Deposition fabrication using inkjet technology

1. A method of fabricating a circuit lead, the method comprising:

depositing a slurry upon a substrate in a predetermined pattern, the substrate including a plurality of substantially uniformly patterned micropores operative to drain a fluid component of the slurry from the surface of the substrate, while maintaining conductive particles of the slurry on a surface of the substrate; and

drying the conductive particles to secure the conductive particles upon a surface of the substrate and provide a circuit lead.

2. The method of claim 1 , wherein the plurality of micropores are generally vertically oriented.

3. The method of claim 1 , wherein the slurry deposition is carried out using an inkjet printer.

4. The method of claim 3 , wherein the slurry deposition includes repositioning at least one of the substrate and a nozzle of the inkjet printer to deposit the conductive particles upon the substrate in the predetermined pattern.

5. The method of claim 1 , wherein the act of drying the substrate includes subjecting the substrate to an elevated temperature ambient.

6. The method of claim 1 , wherein the act of drying the substrate includes applying a vacuum to the substrate.

7. A method of fabricating a circuit lead, the method comprising:

depositing a slurry upon a filtration medium in a predetermined arrangement, the filtration medium including a plurality of micropores in a substantially uniform arrangement operative to filter solid conductive components of the slurry from a fluid component of the slurry;

drying the solid conductive components to secure a substantial portion of the solid conductive components upon a surface of the filtration medium and provide a circuit lead; and

mounting a microchip in electrical communication with the circuit lead.

8. The method of claim 7 , wherein the plurality of micropores are generally vertically oriented.

9. The method of claim 7 , wherein the slurry deposition is carried out using an inkjet printer.

10. The method of claim 9 , wherein the slurry deposition includes repositioning at least one of the filtration medium and a nozzle of the inkjet printer to deposit the solid conductive components upon the filtration medium in the predetermined arrangement.

11. The method of claim 7 , wherein the act of drying the filtration medium includes subjecting the filtration medium to an elevated temperature ambient.

12. The method of claim 7 , wherein the act of drying the filtration medium includes applying a vacuum to the filtration medium.

13. An electronic circuit comprising:

a substrate including a plurality of micropores that are substantially uniformly patterned;

a microchip; and

a circuit lead in electrical communication with the microchip and contacting the substrate, the circuit lead comprising conductive particles deposited upon the substrate by ejecting a slurry from an inkjet printer.

14. The electronic circuit of claim 13 wherein at least one of a median width of the micropores and a median length of the micropores is less than at least one of a median width of the conductive particles and a median length of the conductive particles.

15. The electronic circuit of claim 13 , wherein a summation of a volume of each micropore of the substrate is greater than the volume of a carrier fluid of the slurry.

16. The electronic circuit of claim 13 , wherein the micropores extend substantially through an entire thickness of the substrate.

17. The electronic circuit of claim 13 , wherein the substrate comprises a coating applied to a base substrate, wherein the base substrate includes at least one of paper, a polymer, a composite, and a semiconductor.

18. An electronic circuit comprising:

a substrate including a plurality of micropores in a substantially uniform arrangement; and

a circuit lead formed on the substrate for electrical communication with a microchip, the circuit lead comprising conductive particles deposited upon the substrate by ejecting a slurry from an inkjet printer.

19. The electronic circuit of claim 18 wherein at least one of a median width of the micropores and a median depth of the micropores is less than at least one of a median width of the conductive particles and a median length of the conductive particles.

20. The electronic circuit of claim 18 , wherein a summation of an available volume of the micropores of the substrate is greater than a volume of a carrier fluid, comprising the slurry, deposited on the substrate.

21. The electronic circuit of claim 18 , wherein the micropores extend substantially through an entire thickness of the substrate.

22. The electronic circuit of claim 18 , wherein the substrate comprises a coating applied to a base substrate, wherein the base substrate includes at least one of paper, a polymer, a composite, and a semiconductor.

23. A method of accurately and precisely depositing conductive particles of a conductive ink from an inkjet printer, the method comprising:

orienting a substrate with respect to an inkjet printer, the substrate including a plurality of generally aligned interstices adapted to filter a conductive ink;

depositing the conductive ink upon the substrate in a predetermine pattern using the inkjet printer, where the conductive ink comprises conductive particles and a carrier fluid; and

drying the conductive particles to mount the conductive particles upon a surface of the substrate and provide a conductive lead.

24. The method of claim 23 , wherein the act of drying the substrate includes subjecting the substrate to an elevated temperature ambient.

25. The method of claim 23 , wherein the act of drying the substrate includes applying a vacuum to the substrate.

26. The method of claim 23 , wherein the conductive ink deposited on the substrate is chemically compatible with the substrate.

27. The method of claim 23 , wherein the conductive ink comprises a slurry of solid conductive particles and the carrier fluid.

28. The method of claim 23 , wherein the act of depositing the conductive ink includes depositing the conductive ink using more than one nozzle of a printhead associated with the inkjet printer.