IP Library Patent Application 11394822
Patent Application
App. No. 11/394,822

Method, apparatus and system for flow distribution through a heat exchanger

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Quick Facts
Patent No.
US None
App. No.
11/394,822
Abstract

A method, apparatus and system are described for flow distribution through a heat exchanger. The system may include a chassis and an apparatus. The apparatus may include a heat exchanger, and a cold plate. In some embodiments, a pump may provide for the flow of the fluid between the heat exchanger and the cold plate. In some embodiments, the heat exchanger may include a tube to transport a first fluid, a plurality of fins coupled to the tube to facilitate transfer of thermal energy from the first fluid to the plurality of fins, and a gate coupled to the plurality of fins to direct flow of a second fluid through passages between the fins, where the gate includes a deformable laminate of a plurality of layers having different coefficients of thermal expansion, the plurality of layers being bonded to one another. Other embodiments may be described.

Claims (46)

1 . A heat exchanger comprising:

a tube to transport a first fluid;

a plurality of fins coupled to the tube to facilitate transfer of thermal energy from the first fluid to the plurality of fins; and

a gate coupled to the plurality of fins to direct flow of a second fluid through passages between the fins, wherein the gate includes a deformable laminate of a plurality of layers having different coefficients of thermal expansion, the plurality of layers being bonded to one another.

2 . The heat exchanger of claim 1 , wherein the first fluid is a liquid or a solid.

3 . The heat exchanger of claim 1 , wherein the second fluid is air.

4 . The heat exchanger of claim 1 , wherein the plurality of fins is arranged in a stack of mutually parallel plates.

5 . The heat exchanger of claim 1 , wherein the gate is deformable towards one or more sides with changes in temperature.

6 . The heat exchanger of claim 5 , wherein the gate is deformable towards a contracted state at a low temperature, wherein the flow of the second fluid through the plurality of fins is reduced.

7 . The heat exchanger of claim 5 , wherein the gate is deformable towards an expanded state at a high temperature, wherein the flow of the second fluid through the plurality of fins is increased.

8 . The heat exchanger of claim 6 , wherein the contracted state includes one of the layers having a higher coefficient of thermal expansion contracts to deform the gate toward the near side of the layer.

9 . The heat exchanger of claim 7 , wherein the expanded state includes one of the layers having a higher coefficient of thermal expansion expands to deform the gate toward the far side of the layer.

10 . An apparatus comprising:

a heat exchanger including a tube to transport a first fluid; a plurality of fins coupled to the tube to facilitate transfer of thermal energy from the first fluid to the plurality of fins; a gate coupled to the plurality of fins to direct flow of a second fluid through passages between the fins, wherein the gate includes a deformable laminate of a plurality of layers having different coefficients of thermal expansion, the plurality of layers being bonded to one another; and

a cold plate coupled to the tube and coupled to an electronic component from which thermal energy is to be transferred.

11 . The apparatus of claim 10 , further comprising:

a pump coupled to the tube, wherein the pump circulates the first fluid through the tube between the cold plate and the heat exchanger.

12 . The apparatus of claim 10 , wherein the first fluid is a liquid or a solid.

13 . The apparatus of claim 10 , wherein the second fluid is air.

14 . The apparatus of claim 10 , wherein the plurality of fins is arranged in a stack of mutually parallel plates.

15 . The apparatus of claim 10 , wherein the gate is deformable towards one or more sides with changes in temperature.

16 . The apparatus of claim 15 , wherein the gate is deformable towards a contracted state at a low temperature, wherein the flow of the second fluid through the plurality of fins is reduced.

17 . The apparatus of claim 15 , wherein the gate is deformable towards an expanded state at a high temperature, wherein the flow of the second fluid through the plurality of fins is increased.

18 . The apparatus of claim 16 , wherein the contracted state includes one of the layers having a higher coefficient of thermal expansion contracts to deform the gate toward the near side of the layer.

19 . The apparatus of claim 17 , wherein the expanded state includes one of the layers having a higher coefficient of thermal expansion expands to deform the gate toward the far side of the layer.

20 . A system comprising:

a chassis including airflow vents;

a plurality of components capable of generating heat, the components mounted within the chassis; and

an apparatus including a heat exchanger including a tube to transport a first fluid; a plurality of fins coupled to the tube to facilitate transfer of thermal energy from the first fluid to the plurality of fins; a gate coupled to the plurality of fins to direct flow of a second fluid through passages between the fins, wherein the gate includes a deformable laminate of a plurality of layers having different coefficients of thermal expansion, the plurality of layers being bonded to one another; and a cold plate coupled to the tube and coupled to an electronic component from which thermal energy is to be transferred.

21 . The system of claim 20 , further comprising:

a second apparatus including a second heat exchanger including a second tube to transport a third fluid; a second plurality of fins coupled to the second tube to facilitate transfer of thermal energy from the third fluid to the second plurality of fins; a second gate coupled to the second plurality of fins to direct flow of a fourth fluid through passages between the fins, wherein the second gate includes a deformable laminate of a second plurality of layers having different coefficients of thermal expansion, the second plurality of layers being bonded to one another; and a second cold plate coupled to the second tube and coupled to a second electronic component from which thermal energy is to be transferred.

22 . The system of claim 21 , wherein the first and third fluids are a liquid or a solid.

23 . The system of claim 21 , wherein the second and fourth fluids are air.

24 . The system of claim 20 , wherein the plurality of fins is arranged in a stack of mutually parallel plates.

25 . The system of claim 20 , wherein the gate is deformable towards one or more sides with changes in temperature.

26 . The system of claim 25 , wherein the gate is deformable towards a contracted state at a low temperature, wherein the flow of the second fluid through the plurality of fins is reduced.

27 . The system of claim 25 , wherein the gate is deformable towards an expanded state at a high temperature, wherein the flow of the second fluid through the plurality of fins is increased.

28 . The system of claim 26 , wherein the contracted state includes one of the layers having a higher coefficient of thermal expansion contracts to deform the gate toward the near side of the layer.

29 . The system of claim 27 , wherein the expanded state includes one of the layers having a higher coefficient of thermal expansion expands to deform the gate toward the far side of the layer.

30 . A method comprising:

determining a threshold temperature for a transition between a contracted state and an expanded state;

determining one or more layers based on the threshold temperature; and

configuring a gate with a plurality of layers including the one or more layers based on the threshold temperature.

31 . The method of claim 30 , further comprising:

directing flow of a fluid through the gate, wherein the flow is reduced when the gate is in the contracted state.

32 . The method of claim 31 , wherein the flow is increased when the gate is in the expanded state.

Assignments (2)
RELEASE OF SECURITY INTEREST Recorded Apr 11, 2025
From: SOLACE SIPROCAL, LLC
To: DIGITAL REEF, INC.; SILEO, LLC; SIPROCAL, INC.; GAMES CLUB ESPORTS, LLC; GAMERS CLUB META, LLC; IMAGINATION UNWIRED LLC; IMOX TECHNOLOGIES CORP
Reel/Frame 070813/0370 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 26, 2008
From: NISHI, YOSHIFUMI
To: INTEL CORPORATION
Reel/Frame 020703/0768 →