Method for producing a protective assembly for protecting an electronic component from electrostatic discharge, and correspondingly configured electronic component
View Patent ↗An electronic component includes a first circuit portion having a first supply voltage terminal and a second circuit portion having a second supply voltage terminal. The electronic component includes a first external supply voltage line that supplies the first circuit portion, and a second external supply voltage line that supplies the second circuit portion. The second supply voltage terminal is connected to the second external supply voltage line, and to an electrical connection, which does not run via the first external supply voltage line, between the second external supply voltage line and the first supply voltage terminal. The first circuit portion is isolated from the second circuit portion with respect to high-frequency interference, while electrostatic discharge may propagate via the supply voltage system of the electronic component.
1. A method for producing a protective assembly for protecting an electronic component from electrostatic discharge, comprising:
providing the electronic component comprising a first circuit portion having a first supply voltage terminal, a second circuit portion having a second supply voltage terminal, a first external supply voltage line that supplies the first circuit portion, and a second external supply voltage line that supplies the second circuit portion, the second supply voltage terminal connected to the second external supply voltage line, and
providing an electrical connection, not in communication with the first external supply voltage line, between the second external supply voltage line and the first supply voltage terminal.
2. The method according to claim 1 , wherein providing the first supply voltage terminal comprises providing the first supply voltage terminal not connected to the first external supply voltage line.
3. The method according to claim 1 , wherein providing the first circuit portion comprises providing a third supply voltage terminal, which is connected to the first external supply voltage line.
4. The method according to claim 1 , wherein providing the electrical connection comprises providing at least one of a bonding wire and a metal layer.
5. The method according to claim 1 , wherein providing the electrical connection comprises providing the electrical connection comprising a higher impedance for a high-frequency interference occurring in the electronic component than an impedance of a connection of the second external supply voltage line to an outside of the electronic component.
6. The method according to claim 1 , wherein providing the electrical connection comprises designing said electrical connection such that an inductance of the electrical connection is between 5 and 15 nH.
7. The method according to claim 1 , wherein providing the electrical connection comprises providing the electrical connection as an electrical connection in a package of the electronic component.
8. An electronic component comprising:
a first circuit portion having a first supply voltage terminal,
a second circuit portion having a second supply voltage terminal,
a first external supply voltage line operable to supply the first circuit portion,
a second external supply voltage line operable to supply the second circuit portion, where
the second supply voltage terminal is connected to the second external supply voltage line, and
an electrical connection, not in communication with the first external supply voltage line, between the second external supply voltage line and the first supply voltage terminal.
9. The electronic component according to claim 8 , wherein the first supply voltage terminal is connected to the first external supply voltage line.
10. The electronic component according to claim 8 , wherein the first circuit portion comprises a third supply voltage terminal, which is connected to the first external supply voltage line.
11. The electronic component according claim 8 , wherein the electrical connection comprises at least one of a bonding wire and a metal layer.
12. The electronic component according to claim 8 , wherein the electrical connection is designed in such a way that it has a higher impedance for high-frequency interference occurring in the electronic component than an impedance of a connection of the second external supply voltage line to an outside of the electronic component.
13. The electronic component according to claim 8 , wherein an inductance of the electrical connection is between 5 and 15 nH.
14. The electronic component according to claim 8 , wherein the first supply voltage line, the second external supply voltage line and the electrical connection are disposed in a package of the electronic component.
15. The electronic component according to of claim 8 , wherein the first circuit portion and the second circuit portion comprise semiconductor circuits integrated on a chip.
16. The electronic component according to claim 8 , wherein the first circuit portion and the second circuit portion comprise semiconductor circuits produced on two separate chips.
17. The electronic component according to claim 8 , wherein the first circuit portion comprise an interference-susceptible circuit portion and the second circuit portion comprises a circuit portion potentially causing interference.
18. The electronic component according to claim 8 , wherein the first external supply voltage line and the second external supply voltage line comprise ground lines.
19. The electronic component according to claim 8 , wherein the first external supply voltage line and the second external supply voltage line are each connected to an external terminal of the electronic component.
20. The electronic component according to claim 8 , wherein the first circuit portion comprises an interference-susceptible part and a non-interference-susceptible part, and wherein the first supply voltage terminal comprises a supply voltage terminal of the non-interference-susceptible part of the first circuit portion.