Method of manufacturing a disk drive with a lead frame engaged within a host electronic unit socket
View Patent ↗A method of manufacturing a disk drive for use with a host electronic unit (HEU). The HEU including a printed circuit board having a socket and HEU disk drive circuitry. The method includes providing a lead frame. The lead frame is a single component having material continuity rather than an assembly of subcomponents. The method includes forming a plurality of leads in the lead frame by removing material of the lead frame, and attaching the lead frame to a housing body. The housing body defines a housing periphery sized and configured to be engaged within the socket. The leads extend to the housing periphery. The method includes attaching a disk drive electrical component to the housing body, and electrically connecting the disk drive electrical component to at least one of leads. The disk drive circuitry is located on the HEU printed circuit board rather than within the housing periphery.
1. A method of manufacturing a disk drive for use with a host electronic unit (HEU), the HEU including a printed circuit board having a disk drive socket and disk drive circuitry in electrical communication with the disk drive socket, the method comprising:
providing a lead frame, the lead frame being a single component having material continuity rather than an assembly of subcomponents;
forming a plurality of leads in the lead frame by removing material of the lead frame;
attaching the lead frame to a housing body, the housing body defining a housing periphery sized and configured to be engaged within the disk drive socket, the plurality of leads extending to the housing periphery for electrically communicating with the disk drive circuitry with the housing body being internally engaged within the disk drive socket;
attaching a disk drive electrical component to the housing body within the housing periphery; and
electrically connecting the disk drive electrical component to at least one of the plurality of leads, the leads allowing the disk drive circuitry to control the disk drive electrical component;
wherein the disk drive circuitry is located on the printed circuit board of the HEU rather than within the housing periphery;
wherein the attaching of the lead frame to the housing body includes stamping the lead frame and the housing body.
2. The method of claim 1 wherein the lead frame is formed from a carrier strip.
3. The method of claim 1 wherein the forming of the plurality of leads in the lead frame includes trimming the lead frame.
4. The method claim 3 wherein the trimming of the lead frame occurs prior to attaching of the lead frame to the housing body.
5. The method claim 3 wherein the trimming of the lead frame occurs after attaching of the lead frame to the housing body.
6. The method of claim 1 wherein the housing body and the lead frame are separately formed.
7. The method of claim 1 wherein the housing body is formed from a carrier strip.
8. The method of claim 1 wherein the disk drive component is a spindle motor.
9. The method of claim 1 wherein the disk drive component is a head stack assembly.
10. The method of claim 1 further comprising electrically insulating the lead frame from the housing body.