IP Library Granted Patent US 7,776,392
Granted Patent B2
US 7,776,392 · App. 11/396,990 · Granted Aug 17, 2010

Composite insulation tape with loaded HTC materials

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Quick Facts
Patent No.
US 7,776,392
App. No.
11/396,990
Granted
Aug 17, 2010
Kind
B2
Abstract

In one embodiment of the present invention as used for impregnating a composite tape ( 56 ) with HTC particles provides for permeating a fabric layer ( 51 ) of the composite tape with HTC particles and impregnating an impregnating resin into the composite tape through the fabric layer ( 51 ). At least 5% of the HTC particles permeated into the fabric layer are carried out of the fabric layer and into a mica layer ( 52 ) bound to the fabric layer by the impregnating resin. In some embodiments the impregnating resin itself contains HTC particles.

Claims (38)

1. A method for impregnating a composite tape with high thermal conductivity (HTC) particles comprising:

permeating a fabric layer of said composite tape with HTC particles; and

impregnating an impregnating resin into said composite tape through said fabric layer;

wherein said permeating comprises selectively permeating the fabric layer with a first group of the HTC particles that will be mobile in the impregnating resin during said impregnating and selectively permeating the fabric layer with a second group of the HTC particles that will remain stationary in the fabric layer during said impregnating; and

wherein, during said impregnating, at least 1% of said first group and said second group of HTC particles permeated into said fabric layer are carried out of said fabric layer and into a mica layer bound to said fabric layer by said impregnating resin.

2. The method of claim 1 , wherein the permeating of said fabric layer is performed after said fabric layer is bound to said mica layer.

3. The method of claim 2 , wherein said fabric layer has a resinous backcoating on a side opposite to the side to which said mica layer is bound, and wherein said resinous backcoating keeps said second group of HTC particles within said fabric layer.

4. The method of claim 1 , wherein the first group of HTC particles comprises particles that are 5-100 nm in length with aspect ratios of 1-10 and comprises at least 5% of a total volume of said first group and said second group of HTC particles in said composite tape, and said second group of HTC particles comprises particles that are greater than 100 nm in length.

5. The method of claim 4 , wherein said small first group of particles comprises spheroid and platelet shapes.

6. The method of claim 1 , wherein said impregnating resin comprises HTC particles.

7. The method of claim 1 , wherein an amount of said first group and said second group of HTC particles accumulates at the fabric layer/mica layer interface, and wherein a region of densely packed HTC particles is created at the fabric layer/mica interface.

8. The method of claim 1 , wherein said first group and said second group of HTC particles are dry when they are permeated into said fabric layer.

9. The method of claim 1 , wherein said first group and said second group of HTC particles are mixed with at least one of resin or solvent when they are permeated into said fabric layer.

10. The method of claim 1 , wherein said first group and said second group of HTC particles comprise at least one of oxides, nitrides, or carbides.

11. The method of claim 10 , wherein said first group and said second group of HTC particles comprise at least one of Al 2 O 3 , AIN, MgO, ZnO, BeO, BN, Si 3 N 4 , SiC or SiO 2 with mixed stoichiometric and non-stoichiometric combinations.

12. The method of claim 1 , wherein said first group and said second group of HTC particles are from 1-1000 nm in length, and wherein said HTC particles have an aspect ratio of between 3 and 100.

13. A method for impregnating a composite tape with high thermal conductivity (HTC) particles comprising:

packing a fabric layer of said composite tape with HTC particles;

sealing exposed surfaces of said fabric layer with a resin layer; and

impregnating said composite tape with an impregnating resin through the fabric layer;

wherein said resin layer is soluble in said impregnating resin;

wherein said packing comprises selectively packing the fabric layer with a first group of the HTC particles that will be mobile in the impregnating resin during said impregnating and selectively packing the fabric layer with a second group of the HTC particles that will remain stationary in the fabric layer during said impregnating; and

wherein said impregnating resin flows from said fabric layer into a mica layer bound to said fabric layer;

wherein, during said impregnating, at least 5% of said first group and said second group of HTC particles in said fabric layer are carried by said impregnating resin out of the fabric layer and into said mica layer; and

wherein approximately 10% by volume of said first group and said second group of HTC particles remain at the fabric layer/mica layer interface whereby a region is created with a higher concentration of HTC particles.

14. The method of claim 13 , wherein said first group and said second group of HTC particles comprise at least one of oxides, nitrides, or carbides.

15. The method of claim 13 , wherein said first group and said second group of HTC particles have been surface functionalized.

16. The method of claim 15 , wherein said first group of particles have been surface functionalized to limit interaction with other ones of the first group of particles.

17. The method of claim 1 , wherein said first group and said second group of HTC particles comprise 0.1-65% by volume of composite tape.

18. The method of claim 17 , wherein said first group and said second group of HTC particles comprise 1-25% by volume of composite tape.

19. A method for impregnating a mica layer within a composite tape, comprising:

joining a mica layer to at least one fabric layer;

packing said fabric layer with high thermal conductivity (HTC) particles;

sealing exposed surfaces of said fabric layer with a resin layer; and

impregnating said composite tape with an impregnating resin;

wherein said packing comprises selectively packing the fabric layer with a first group of the HTC particles that will be mobile in the impregnating resin during said impregnating and selectively packing the fabric layer with a second group of the HTC particles that will remain stationary in the fabric layer during said impregnating; and

wherein at least 5% of said first group and said second group of HTC particles in said fabric layer is carried by said impregnating resin out of said fabric layer and into said mica layer.

20. The method of claim 13 , wherein said packing a fabric layer of said composite tape with HTC particles is done via vacuum pressure impregnation.

Assignments (2)
CHANGE OF NAME Recorded Mar 31, 2009
From: SIEMENS POWER GENERATION, INC.
To: SIEMENS ENERGY, INC.
Reel/Frame 022488/0630 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 3, 2006
From: SMITH, JAMES D. B.; WOOD, JOHN W.; STEVENS, GARY; SURREY, UNIVERSITY OF
To: SIEMENS POWER GENERATION, INC.
Reel/Frame 017754/0853 →