Patterning on surface with high thermal conductivity materials
View Patent ↗The present invention provides for high thermal conductivity paper that comprises a host matrix ( 10 ), and high thermal conductivity materials ( 12 ) added to a surface of the host matrix in a specific pattern ( 12 ). The high thermal conductivity materials are comprised of one or more of nanofillers, diamond like coatings directly on the host matrix, and diamond like coatings on the nanofillers. In particular embodiments the specific pattern comprises one or more of a grid, edging, banding centering and combinations thereof and the high thermal conductivity materials cover 15-55% of the surface of the host matrix. Multiple surfaces, including sub layers may have patterning.
1. An electrically insulating tape comprising:
a mica paper layer;
a glass fiber backing layer;
a plurality of high thermal conductivity materials disposed within the mica paper layer in a specific pattern;
wherein the specific pattern comprises at least one of a grid, edging, banding, centering, or combinations thereof.
2. The electrically insulating tape of claim 1 , wherein the plurality of high thermal conductivity materials comprises at least one of nanofillers, diamond like coatings, or diamond like coatings on nanofillers.
3. The electrically insulating tape of claim 1 , wherein the plurality of high thermal conductivity materials are disposed within the mica paper layer in a specific pattern, and wherein the specific pattern comprises a staggered configuration.
4. The electrically insulating tape of claim 1 , wherein the high thermal conductivity materials have an aspect ratio in the range of from 3 to 100.