High-speed differential AC coupling device
View Patent ↗The present invention includes method and apparatus for a device including two capacitors separated by a gap within one package thereby the two capacitors are coupled to each other in such a way that the impedance between them are matched with respect to the other components along a transmission path.
1. A passive microwave device adapted for use with a differential communication link, comprising:
a package having two ceramic capacitors separated by a gap, the gap width being selected to provide a differential impedance of the capacitors matching an impedance of the components of the differential communication link and said package being adapted to conform to conductive paths forming the differential communication link.
2. The device of claim 1 , wherein the differential impedance is within a range between 90 ohms and 105 ohms.
3. The device of claim 1 , wherein the differential impedance is 100 ohms.
4. The device of claim 1 , wherein the differential communication link transmits a differential signal at 10 GBits/s.
5. The device of claim 1 , wherein the differential communication link transmits at a rate greater than 2.5 GBits/s.
6. The device of claim 1 , further comprising a ground connection and an internal ground plane.
7. The device of claim 1 , wherein each capacitor has multiple layers of high-frequency ceramic materials and metal surfaces.
8. The device of claim 1 , further comprising a hybrid stackup, wherein materials for the capacitors are different from the material in the gap between the two capacitors.
9. The device of claim 1 , wherein the two capacitors are placed in parallel within the package with a gap between the two closest sides of capacitors that achieves a differential impedance within a range between 90 ohms and 105 ohms.
10. A printed circuit board (PCB) having a high-speed differential AC coupling device, comprising:
a transmitting device, for transmission of a differential signal;
a backplane, having traces in the inner layer for transmission of the differential signal;
the AC coupling device having two ceramic capacitors separated by a gap, the gap width being selected to provide a differential impedance of the capacitors matching an impedance of the components along the traces and said package being adapted to conform to conductive paths forming the traces; and
a receiving device, for receiving the differential signal.
11. The PCB of claim 10 , further comprising solder pads and vias.
12. The PCB of claim 10 , wherein the differential impedance is the same as a PCB differential impedance from the transmitting device to the receiving device.
13. The PCB of claim 10 , wherein the differential impedance is within a range between 90 ohms and 105 ohms.
14. The PCB of claim 10 , wherein the differential signal is transmitted at 10 GBits/s.
15. The PCB of claim 10 , wherein the differential signal is transmitted at a rate greater than 2.5 GBits/s.
16. The PCB of claim 10 , wherein the AC coupling device further comprises a ground connection and an internal ground plane.
17. The PCB of claim 10 , wherein the AC coupling device includes two capacitors, each capacitor having multiple layers of high-frequency ceramic materials and metal surfaces.
18. The PCB of claim 10 , wherein the AC coupling device further comprises a hybrid stackup.
19. The PCB of claim 10 , wherein the AC coupling device includes two capacitors that are placed in parallel within the device having a gap that achieves a differential impedance of between 90 ohms and 105 ohms between the two closest sides of the two capacitors.
20. A method, comprising:
connecting a high-speed AC coupler between a transmitting device and a receiving device for transmission of differential signals along a differential transmission link;
matching an impedance of the AC coupler such that the impedance is the same as the impedance of the rest of the differential transmission link; and
transmitting a high-speed differential signal from the transmitting device to the receiving device, wherein the AC coupler has two ceramic capacitors separated by a gap, the gap width being selected to provide a differential impedance of the capacitors matching an impedance of the components of the differential communication link and said AC coupler being adapted to conform to conductive paths forming the differential transmission link.