IP Library Granted Patent US 7,301,756
Granted Patent B2
US 7,301,756 · App. 11/388,088 · Granted Nov 27, 2007

System for mounting modules in a rack mounted chassis

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,301,756
App. No.
11/388,088
Filed
Mar 23, 2006
Granted
Nov 27, 2007
Kind
B2
Art Unit
2835
USPC
361/679
Abstract

A mounted electronics system is provided. The mounted electronics system comprises at least one sub-module, a chassis adapted to receive the at least one sub-module, and a mounting assembly coupled to the chassis and adapted to secure the at least one sub-module to the chassis such that substantially all of the interior width of the chassis is available for use by the at least one sub-module.

Claims (47)

1. A mounted electronics system comprising:

at least one sub-module;

a chassis adapted to receive the at least one sub-module; and

a mounting assembly coupled to the chassis and adapted to secure the at least one sub-module to the chassis such that substantially all of the interior width of the chassis is available for use by the at least one sub-module;

wherein the mounting assembly comprises:

a flange adapted to secure the at least one sub-module to the chassis; and

at least one joint coupling the flange to the chassis, the at least one joint comprising a flexible joint adapted to enable the flange to rotate.

2. The mounted electronics system of claim 1 , further comprising a frame to which the chassis is secured, wherein the frame comprises one of a 19-inch rack, a 23-inch rack, and a 600 millimeter cabinet.

3. The mounted electronics system of claim 1 , wherein the flexible joint is further adapted to enable the flange to rotate towards the interior of the chassis when the chassis is secured to the frame and to rotate away from the interior of the chassis when the at least one sub-module is secured to the chassis.

4. The mounted electronics system of claim 1 , wherein the at least one flexible joint is further adapted to enable the flange to rotate towards the interior of the chassis such that the flange is substantially parallel with and overlapping a face of the at least one sub-module when the at least one sub-module is secured to the chassis.

5. The mounted electronics system of claim 1 , wherein the flexible joint further comprises at least one of a hinge and a ball-and-socket joint.

6. A chassis mounting assembly, comprising:

at least one joint coupled to a chassis; and

a flange coupled to the at least one joint and adapted to secure at least one sub-module to the chassis, wherein the flange is positioned such that substantially the entire interior width of the chassis is available for use by the at least one sub-module;

wherein the at least one joint comprises a flexible joint adapted to enable the flange to rotate.

7. The chassis mounting assembly of claim 6 , wherein the flexible joint is further adapted to enable the flange to rotate towards the interior of the chassis when the chassis is secured to the frame and to rotate away from the interior of the chassis when at least one sub-module is secured to the chassis.

8. The chassis mounting assembly of claim 6 , wherein the at least one flexible joint is further adapted to enable the flange to rotate towards the interior of the chassis such that the flange is substantially parallel with and overlapping a face of the at least one sub-module when the at least one sub-module is secured to the chassis.

9. The chassis mounting assembly of claim 6 , wherein the flexible joint further comprises at least one of a hinge and a ball-and-socket joint.

10. A mounted electronics system comprising:

a frame;

at least one sub-module;

a chassis coupled to the frame and adapted to receive the at least one sub-module; and

a mounting assembly coupled to the outside of the chassis, the mounting assembly comprising:

a flange adapted to secure the at least one sub-module to the chassis; and

at least one joint coupling the flange to the chassis, wherein the at least one joint is adapted to enable the flange to rotate such that the flange is able to rotate towards the interior of the chassis when the chassis is coupled to the frame and such that the flange is able to rotate away from the interior of the chassis when the at least one sub-module is secured to the chassis.

11. The mounted electronics system of claim 10 , wherein the flexible joint further comprises at least one of a hinge and a ball-and-socket joint.

12. A mounted electronics system comprising:

a frame;

at least one sub-module;

a chassis coupled to the frame and adapted to receive the at least one sub-module; and

a mounting assembly coupled substantially to the outside of the chassis and adapted to secure the at least one sub-module to the chassis such that substantially all of the interior width of the chassis is available for use by the at least one sub-module, the mounting assembly comprising:

a flange adapted to secure the at least one sub-module to the chassis; and

at least one flexible joint coupling the flange to the chassis and adapted to enable the flange to rotate.

13. The mounted electronics system of claim 12 , wherein the flange is further adapted with access holes such that screws securing the chassis to the frame are accessible through the access holes in the flange when the flange overlaps a portion of the frame.

14. The mounted electronics system of claim 12 , wherein the at least one flexible joint is further adapted to enable the flange to rotate towards the interior of the chassis when the chassis is secured to the frame and to rotate away from the interior of the chassis when the at least one sub-module is secured to the chassis.

15. The mounted electronics system of claim 12 , wherein the at least one flexible joint is further adapted to enable the flange to rotate towards the interior of the chassis such that the flange is substantially parallel with and overlapping a face of the at least one sub-module when the at least one sub-module is secured to the chassis.

16. The mounted electronics system of claim 12 , wherein the at least one flexible joint further comprises at least one of a hinge and a ball-and-socket joint.

17. A chassis mounting assembly, comprising:

securing means for securing a sub-module to a chassis, wherein the securing means is located substantially outside of the chassis; and

rotating means, coupled to the securing means and chassis, for rotating the securing means such that the securing means is rotated towards the chassis interior when the chassis is secured to a frame and rotated away from the chassis interior when a sub-module is secured to a chassis via the securing means.

18. A method of inserting a sub-module into a chassis, the method comprising:

rotating a flange coupled to a chassis toward the chassis interior;

attaching the chassis to a frame;

rotating the flange away from the interior of the chassis, wherein the flange is rotated such that the flange does not prevent a sub-module from occupying substantially the entire interior width of the chassis;

inserting the sub-module into the chassis; and

attaching the sub-module to the flange.

19. The method of claim 18 , wherein rotating the flange away from the interior of the chassis further comprises the step of rotating the flange away from the interior of the chassis until the flange is substantially parallel with and overlapping a bracket used to attach the chassis to the frame.

Assignments (14)
RELEASE OF SECURITY INTEREST AT REEL/FRAME 049905/0504 Recorded Dec 19, 2024
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: ARRIS ENTERPRISES LLC (F/K/A ARRIS ENTERPRISES, INC.); ARRIS TECHNOLOGY, INC.; ARRIS SOLUTIONS, INC.; COMMSCOPE, INC. OF NORTH CAROLINA; COMMSCOPE TECHNOLOGIES LLC; RUCKUS WIRELESS, LLC (F/K/A RUCKUS WIRELESS, INC.)
Reel/Frame 071477/0255 →
TERM LOAN SECURITY AGREEMENT Recorded Jul 3, 2019
From: COMMSCOPE, INC. OF NORTH CAROLINA; COMMSCOPE TECHNOLOGIES LLC; ARRIS ENTERPRISES LLC; ARRIS TECHNOLOGY, INC.; RUCKUS WIRELESS, INC.; ARRIS SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 049905/0504 →
ABL SECURITY AGREEMENT Recorded Jul 3, 2019
From: COMMSCOPE, INC. OF NORTH CAROLINA; COMMSCOPE TECHNOLOGIES LLC; ARRIS ENTERPRISES LLC; ARRIS TECHNOLOGY, INC.; RUCKUS WIRELESS, INC.; ARRIS SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 049892/0396 →
PATENT SECURITY AGREEMENT Recorded Jul 3, 2019
From: COMMSCOPE TECHNOLOGIES LLC
To: WILMINGTON TRUST, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 049892/0051 →
RELEASE OF SECURITY INTEREST Recorded Apr 9, 2019
From: JPMORGAN CHASE BANK, N.A.
To: REDWOOD SYSTEMS, INC.; ALLEN TELECOM LLC; ANDREW LLC; COMMSCOPE, INC. OF NORTH CAROLINA; COMMSCOPE TECHNOLOGIES LLC
Reel/Frame 048840/0001 →
RELEASE OF SECURITY INTEREST Recorded Apr 9, 2019
From: JPMORGAN CHASE BANK, N.A.
To: REDWOOD SYSTEMS, INC.; ALLEN TELECOM LLC; ANDREW LLC; COMMSCOPE, INC. OF NORTH CAROLINA; COMMSCOPE TECHNOLOGIES LLC
Reel/Frame 049260/0001 →
PATENT SECURITY AGREEMENT (ABL) Recorded Jan 13, 2016
From: COMMSCOPE TECHNOLOGIES LLC
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 037514/0196 →
PATENT SECURITY AGREEMENT (TERM) Recorded Jan 13, 2016
From: COMMSCOPE TECHNOLOGIES LLC
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 037513/0709 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 29, 2015
From: COMMSCOPE EMEA LIMITED
To: COMMSCOPE TECHNOLOGIES LLC
Reel/Frame 037012/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 26, 2015
From: TYCO ELECTRONICS SERVICES GMBH
To: COMMSCOPE EMEA LIMITED
Reel/Frame 036956/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 6, 2015
From: ADC TELECOMMUNICATIONS, INC.
To: TYCO ELECTRONICS SERVICES GMBH
Reel/Frame 036060/0174 →
RELEASE OF SECURITY INTEREST Recorded Jan 11, 2010
From: JPMORGAN CHASE BANK, N.A.
To: ADC TELECOMMUNICATIONS, INC.
Reel/Frame 023758/0177 →
SECURITY AGREEMENT Recorded Apr 3, 2008
From: ADC TELECOMMUNICATIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 020753/0037 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 23, 2006
From: WAYMAN, MICHAEL J.
To: ADC TELECOMMUNICATIONS, INC.
Reel/Frame 017726/0658 →