IP Library Granted Patent US 7,707,625
Granted Patent B2
US 7,707,625 · App. 11/391,994 · Granted Apr 27, 2010

Credential processing device event management

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Quick Facts
Patent No.
US 7,707,625
App. No.
11/391,994
Granted
Apr 27, 2010
Kind
B2
Abstract

In a method of monitoring a group of credential processing devices, credential substrates are processed using the credential processing devices of the group. Next, event outputs are received. Each event output relates to an occurrence of a process event during the processing of the substrate by one of the devices. Finally, a relative condition score is calculated for a subject device of the group based on the event outputs corresponding to the subject device and the event outputs corresponding to the other devices in the group. The relative condition score of the subject device is a measure of a condition of the subject device relative to the conditions of the other devices in the group. Also disclosed is a system configured to perform the above-described method.

Claims (25)

1. A method of monitoring a group of credential processing devices each configured to process credential substrates, the method comprising steps of:

processing credential substrates using the credential processing devices of the group;

receiving event outputs each relating to an occurrence of an event during the processing of the substrate by one of the devices; and

calculating a relative condition score for a subject device of the group based on the event outputs corresponding to the subject device and the event outputs corresponding to the other devices in the group, wherein the relative condition score of the subject device is a measure of a condition of the subject device relative to conditions of the other devices in the group.

2. The method of claim 1 , wherein the processing step includes a process selected from the group consisting of feeding the substrate, printing an image to the substrate, laminating the substrate, encoding data to the substrate, and inverting the substrate.

3. The method of claim 1 , wherein the event outputs corresponding to each device are indicative of a problem during the processing of the credential substrate by the device.

4. The method of claim 1 , wherein the event outputs are indicative of a problem with a component of the corresponding device.

5. The method of claim 4 , wherein the component is selected from the group consisting of substrate feeding component, a printing component, a laminating component, a substrate inverting component, and a substrate encoding component.

6. The method of claim 1 , wherein the calculating step includes calculating a frequency of the event outputs for the subject device.

7. The method of claim 1 , wherein the calculating step comprises comparing a frequency of the event outputs for the subject device to frequencies of the event outputs for the other devices in the group.

8. The method of claim 1 , wherein the calculating step comprises comparing a count of the event outputs corresponding to the subject device to a count corresponding to the event outputs of the other devices in the group.

9. The method of claim 1 , wherein the calculating step comprises comparing the count of event outputs corresponding to the subject device to an average count of event outputs for the devices in the group.

10. A credential production system comprising:

a group of credential processing devices, each device configured to process a credential substrate;

one or more event analyzers configured to produce event outputs each relating to an occurrence of an event during the processing of the substrate by the devices; and

a device manager configured to calculate a relative condition score for a subject device of the group based on the event outputs corresponding to the subject device and the event outputs corresponding to the other devices in the group, wherein the relative condition score of the subject device is a measure of a condition of the subject device relative to conditions of the other devices in the group.

11. The system of claim 10 , wherein the process is selected from the group consisting of feeding the substrate, printing an image to the substrate, laminating the substrate, encoding data to the substrate, and inverting the substrate.

12. The system of claim 10 , wherein the event outputs are each indicative of an error during an operation selected from the group consisting of a substrate feeding operation, a substrate printing operation, a substrate laminating operation, a substrate encoding operation, and a substrate inverting operation.

13. The system of claim 10 , wherein the event outputs are each indicative of a parameter relating to the performance of a component of the device.

14. The system of claim 13 , wherein the component is selected from the group consisting of substrate feeding component, a printing component, a laminating component, a substrate inverting component, and a substrate encoding component.

15. The system of claim 10 , wherein the relative condition score is based on a frequency of the event outputs for the subject device.

16. The system of claim 10 , wherein the relative condition score is based on an average frequency of the event outputs of the devices in the group.

17. The system of claim 10 , wherein the relative condition score is based on a comparison of a frequency of the event outputs for the subject device to a frequency of event outputs corresponding to the other devices in the group.

18. The system of claim 10 , wherein the relative condition score is based on a comparison of a count of the event outputs for the subject device to counts of the event outputs for the other devices in the group.

19. The system of claim 10 , wherein the relative condition score is based on a comparison of a count of the event outputs for the subject device to an avenge count of the event outputs for the devices in the group.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 28, 2014
From: HID GLOBAL CORPORATION
To: ASSA ABLOY AB
Reel/Frame 032554/0875 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 14, 2010
From: FARGO ELECTRONICS, INC.
To: HID GLOBAL CORPORATION
Reel/Frame 023788/0399 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 29, 2006
From: KLINEFELTER, GARY M.
To: FARGO ELECTRONICS, INC.
Reel/Frame 017700/0543 →