Active primary-sided circuit arrangement for a switch-mode power supply
View Patent ↗The invention under consideration refers to a circuit arrangement for a switch-mode power supply, wherein the switch-mode power supply has a primary side, which can be connected to a supply voltage, and a secondary side, which can be connected to a consumer, and wherein the circuit arrangement comprises a primary-sided switch, a control circuit for controlling the primary-sided switch and additional active primary-sided components. Furthermore, the invention under consideration also refers to a switch-mode power supply with an active primary-sided circuit arrangement of that type. In order to specify an improved circuit arrangement that overcomes the disadvantages of the known solutions and that makes it possible to assemble a switch-mode power supply in miniaturised form in a manner that is particularly simple and economical while still complying with applicable safety standards, the control circuit is formed by a first integrated semiconductor chip and the primary-sided switch and the additional components are integrated in at least one additional semiconductor chip, said semiconductor chip being separate from the control circuit and being arranged on a single circuit carrier shared with the control circuit.
1. Circuit arrangement for a switch-mode power supply, wherein the switch-mode power supply has a primary side, which can be connected to a supply voltage, and a secondary side, which can be connected to a consumer,
wherein the circuit arrangement ( 100 ) comprises a primary-sided switch ( 102 ), a control circuit ( 104 ) for controlling the primary-sided switch ( 102 ) and additional active, primary-sided components ( 106 , 108 , 110 ),
wherein said control circuit ( 104 ) is formed by a first integrated semiconductor chip and the primary-sided switch ( 102 ) and the additional components ( 106 , 108 , 110 ), are integrated in at least one additional semiconductor chip, said semiconductor chip being separate from the control circuit and arranged on a circuit carrier ( 112 ) shared with the control circuit.
2. Circuit arrangement according to claim 1 , wherein the control circuit ( 104 ), the primary-sided switch ( 102 ) and the additional primary-sided components ( 106 , 108 , 110 ) are accommodated in a shared housing ( 118 ).
3. Circuit arrangement according to claim 2 , wherein the housing ( 118 ) is executed as a wired housing.
4. Circuit arrangement according to claim 2 , wherein the housing ( 118 ) is executed as a housing that can be surface-mounted for surface-mount technologies.
5. Circuit arrangement according to claim 1 , wherein the circuit carrier is executed as a leadframe ( 112 ).
6. Circuit arrangement according to claim 1 , wherein a metallization of the circuit carrier ( 112 ) has cooling areas that are formed for removing heat.
7. Circuit arrangement according to claim 1 , wherein the additional active components comprise four rectifier diodes ( 106 ).
8. Circuit arrangement according to claim 1 , wherein the additional active components comprise a diode ( 108 ) for the auxiliary power supply.
9. Circuit arrangement according to claim 1 , wherein the additional active components comprise a snubber diode ( 110 ).
10. Circuit arrangement according to claim 1 , wherein the additional active components ( 106 , 108 , 110 ) are at least partially combined into a single semiconductor chip and are monolithically integrated.
11. Circuit arrangement according to claim 1 , wherein at least those additional components ( 106 , 108 , 110 ) that are under high voltages are executed in a silicon-on-insulator technology and the control circuit ( 104 ) is formed as a silicon semiconductor circuit.
12. Circuit arrangement according to claim 1 , wherein the circuit carrier has a ceramic substrate comprising multiple layers.
13. Switch-mode power supply having a primary side, which can be connected to a supply voltage, and a secondary side, which can be connected to a consumer,
said switch-mode power supply comprising a circuit arrangement which comprises a primary-sided switch, a control circuit for controlling the primary-sided switch and additional active, primary-sided components,
wherein said control circuit is formed by a first integrated semiconductor chip and the primary-sided switch and the additional components, are integrated in at least one additional semiconductor chip, said semiconductor chip being separate from the control circuit and arranged on a circuit carrier shared with the control circuit.