser beam across the substrate perpendicular to the given direction to create the apertures in the layer.

14. A method according to claim 12 wherein the pulsed laser beam is sufficiently uniform in power to create the apertures in the layer on the back side of the substrate, with non-visible defects that have a periodicity of at least about one inch.

15. A method of optically processing a pulsed laser beam to create apertures in a layer on a back side of a substrate that includes a microlens array on a front side thereof, the method comprising:

impinging the pulsed laser beam through the microlens array on the front side of the substrate and onto the layer on the back side of the substrate,

wherein the pulsed laser beam is at least one inch square in area and is sufficiently uniform in power to create apertures in the layer on the back side of the substrate through all of the microlenses in the microlens array on the front side thereof on which the at least one inch square pulsed laser beam impinges, wherein the microlenses include at least one base dimension that is less than about 100 μm in size; and

wherein impinging the pulsed laser beam onto the layer on the back side of the substrate through the microlens array on the front side of the substrate comprises passing the pulsed laser beam through a layer on the microlens array that has different index of refraction than the microlens array, prior to entering the microlens array.

16. A method of optically processing a pulsed laser beam to create apertures in a layer on a back side of a substrate that includes a microlens array on a front side thereof, the method comprising:

impinging the pulsed laser beam through the microlens array on the front side of the substrate and onto the layer on the back side of the substrate,

wherein the pulsed laser beam is at least one inch square in area and is sufficiently uniform in power to create apertures in the layer on the back side of the substrate through all of the microlenses in the microlens array on the front side thereof on which the at least one inch square pulsed laser beam impinges, wherein the microlenses include at least one base dimension that is less than about 100 μm in size; and

wherein impinging the pulsed laser beam onto the layer on the back side of the substrate through the microlens array on the front side of the substrate comprises passing the pulsed laser beam through a layer on the microlens array that has different index of refraction than the microlens array, and a coupling layer between the different index of refraction layer and the microlens array, prior to entering the microlens array.